Prosecution Insights
Last updated: August 18, 2026

Examiner: SALAZ, SAMMANTHA KATELYN

Tech Center 2800 • Art Units: 2814 2892

This examiner grants 89% of resolved cases

Performance Statistics

88.9%
Allow Rate
+20.9% vs TC avg
58
Total Applications
+17.6%
Interview Lift
1172
Avg Prosecution Days
Based on 27 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
30.0%
§102 Novelty
51.4%
§103 Obviousness
15.2%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18250991 DISPLAY MODULE HAVING POL-LESS DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE Non-Final OA WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
18691021 LIGHT-EMITTING SUBSTRATE AND DISPLAY DEVICE Non-Final OA BOE Technology Group Co., Ltd.
17856493 DISPLAY DEVICE Final Rejection Samsung Display Co., LTD.
17856869 INDEPENDENT GATE STACK FOR SINGLE NANOWIRE STANDARD CELL TRANSISTORS Final Rejection Intel Corporation
17850623 STACKED SINGLE CRYSTAL TRANSITION-METAL DICHALCOGENIDE USING SEEDED GROWTH Non-Final OA Intel Corporation
17694266 FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DUAL METAL GATES AND GATE DIELECTRICS WITH A SINGLE POLARITY DIPOLE LAYER Non-Final OA Intel Corporation
18560325 ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE Non-Final OA Tesla, Inc.
18147396 BARRIER LAYERS FOR ANISOTROPIC MAGNETO-RESISTIVE SENSORS Final Rejection Texas Instruments Incorporated
18438875 Threshold Voltage Tuning Using Aluminum Layer as Dipole Material Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18338715 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18150362 PIXEL SENSOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
17836781 SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18351099 Volume-Less Dipole Incorporation into CFET Having Common Gate Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18458630 3D COMB NANOSHEET AND PI/2 ROTATED NANOSHEET Non-Final OA Tokyo Electron Limited
18350552 THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING ETCH STOP STRUCTURES LOCATED BETWEEN TIERS Non-Final OA SANDISK TECHNOLOGIES LLC
17964463 MICRO-LED WITH REFLECTANCE REDISTRIBUTION Final Rejection Lumileds LLC
18072840 Replacement Metal Gate Integration for Gate All Around Transistors Non-Final OA International Business Machines Corporation
17935992 STRUCTURE TO FORM AND INTEGRATE HIGH VOLTAGE FINFET I/O DEVICE WITH NANOSHEET LOGIC DEVICE Final Rejection INTERNATIONAL BUSINESS MACHINES CORPORATION
17932677 DUAL DIELECTRIC STRESSORS Non-Final OA INTERNATIONAL BUSINESS MACHINES CORPORATION
18224050 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Final Rejection UNITED MICROELECTRONICS CORP.
18164623 SEMICONDUCTOR STRUCTURE FOR 3D MEMORY AND MANUFACTURING METHOD THEREOF Final Rejection MACRONIX International Co., Ltd.

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