Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2689 2898
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18457504 | SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18455943 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18331296 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18169905 | INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION NETWORK STRUCTURE AND METHODS OF FORMING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18067773 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18255833 | IMAGING ELEMENT AND IMAGING DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18471441 | DOCUMENT STRUCTURE FORMATION | Non-Final OA | Infineon Technologies AG |
| 17750570 | Display Apparatus and Manufacturing Method of Display Apparatus | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 17895112 | SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION | Final Rejection | Intel Corporation |
| 17821009 | QUASI-MONOLITHIC DIE ARCHITECTURES | Final Rejection | Intel Corporation |
| 18310425 | PACKAGE SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE OF THE PACKAGE SUBSTRATE WITH A RESIN | Final Rejection | QUALCOMM Incorporated |
| 18486649 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18467412 | METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL HOT SPOT REGION OF AN IC STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18453162 | POWER TAP CONNECTIONS FOR NON-CMOS CIRCUITS UTILIZING CFET TECHNOLOGY | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18318698 | MICROELECTROMECHANICAL DEVICE AND METHOD FOR MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18170030 | IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17750417 | METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV) | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17967116 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18247013 | SEMICONDUCTOR MULTILAYER STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | Non-Final OA | Nippon Telegraph and Telephone Corporation |
| 18467779 | METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD | Final Rejection | NEXPERIA B.V. |
| 18369755 | SEMICONDUCTOR WAFER FABRICATION WITH POLYIMIDE TO GRAPHENE CONVERSION | Non-Final OA | NXP USA, Inc. |
| 18109430 | METHOD FOR PREPARING SEMICONDUCTOR LAYER | Final Rejection | NATIONAL TAIWAN UNIVERSITY |
| 18368664 | SEMICONDUCTOR STRUCTURE HAVING PROTECTIVE LAYER ON SIDEWALL OF CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREOF | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18076417 | ELECTRONIC DEVICE | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 18350612 | Semiconductor Structure and Method for Manufacturing the Same | Final Rejection | Enkris Semiconductor (Wuxi), Ltd. |
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