Tech Center 2800 • Art Units: 2811 2822 2896 2898
This examiner grants 56% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17855346 | SHIELDING INTEGRATED INDUCTORS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18659125 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18329853 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18327219 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 17635292 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18665569 | SEMICONDUCTOR DEVICE INCLUDING AN IGBT WITH REDUCED VARIATION IN THRESHOLD VOLTAGE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18320995 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18320997 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18446917 | METHOD AND STRUCTURE FOR DIODES WITH BACKSIDE CONTACTS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17575619 | FISHBONE STRUCTURE ENHANCING SPACING WITH ADJACENT CONDUCTIVE LINE IN POWER NETWORK | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 16542960 | PITCH-DIVIDED INTERCONNECTS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | Non-Final OA | Intel Corporation |
| 18190254 | PIXEL ARRANGEMENT STRUCTURE, DISPLAY PANEL AND MASK ASSEMBLY | Final Rejection | Hefei Visionox Technology Co., Ltd. |
| 18530113 | SEMICONDUCTOR DEVICES COMPRISING TRANSISTORS HAVING INCREASED THRESHOLD VOLTAGE AND RELATED METHODS AND SYSTEMS | Final Rejection | Micron Technology, Inc. |
| 18322996 | SECURITY CODE INCLUDING METAMATERIALS | Non-Final OA | KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY |
| 17762642 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18316410 | PLUG FOR MEMS CAVITY | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 17215555 | Chip on Package Structure and Method | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17539050 | PASSIVATION COVERED LIGHT EMITTING UNIT STACK | Non-Final OA | Seoul Viosys Co., Ltd. |
| 17475273 | PASSIVATION COVERED LIGHT EMITTING UNIT STACK | Final Rejection | Seoul Viosys Co., Ltd. |
| 18128218 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 17897725 | TEST KEY TRANSISTOR FOR DEEP TRENCH ISOLATION DEPTH DETECTION | Final Rejection | CISTA SYSTEM CORP. |
| 16297374 | LIGHT EMITTING DIODE PACKAGE HAVING SERIES CONNECTED LEDS | Final Rejection | Bridgelux, Inc. |
| 18025321 | MULTI-WAVELENGTH LED STRUCTURES AND MANUFACTURING METHODS THEREOF | Final Rejection | ENKRIS SEMICONDUCTOR, INC. |
| 18260162 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | DYNAX SEMICONDUCTOR, INC. |
| 18235894 | PACKAGING STRUCTURE HAVING ORGANIC INTERPOSER LAYER AND METHOD FOR MANUFACTURING SAME | Non-Final OA | SJ Semiconductor(Jiangyin) Corporation |
| 17680308 | FLIP CHIP SEMICONDUCTOR PACKAGE WITH A LEADFRAME TO ENHANCE PACKAGE MECHANICAL STABILITY AND HEAT DISSIPATION | Final Rejection | UTAC Headquarters Pte. Ltd. |
| 18299321 | FACE-UP LIGHT-EMITTING DEVICE AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | XIAMEN SAN’AN OPTOELECTRONICS CO., LTD. |
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