Tech Center 4100 • Art Units: 2812 4100
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18816236 | SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERN AND CONDUCTIVE PAD PATTERN | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18746308 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18425196 | SEMICONDUCTOR DEVICES | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18594454 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | Non-Final OA | KABUSHIKI KAISHA TOSHIBA |
| 18780788 | METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT | Non-Final OA | Commissariat à l'Énergie Atomique et aux Énergies Alternatives |
| 18389834 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Magnolia White Corporation |
| 18121264 | VIA STRUCTURES IN BONDED GLASS SUBSTRATES | Non-Final OA | Intel Corporation |
| 18076130 | LINED CONDUCTIVE STRUCTURES FOR TRENCH CONTACT | Non-Final OA | Intel Corporation |
| 18784638 | NOVEL MIM STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18630206 | Tapered Superjunction with Ultrathin P-Type Material Layer | Non-Final OA | Applied Materials, Inc. |
| 18590102 | METHODS OF FORMING LOW RESISTIVITY FILMS USING Microwave treatment | Non-Final OA | Applied Materials, Inc. |
| 18631791 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18706010 | 3D FLASH MEMORY AND MANUFACTURING METHOD THEREOF | Non-Final OA | IUCF-HYU (Industry-University Cooperation Foundation Hanyang University) |
| 18223560 | MEMORY CELL STRUCTURE | Final Rejection | Invention And Collaboration Laboratory Pte. Ltd. |
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