Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2895 2897
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18638757 | SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18388266 | SEMICONDUCTOR DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18234987 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18687589 | PHOTODETECTION DEVICE, IMAGING DEVICE, AND DISTANCE MEASUREMENT APPARATUS | Non-Final OA | Sony Semiconductor Solutions Corporation |
| 18580126 | DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18495602 | STACKED WAFER AND DICING METHOD OF STACKED WAFER | Final Rejection | CANON KABUSHIKI KAISHA |
| 18785925 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18425756 | LIGHT EMITTING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18398197 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 17959126 | DISPLAY WITH TWO BARRIER LAYERS IN THE ENCAPSULATION LAYER | Non-Final OA | Samsung Display Co., Ltd. |
| 18641584 | LIGHTING APPARATUS | Non-Final OA | LEEDARSON LIGHTING CO.,LTD. |
| 18514503 | ENABLING MM-WAVE AESAS USING ADVANCED PACKAGING | Final Rejection | Rockwell Collins, Inc. |
| 18570678 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18584199 | FERROELECTRIC SEMICONDUCTOR DEVICE INCLUDING MEMORY CELL HAVING A THREE-DIMENSIONAL STRUCTURE | Non-Final OA | SK hynix Inc. |
| 17941274 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18776479 | DEEP TRENCH ISOLATION WITH FIELD OXIDE | Final Rejection | Texas Instruments Incorporated |
| 18507801 | SUBSTRATE ALPHA PARTICLE SHIELD FOR SEMICONDUCTOR PACKAGES | Non-Final OA | Micron Technology, Inc. |
| 18542136 | APPARATUS, SYSTEM, AND METHOD FOR DISTRIBUTING DIE-SPECIFIC SIGNALS ACROSS DIE STACKS | Non-Final OA | Advanced Micro Devices, Inc. |
| 17563749 | VERTICALLY AND HORIZONTALLY STACKED DEVICE STRUCTURES | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18674289 | MAGNETORESISTIVE STACK/STRUCTURE AND METHODS THEREFOR | Final Rejection | Everspin Technologies, Inc. |
| 18752747 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | United Semiconductor (Xiamen) Co., Ltd. |
| 17752228 | METHOD OF MAKING HETEROEPITAXIAL STRUCTURES AND DEVICE FORMED BY THE METHOD | Non-Final OA | UNM RAINFOREST INNOVATIONS |
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