Tech Center 2800 • Art Units: 2689 2898
This examiner grants 88% of resolved cases
Sandra Milena Rodriguez Villanu is an examiner in Tech Center 2800, Art Unit 2689. She has 116 resolved cases with a high allowance rate of 87.9 percent. This rate indicates a very favorable environment for applicants, with the vast majority of applications reaching a resolution resulting in a patent grant. Practitioners should feel confident in the 87.9 percent allowance rate when navigating the examination process under this examiner.
The interview lift is 12.1 percent, which suggests that interviews provide a modest but measurable benefit in increasing the likelihood of allowance. While the base allowance rate is already high, the 12.1 percent lift indicates that direct communication can still help resolve any remaining issues. For applicants in Tech Center 2800, engaging in an interview is a useful strategy to ensure a smooth path to a grant.
The median days to allowance is 1042. This duration represents the typical time from filing to the issuance of a patent for the 116 resolved cases. The 1042 days provide a clear benchmark for the expected length of the prosecution cycle in Art Unit 2689. Applicants can use this timeline to manage their expectations and plan their intellectual property activities accordingly.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18736748 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18589834 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18457504 | SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18331296 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18296329 | SEMICONDUCTOR DEVICE WITH DEEP SILICIDE FILM | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18169905 | INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION NETWORK STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18067773 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18405376 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18399614 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18369755 | SEMICONDUCTOR WAFER FABRICATION WITH POLYIMIDE TO GRAPHENE CONVERSION | Non-Final OA | NXP USA, Inc. |
| 18709398 | DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS | Non-Final OA | LG DISPLAY CO., LTD. |
| 18189581 | NITRIDE EPITAXIAL STRUCTURE AND SEMICONDUCTOR DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18738230 | DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 17895112 | SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION | Final Rejection | Intel Corporation |
| 17821009 | QUASI-MONOLITHIC DIE ARCHITECTURES | Non-Final OA | Intel Corporation |
| 18498118 | DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Japan Display Inc. |
| 18255833 | IMAGING ELEMENT AND IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18486526 | ELECTRICAL FUSE STRUCTURE | Non-Final OA | International Business Machines Corporation |
| 17746887 | MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES | Non-Final OA | Texas Instruments Incorporated |
| 17967116 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18788253 | THIN FILM TRANSISTOR BASED LIGHT SENSOR | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18775598 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18467979 | INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18453162 | POWER TAP CONNECTIONS FOR NON-CMOS CIRCUITS UTILIZING CFET TECHNOLOGY | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18170030 | IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17750417 | METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV) | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18418849 | TUNGSTEN-BASED ADDITIVE FOR THROUGH-SUBSTRATE ETCHING | Non-Final OA | Tokyo Electron Limited |
| 18471441 | DOCUMENT STRUCTURE FORMATION | Final Rejection | Infineon Technologies AG |
| 18076417 | ELECTRONIC DEVICE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
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