Tech Center 2800 • Art Units: 2817 2823 2842 2843 2892 2899
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18512640 | SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18505035 | SEMICONDUCTOR DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18383065 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18235547 | IMAGE SENSOR INCLUDING PATTERNED ANTIREFLECTION LAYER AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18119705 | SEMICONDUCTOR PACKAGE INCLUDING A LOWER SUBSTRATE AND AN UPPER SUBSTRATE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17977100 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17876847 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18524404 | Display Apparatus | Non-Final OA | LG Display Co., Ltd. |
| 18524402 | HIGH VOLTAGE ISOLATION DEVICE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18524264 | MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT | Non-Final OA | Texas Instruments Incorporated |
| 18156449 | INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT | Non-Final OA | Texas Instruments Incorporated |
| 18070985 | DYNAMIC CONTROL OF FRONT-END STAGE TRANSCONDUCTANCE IN BIPOLAR AMPLIFIERS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18552867 | SIDE-FILLING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, METHOD FOR REMOVING SIDE-FILLING MEMBER, AND METHOD FOR FABRICATING THE SEMICONDUCTOR DEVICE | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18474348 | Semiconductor Device And Electronic Apparatus | Non-Final OA | SEIKO EPSON CORPORATION |
| 18470561 | Wireless Circuitry with Tunable Matching Network | Non-Final OA | Apple Inc. |
| 18537782 | REDRESSING A CHIP SITE ON A MULTI-CHIP LAMINATE PACKAGE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18330429 | VOLTAGE-MODE FILTERS WITH OUTPUT IMPEDANCE NEUTRALIZATION | Non-Final OA | International Business Machines Corporation |
| 18429708 | METHOD OF MANUFACTURING AN INTERCONNECT STRUCTURE WITH A METAL CAP | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18311898 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Innolux Corporation |
| 17833580 | EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT | Final Rejection | Intel Corporation |
| 18480733 | HIGH-FREQUENCY AMPLIFICATION APPARATUS AND MAGNETIC RESONANCE IMAGING APPARATUS | Non-Final OA | CANON MEDICAL SYSTEMS CORPORATION |
| 18462594 | VARIABLE RESISTOR CIRCUIT, RESISTOR VOLTAGE DIVIDER CIRCUIT, DIFFERENTIAL AMPLIFIER, AND MOTOR DRIVER | Non-Final OA | ROHM CO., LTD. |
| 18298425 | CIRCUIT WITH A PSEUDO CLASS-AB STRUCTURE | Non-Final OA | MEDIATEK INC. |
| 18476773 | DOHERTY AMPLIFIER CIRCUIT | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18452467 | WIDEBAND SWITCHING GAIN ENHANCED TUNABLE LNA ARCHITECTURE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18356565 | POWER AMPLIFIER CIRCUIT | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18251186 | FREQUENCY COMPENSATION OF AMPLIFIERS | Non-Final OA | Analog Devices, Inc. |
| 18240651 | RADIO FREQUENCY AMPLIFIERS WITH CAPACITANCE NEUTRALIZATION | Non-Final OA | Skyworks Solutions, Inc. |
| 18143168 | SYSTEMS AND METHODS FOR FRONT-END MODULE FILTERING | Final Rejection | SKYWORKS SOLUTIONS, INC. |
| 18679091 | A STRUCTURE COMPRISING A RECONSTRUCTED PACKAGE SUBSTRATE INCLUDING AN ENCAPSULATED SUBSTRATE BLOCK | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
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