Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 74% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18534997 | CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR STRUCTURE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18138192 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18193758 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17962783 | THIN FILM TRANSISTOR, FABRICATING METHOD THEREOF AND DISPLAY DEVICE COMPRISING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18194126 | POST-LASER DICING WAFER-LEVEL TESTING | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18356436 | DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18247789 | BACKLIGHT UNIT, DISPLAY DEVICE COMPRISING SAME, AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Final Rejection | LG ELECTRONICS INC. |
| 18076396 | DISPLAY APPARATUS HAVING FIRST FIXING ELEMENT ADJACENT TO PAD GROUP | Non-Final OA | AUO Corporation |
| 17992935 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | AUO Corporation |
| 17855639 | CONTACT ARCHITECTURE FOR 2D STACKED NANORIBBON TRANSISTOR | Non-Final OA | Intel Corporation |
| 17554004 | INDUCTORS AND TRANSFORMERS FORMED BY BURIED POWER RAILS | Final Rejection | Intel Corporation |
| 17308853 | METAL OXIDE THIN FILM TRANSISTORS WITH MULTI-COMPOSITION GATE DIELECTRIC | Non-Final OA | Intel Corporation |
| 18353732 | Stacked Multi-Gate Device With Reduced Contact Resistance And Methods For Forming The Same | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18319915 | METHOD TO REDUCE PARASITIC RESISTANCE FOR CFET DEVICES THROUGH SINGLE DAMASCENE PROCESSING OF VIAS | Non-Final OA | Tokyo Electron Limited |
| 17816782 | Trimming Through Etching in Wafer to Wafer Bonding | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17815088 | Semiconductor Package and Method | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18156459 | SEMICONDUCTOR STRUCTURE WITH VERTICAL TRANSISTOR AND FORMING METHOD THEREFOR | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18484304 | ELECTRICAL MODULE AND METHOD OF MANUFACTURING AN ELECTRICAL MODULE | Non-Final OA | Rolls-Royce Deutschland Ltd & Co KG |
| 18065918 | Method for Bonding Dies to a Carrier Substrate | Final Rejection | IMEC VZW |
| 18248212 | LOW ROUGHNESS THIN-FILM TRANSISTORS | Non-Final OA | Amorphyx, Incorporated |
| 17806497 | Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LED Chip | Non-Final OA | XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD. |
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