Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2818 4100
This examiner grants 91% of resolved cases
NGUYEN, DAO H operates within Tech Center 4100 and Art Unit 2818, where they have managed 1274 resolved cases. This volume of cases indicates the examiner's level of experience in handling patent applications within this technology sector. The examiner maintains an allowance rate of 91.4 percent, which provides a baseline for the probability of securing a patent grant. This percentage suggests the likelihood that an application reaching a final disposition will be allowed. Practitioners can use this figure to gauge the general receptivity of the examiner to patentable subject matter.
The data shows an interview lift of 5.7 percent, indicating how direct communication correlates with the probability of success. The interview lift of 5.7 percent is lower than the 91.4 percent allowance rate, which helps determine the relative impact of verbal engagement. The median days to allowance stands at 712, providing a timeline expectation for the prosecution process from filing to grant. This duration reflects the typical pendency for successful applications. Understanding these metrics allows for a more informed strategy when navigating the examination process with this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18800139 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18753484 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18486546 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18673326 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SEIKO EPSON CORPORATION |
| 18687577 | LIGHT-EMITTING DEVICE, DISPLAY PANEL, DISPLAY APPARATUS AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18604289 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18383404 | ORGANIC LIGHT EMITTING DISPLAY APPARATUS | Final Rejection | LG Display Co., Ltd. |
| 17615175 | LIGHT-EMITTING SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18324071 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18645598 | LANDING PAD STRUCTURES FOR CONTACTS IN LIGHT-EMITTING DIODE CHIPS AND RELATED METHODS | Non-Final OA | CreeLED, Inc. |
| 18405570 | HYBRID SUBSTRATE WITH EMBEDDED COMPONENT | Final Rejection | QUALCOMM Incorporated |
| 18459664 | INTEGRATED CIRCUIT DEVICES WITH BACKSIDE BIT LINES AND WORD LINES | Non-Final OA | Intel Corporation |
| 18664556 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18359922 | SHARED SOURCE/DRAIN CONTACT FOR STACKED TRANSISTORS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18334817 | STACKED TRANSISTOR STRUCTURES WITH HYBRID GATE PITCH | Non-Final OA | International Business Machines Corporation |
| 18750465 | SEMICONDUCTOR DEVICE WITH HIGH VOLTAGE TERMINATION | Non-Final OA | Infineon Technologies Austria AG |
| 18324231 | STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18779109 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18770177 | SEMICONDUCTOR DEVICE WITH BACKSIDE CONTACT AND METHODS OF FORMING SUCH | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18474606 | THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18463062 | HEAT SINK FOR STACKED MULTI-GATE DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18768952 | Semiconductor Device Structure With Uniform Threshold Voltage Distribution and Method of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18433234 | TRENCH AND CHANNEL GAP FILL TUNING FOR FLOWABLE CHEMICAL VAPOR DEPOSITION (FCVD) FILMS | Non-Final OA | Applied Materials, Inc. |
| 18179858 | LATERAL SILICON BRIDGE FOR STACKED DIES | Final Rejection | Advanced Micro Devices, Inc. |
| 18655343 | DISPLAY PANEL AND FABRICATION METHOD THEREOF | Non-Final OA | AUO Corporation |
| 18505187 | CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THROUGH-DIE VIAS | Final Rejection | ATI TECHNOLOGIES ULC |
| 18386456 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOW-K DRAIN-SELECT-LEVEL ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18677857 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | United Microelectronics Corp. |
| 18834258 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| 18350459 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | POWERTECH TECHNOLOGY INC. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy