Tech Center 3600 • Art Units: 2814 2892 3645
This examiner grants 86% of resolved cases
Sammantha Katelyn Salaz is a patent examiner in Tech Center 3600, assigned to Art Unit 2814. She has 29 resolved cases. The data shows an allowance rate of 89.7% for these 29 cases. This 89.7% figure represents the frequency of grants among all resolved cases for this examiner.
The interview lift for Sammantha Katelyn Salaz is 17.6%. This 17.6% lift indicates the change in the probability of allowance when an interview is conducted during prosecution. Practitioners can use this lift to evaluate the potential impact of oral advocacy on their specific applications in Art Unit 2814.
The median days to allowance is 1193. This 1193 day period measures the time from the filing of an application to the issuance of a patent. This median provides a data point for estimating the duration of the examination process for matters assigned to this examiner.
Practitioners should consider the 89.7% allowance rate and the 17.6% interview lift when developing their response strategies. These figures, along with the 1193 day median, offer a statistical overview of the examiner's history in Tech Center 3600.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18634937 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18211786 | SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18676909 | DISPLAY SUBSTRATE AND ELECTRONIC APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18691021 | LIGHT-EMITTING SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18422048 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 17856493 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18250991 | DISPLAY MODULE HAVING POL-LESS DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 17889962 | PACKAGE ARCHITECTURES WITH GLASS CORES FOR THICKNESS REDUCTION AND 3D INTEGRATION | Final Rejection | Intel Corporation |
| 17856869 | INDEPENDENT GATE STACK FOR SINGLE NANOWIRE STANDARD CELL TRANSISTORS | Non-Final OA | Intel Corporation |
| 17850623 | STACKED SINGLE CRYSTAL TRANSITION-METAL DICHALCOGENIDE USING SEEDED GROWTH | Non-Final OA | Intel Corporation |
| 17694266 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DUAL METAL GATES AND GATE DIELECTRICS WITH A SINGLE POLARITY DIPOLE LAYER | Non-Final OA | Intel Corporation |
| 18493765 | SEMICONDUCTOR DEVICE WITH COUPLER STRUCTURE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18337867 | PROTECTION DIODE FOR STACKED FIELD EFFECT TRANSISTOR | Non-Final OA | International Business Machines Corporation |
| 17935992 | STRUCTURE TO FORM AND INTEGRATE HIGH VOLTAGE FINFET I/O DEVICE WITH NANOSHEET LOGIC DEVICE | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17932677 | DUAL DIELECTRIC STRESSORS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18560325 | ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE | Non-Final OA | Tesla, Inc. |
| 18486071 | OPTICAL SENSOR PACKAGE WITH ENCAPSULANT IS BETWEEN AND SEPARATES SUBSTRATES AND MULTIPLE ASSEMBLIES | Non-Final OA | STMicroelectronics PTE LTD |
| 18438875 | Threshold Voltage Tuning Using Aluminum Layer as Dipole Material | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18460594 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18338715 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18314968 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18150362 | PIXEL SENSOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17836781 | SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18351099 | Volume-Less Dipole Incorporation into CFET Having Common Gate | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18350552 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING ETCH STOP STRUCTURES LOCATED BETWEEN TIERS | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18224050 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy