Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2818 4100
This examiner grants 91% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18654758 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18653734 | CHIP BONDING FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING THE CHIP BONDING FILM | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18486546 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17615175 | LIGHT-EMITTING SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18687577 | LIGHT-EMITTING DEVICE, DISPLAY PANEL, DISPLAY APPARATUS AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18324071 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18604289 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18405570 | HYBRID SUBSTRATE WITH EMBEDDED COMPONENT | Final Rejection | QUALCOMM Incorporated |
| 18673326 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SEIKO EPSON CORPORATION |
| 18664556 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18324231 | STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18761895 | SEMICONDUCTOR DEVICE HAVING MOS TRANSISTOR FOR EFFICIENT STRESS TRANSFER | Non-Final OA | MICRON TECHNOLOGY, INC. |
| 18633920 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18628494 | HEAT DISSIPATION FOR HOT SPOTS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18463062 | HEAT SINK FOR STACKED MULTI-GATE DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18359922 | SHARED SOURCE/DRAIN CONTACT FOR STACKED TRANSISTORS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18334817 | STACKED TRANSISTOR STRUCTURES WITH HYBRID GATE PITCH | Non-Final OA | International Business Machines Corporation |
| 18505187 | CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THROUGH-DIE VIAS | Final Rejection | ATI TECHNOLOGIES ULC |
| 18677857 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | United Microelectronics Corp. |
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