Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 77% of resolved cases
Jiyoung Oh works in Art Unit 2818 within Tech Center 2800. With 44 resolved cases, the examiner has an allowance rate of 77.3 percent. The median days to allowance is 1273, indicating the timeline for granted applications. The 44 resolved cases provide the basis for these statistics and offer a view of the examiner's performance in this art unit.
The interview lift of 21.5 percent is a factor for strategy. This figure suggests that interviews are effective in this art unit, potentially resolving technical disagreements that contribute to the 1273 day median. Applicants can use the 21.5 percent lift to improve their chances of success beyond the 77.3 percent baseline allowance rate. These metrics are essential for managing prosecution expectations with this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17799076 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS AND METHOD OF MANUFACTURING SAME | Non-Final OA | LG ELECTRONICS INC. |
| 18534997 | CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR STRUCTURE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18138192 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18193758 | SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18156049 | SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18712703 | CHIP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 17968371 | DISPLAY DEVICE HAVING METAL LAYER WITH PROTRUDING PARTS AND RECESSED PARTS | Non-Final OA | Samsung Display Co., LTD. |
| 18176697 | IMAGE DISPLAY DEVICE MANUFACTURING METHOD AND IMAGE DISPLAY DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18759892 | SEMICONDUCTOR LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE | Non-Final OA | STANLEY ELECTRIC CO., LTD. |
| 18113161 | DISPLAY DEVICE | Final Rejection | Magnolia White Corporation |
| 17855639 | CONTACT ARCHITECTURE FOR 2D STACKED NANORIBBON TRANSISTOR | Non-Final OA | Intel Corporation |
| 17308853 | METAL OXIDE THIN FILM TRANSISTORS WITH MULTI-COMPOSITION GATE DIELECTRIC | Final Rejection | Intel Corporation |
| 18508706 | POWER SEMICONDUCTOR DEVICE | Final Rejection | HYUNDAI MOBIS CO., LTD. |
| 18809015 | BARRIER LAYERS FOR WORD LINE CONTACTS IN A THREE-DIMENSIONAL NAND MEMORY AND FABRICATION METHODS THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18399558 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF, MEMORY AND MEMORY SYSTEM | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 18810032 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18580785 | SILICON CARBIDE SEMICONDUCTOR DEVICE | Final Rejection | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 17993579 | FOCAL PLANE ARRAY HAVING AN INDIUM ARSENIDE ABSORBER LAYER | Non-Final OA | CORNING INCORPORATED |
| 18508541 | REDUCED GATE EDGE CAPACITANCE | Final Rejection | International Business Machines Corporation |
| 17957194 | HYBRID INSERTED DIELECRIC GATE-ALL-AROUND DEVICE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18745962 | MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING VERTICALLY SPACED TRANSISTORS AND STORAGE DEVICES, AND RELATED ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 18788538 | PHASE CHANGE RANDOM ACCESS MEMORY (PCRAM) DEVICE WITH INCREASED PACKING DENSITY AND METHOD OF MAKING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18398437 | CIRCUIT CELLS HAVING CONDUCTION PATH BETWEEN FRONTSIDE POWER RAIL AND BACKSIDE POWER RAIL | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18510011 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18304350 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17819482 | POWER VIAS FOR BACKSIDE POWER DISTRIBUTION NETWORK | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17817249 | SEMICONDUCTOR DEVICE WITH POLYGONAL PROFILES FROM THE TOP VIEW AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 17858971 | SEMICONDUCTOR PACKAGE WITH INTEGRATED CIRCUIT CHIP COUPLERS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18775995 | SEMICONDUCTOR DEVICE WITH DOPED REGION DIELECTRIC LAYER | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18506641 | DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
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