Tech Center 2800 • Art Units: 2812
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18425196 | SEMICONDUCTOR DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18169721 | SEMICONDUCTOR DEVICE HAVING LOW-BANDGAP INTERFACIAL LAYER IN THE CAPACITOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18391416 | PUMP-OUT RESISTANT COLDPLATE | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18147525 | NANOSHEET DEVICE WITH NITRIDE ISOLATION STRUCTURES | Non-Final OA | International Business Machines Corporation |
| 18076130 | LINED CONDUCTIVE STRUCTURES FOR TRENCH CONTACT | Final Rejection | Intel Corporation |
| 18468533 | INTEGRATED DEVICES COUPLED TO INTERPOSER COMPRISING POROUS PORTION | Non-Final OA | QUALCOMM Incorporated |
| 18456231 | SEMICONDUCTOR STRUCTURE, FABRICATION METHOD THEREOF, AND MEMORY SYSTEM | Final Rejection | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 17994393 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Winbond Electronics Corp. |
| 18305375 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18395683 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18167138 | SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SEMICONDUCTOR STRUCTURE | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18373173 | ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICE | Final Rejection | AMAZING MICROELECTRONIC CORP. |
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