Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2689 2898
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18736748 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18589834 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18525724 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18463488 | SEMICONDUCTOR DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18331296 | SEMICONDUCTOR DEVICES | Final Rejection | Samsung Electronics Co., Ltd. |
| 18296329 | SEMICONDUCTOR DEVICE WITH DEEP SILICIDE FILM | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18169905 | INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION NETWORK STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18067773 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18255833 | IMAGING ELEMENT AND IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17597699 | LED ARRAYS WITH DBR | Non-Final OA | Snap Inc. |
| 18709398 | DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS | Non-Final OA | LG DISPLAY CO., LTD. |
| 18738230 | DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18189581 | NITRIDE EPITAXIAL STRUCTURE AND SEMICONDUCTOR DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18405376 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18310425 | PACKAGE SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE OF THE PACKAGE SUBSTRATE WITH A RESIN | Non-Final OA | QUALCOMM Incorporated |
| 18054211 | PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS | Non-Final OA | Intel Corporation |
| 17895112 | SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION | Final Rejection | Intel Corporation |
| 17821009 | QUASI-MONOLITHIC DIE ARCHITECTURES | Non-Final OA | Intel Corporation |
| 18498118 | DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Japan Display Inc. |
| 18369755 | SEMICONDUCTOR WAFER FABRICATION WITH POLYIMIDE TO GRAPHENE CONVERSION | Final Rejection | NXP USA, Inc. |
| 17963937 | Process Control Monitor Device Structure for Buried TSV Formation in IC Wafers | Non-Final OA | Raytheon Company |
| 17967116 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18467412 | METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL HOT SPOT REGION OF AN IC STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18453162 | POWER TAP CONNECTIONS FOR NON-CMOS CIRCUITS UTILIZING CFET TECHNOLOGY | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18170030 | IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17896093 | TRANSISTOR, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF TRANSISTOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17750417 | METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV) | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18076417 | ELECTRONIC DEVICE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18164142 | ESD PROTECTION CIRCUIT, ESD PROTECTION METHOD, SEMICONDUCTOR MEMORY AND ESD PROTECTION SYSTEM | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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