Tech Center 2800 • Art Units: 2895 2897
This examiner grants 80% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18229296 | SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18514927 | LIGHT EMITTING DISPLAY APPARATUS INCLUDING SUBPIXEL WITH TWO LIGHT EMISSION PORTIONS | Non-Final OA | LG Display Co., Ltd. |
| 17914957 | DISPLAY DEVICES AND DISPLAY SUBSTRATES | Final Rejection | BOE Technology Group Co., Ltd. |
| 18570678 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18620692 | ORGANIC LIGHT EMITTING DIODE DISPLAY WITH SHAPED EDGES OF ORGANIC EMISSION LAYER | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18353681 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18127801 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 17960219 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17942479 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18495602 | STACKED WAFER AND DICING METHOD OF STACKED WAFER | Non-Final OA | CANON KABUSHIKI KAISHA |
| 17821877 | DISPLAY PANEL AND DISPLAY APPARATUS | Final Rejection | WUHAN TIANMA MICROELECTRONICS CO., LTD. |
| 18476816 | ACTIVE PRIME REGION WITH CONDUCTIVE BYPASS | Non-Final OA | International Business Machines Corporation |
| 17563749 | VERTICALLY AND HORIZONTALLY STACKED DEVICE STRUCTURES | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18348343 | NOVEL STORAGE GATE FINFET FOR NON-VOLATILE MEMORY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18661794 | OLED WITH A FLATTENING LAYER BETWEEN TWO BARRIER LAYERS | Final Rejection | Magnolia White Corporation |
| 17521760 | INTEGRATED CIRCUIT INTERCONNECT STRUCTURES INCLUDING COPPER-FREE VIAS | Final Rejection | Intel Corporation |
| 18573300 | METHOD FOR MANUFACTURING A SILICON CARBIDE SEMICONDUCTOR COMPONENT | Non-Final OA | Robert Bosch GmbH |
| 18507801 | SUBSTRATE ALPHA PARTICLE SHIELD FOR SEMICONDUCTOR PACKAGES | Non-Final OA | Micron Technology, Inc. |
| 18334010 | SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE DEVICE MANUFACTURING METHOD | Non-Final OA | Kioxia Corporation |
| 18455411 | MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 17941274 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18674289 | MAGNETORESISTIVE STACK/STRUCTURE AND METHODS THEREFOR | Non-Final OA | Everspin Technologies, Inc. |
| 18090915 | MEMORY DEVICES AND METHODS FOR FORMING THE SAME | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 17892873 | SEMICONDUCTOR DEVICE WITH A SHORTING STI IN A LOW-VOLTAGE REGION THAN IN A HIGH-VOLTAGE REGION | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 17752228 | METHOD OF MAKING HETEROEPITAXIAL STRUCTURES AND DEVICE FORMED BY THE METHOD | Non-Final OA | UNM RAINFOREST INNOVATIONS |
| 18542136 | APPARATUS, SYSTEM, AND METHOD FOR DISTRIBUTING DIE-SPECIFIC SIGNALS ACROSS DIE STACKS | Non-Final OA | Advanced Micro Devices, Inc. |
| 18479316 | IMAGE SENSOR CHARGE DIRECTION STRUCTURES AND METHODS | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18514503 | ENABLING MM-WAVE AESAS USING ADVANCED PACKAGING | Non-Final OA | Rockwell Collins, Inc. |
| 18479429 | INFRARED DETECTOR UNIT DEVICE AND PREPARATION METHOD THEREFOR | Non-Final OA | Shanghai Institute of Technical Physics, CAS |
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