Prosecution Insights
Last updated: October 01, 2026

Examiner: RODRIGUEZ VILLANU, SANDRA MILENA

Tech Center 2800 • Art Units: 2689 2898

This examiner grants 88% of resolved cases

Analysis

Sandra Milena Rodriguez Villanu is an examiner in Tech Center 2800, Art Unit 2689. She has 116 resolved cases with a high allowance rate of 87.9 percent. This rate indicates a very favorable environment for applicants, with the vast majority of applications reaching a resolution resulting in a patent grant. Practitioners should feel confident in the 87.9 percent allowance rate when navigating the examination process under this examiner.

The interview lift is 12.1 percent, which suggests that interviews provide a modest but measurable benefit in increasing the likelihood of allowance. While the base allowance rate is already high, the 12.1 percent lift indicates that direct communication can still help resolve any remaining issues. For applicants in Tech Center 2800, engaging in an interview is a useful strategy to ensure a smooth path to a grant.

The median days to allowance is 1042. This duration represents the typical time from filing to the issuance of a patent for the 116 resolved cases. The 1042 days provide a clear benchmark for the expected length of the prosecution cycle in Art Unit 2689. Applicants can use this timeline to manage their expectations and plan their intellectual property activities accordingly.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

87.9%
Allow Rate
+19.9% vs TC avg
162
Total Applications
+12.1%
Interview Lift
1042
Avg Prosecution Days
Based on 116 resolved cases, 2023–2026

Rejection Statute Breakdown

0.5%
§101 Eligibility
22.7%
§102 Novelty
49.8%
§103 Obviousness
25.4%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18736748 INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18589834 IMAGE SENSOR Non-Final OA Samsung Electronics Co., Ltd.
18457504 SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18331296 SEMICONDUCTOR DEVICES Non-Final OA Samsung Electronics Co., Ltd.
18296329 SEMICONDUCTOR DEVICE WITH DEEP SILICIDE FILM Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18169905 INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION NETWORK STRUCTURE AND METHODS OF FORMING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18067773 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18405376 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME Non-Final OA Samsung Display Co., LTD.
18399614 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME Non-Final OA Samsung Display Co., LTD.
18369755 SEMICONDUCTOR WAFER FABRICATION WITH POLYIMIDE TO GRAPHENE CONVERSION Non-Final OA NXP USA, Inc.
18709398 DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS Non-Final OA LG DISPLAY CO., LTD.
18189581 NITRIDE EPITAXIAL STRUCTURE AND SEMICONDUCTOR DEVICE Non-Final OA HUAWEI TECHNOLOGIES CO., LTD.
18738230 DISPLAY DEVICE Non-Final OA Magnolia White Corporation
17895112 SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION Final Rejection Intel Corporation
17821009 QUASI-MONOLITHIC DIE ARCHITECTURES Non-Final OA Intel Corporation
18498118 DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME Non-Final OA Japan Display Inc.
18255833 IMAGING ELEMENT AND IMAGING DEVICE Non-Final OA SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18486526 ELECTRICAL FUSE STRUCTURE Non-Final OA International Business Machines Corporation
17746887 MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES Non-Final OA Texas Instruments Incorporated
17967116 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE Final Rejection SK hynix Inc.
18788253 THIN FILM TRANSISTOR BASED LIGHT SENSOR Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18775598 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18467979 INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18453162 POWER TAP CONNECTIONS FOR NON-CMOS CIRCUITS UTILIZING CFET TECHNOLOGY Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18170030 IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
17750417 METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV) Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18418849 TUNGSTEN-BASED ADDITIVE FOR THROUGH-SUBSTRATE ETCHING Non-Final OA Tokyo Electron Limited
18471441 DOCUMENT STRUCTURE FORMATION Final Rejection Infineon Technologies AG
18076417 ELECTRONIC DEVICE Non-Final OA Advanced Semiconductor Engineering, Inc.

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