Tech Center 2800 • Art Units: 2814 2892
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18250991 | DISPLAY MODULE HAVING POL-LESS DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18691021 | LIGHT-EMITTING SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 17856493 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 17856869 | INDEPENDENT GATE STACK FOR SINGLE NANOWIRE STANDARD CELL TRANSISTORS | Final Rejection | Intel Corporation |
| 17850623 | STACKED SINGLE CRYSTAL TRANSITION-METAL DICHALCOGENIDE USING SEEDED GROWTH | Non-Final OA | Intel Corporation |
| 17694266 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DUAL METAL GATES AND GATE DIELECTRICS WITH A SINGLE POLARITY DIPOLE LAYER | Non-Final OA | Intel Corporation |
| 18560325 | ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE | Non-Final OA | Tesla, Inc. |
| 18147396 | BARRIER LAYERS FOR ANISOTROPIC MAGNETO-RESISTIVE SENSORS | Final Rejection | Texas Instruments Incorporated |
| 18438875 | Threshold Voltage Tuning Using Aluminum Layer as Dipole Material | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18338715 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18150362 | PIXEL SENSOR ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17836781 | SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18351099 | Volume-Less Dipole Incorporation into CFET Having Common Gate | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18458630 | 3D COMB NANOSHEET AND PI/2 ROTATED NANOSHEET | Non-Final OA | Tokyo Electron Limited |
| 18350552 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING ETCH STOP STRUCTURES LOCATED BETWEEN TIERS | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 17964463 | MICRO-LED WITH REFLECTANCE REDISTRIBUTION | Final Rejection | Lumileds LLC |
| 18072840 | Replacement Metal Gate Integration for Gate All Around Transistors | Non-Final OA | International Business Machines Corporation |
| 17935992 | STRUCTURE TO FORM AND INTEGRATE HIGH VOLTAGE FINFET I/O DEVICE WITH NANOSHEET LOGIC DEVICE | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17932677 | DUAL DIELECTRIC STRESSORS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18224050 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18164623 | SEMICONDUCTOR STRUCTURE FOR 3D MEMORY AND MANUFACTURING METHOD THEREOF | Final Rejection | MACRONIX International Co., Ltd. |
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