Tech Center 4100 • Art Units: 2812 4100
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18367183 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18396447 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18594454 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | Non-Final OA | KABUSHIKI KAISHA TOSHIBA |
| 18389834 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Magnolia White Corporation |
| 18121264 | VIA STRUCTURES IN BONDED GLASS SUBSTRATES | Non-Final OA | Intel Corporation |
| 18090816 | INTEGRATED CIRCUIT STRUCTURES HAVING BIT-COST SCALING WITH RELAXED TRANSISTOR AREA | Final Rejection | Intel Corporation |
| 18076130 | LINED CONDUCTIVE STRUCTURES FOR TRENCH CONTACT | Non-Final OA | Intel Corporation |
| 18399692 | LIGHT EMITTING ELEMENT ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF | Non-Final OA | AUO Corporation |
| 18540971 | INTEGRATED CIRCUIT DEVICE INCLUDING DIES ARRANGED FACE-TO-FACE | Non-Final OA | Microchip Technology Incorporated |
| 18628008 | INDUCTOR-CAPACITOR CIRCUIT STRUCTURE AT HYBRID BONDING INTERFACE | Non-Final OA | International Business Machines Corporation |
| 18466215 | TAPERED INNER SPACER | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18631791 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18545648 | Electroless Deposition Process for Semiconductor Devices | Non-Final OA | Wolfspeed, Inc. |
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