Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2817 2823 2842 2843 2892 2899
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18505035 | SEMICONDUCTOR DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18383065 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18119705 | SEMICONDUCTOR PACKAGE INCLUDING A LOWER SUBSTRATE AND AN UPPER SUBSTRATE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17876847 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18524404 | Display Apparatus | Non-Final OA | LG Display Co., Ltd. |
| 18524264 | MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT | Non-Final OA | Texas Instruments Incorporated |
| 18524402 | HIGH VOLTAGE ISOLATION DEVICE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18070985 | DYNAMIC CONTROL OF FRONT-END STAGE TRANSCONDUCTANCE IN BIPOLAR AMPLIFIERS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18480733 | HIGH-FREQUENCY AMPLIFICATION APPARATUS AND MAGNETIC RESONANCE IMAGING APPARATUS | Non-Final OA | Canon Kabushiki Kaisha |
| 18552867 | SIDE-FILLING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, METHOD FOR REMOVING SIDE-FILLING MEMBER, AND METHOD FOR FABRICATING THE SEMICONDUCTOR DEVICE | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18470561 | Wireless Circuitry with Tunable Matching Network | Non-Final OA | Apple Inc. |
| 18474348 | Semiconductor Device And Electronic Apparatus | Non-Final OA | SEIKO EPSON CORPORATION |
| 18537782 | REDRESSING A CHIP SITE ON A MULTI-CHIP LAMINATE PACKAGE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18191950 | HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY | Non-Final OA | International Business Machines Corporation |
| 18311898 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Innolux Corporation |
| 18475804 | Semiconductor Integrated Circuit | Non-Final OA | ROHM CO., LTD. |
| 18476773 | DOHERTY AMPLIFIER CIRCUIT | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18452467 | WIDEBAND SWITCHING GAIN ENHANCED TUNABLE LNA ARCHITECTURE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18679091 | A STRUCTURE COMPRISING A RECONSTRUCTED PACKAGE SUBSTRATE INCLUDING AN ENCAPSULATED SUBSTRATE BLOCK | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18356462 | TIA WITH TUNABLE GAIN | Non-Final OA | Nokia Solutions and Networks Oy |
| 18369583 | MEASUREMENT SYSTEM, RELATED INTEGRATED CIRCUIT AND METHOD | Non-Final OA | STMicroelectronics S.r.l. |
| 18536135 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | Guangzhou China Star Optoelectronics Semiconductor Display Technology Co., LTd. |
| 17754991 | ARRAY SUBSTRATE, METHOD FOR MANUFACTURING ARRAY SUBSTRATE, AND DISPLAY PANEL | Non-Final OA | GUANGZHOU CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18358394 | BIASING CIRCUIT FOR RADIO FREQUENCY AMPLIFIER | Non-Final OA | MACOM Technology Solutions Holdings, Inc. |
| 18505135 | RADIO FREQUENCY DEVICE | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18482849 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 18395347 | DIRECT BONDING OF SEMICONDUCTOR ELEMENTS | Non-Final OA | Adeia Semiconductor Bonding Technologies Inc. |
| 18241850 | METHOD, DEVICE AND APPARATUS FOR BIASING A POWER AMPLIFIER OPERATIVE OVER WIDE SUPPLY RANGE | Non-Final OA | AXIRO SEMICONDUCTOR INC. |
| 18052416 | SEMICONDUCTOR PACKAGE INCLUDING FIDUCIAL MARK | Non-Final OA | SAMSUNGELECTRONICSCO.,LTD. |
| 17941020 | SOLDER ALLOY, SOLDER BONDING MATERIAL, SOLDER PASTE, AND SEMICONDUCTOR PACKAGE | Non-Final OA | TAMURA CORPORATION |
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