Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 76% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17799076 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS AND METHOD OF MANUFACTURING SAME | Non-Final OA | LG ELECTRONICS INC. |
| 18138192 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18193758 | SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18156049 | SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18306348 | METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE | Final Rejection | NICHIA CORPORATION |
| 18759892 | SEMICONDUCTOR LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE | Non-Final OA | STANLEY ELECTRIC CO., LTD. |
| 18056438 | GERMANIUM PHOTODIODE WITH REDUCED DARK CURRENT COMPRISING A PERIPHERAL INTERMEDIATE PORTION BASED ON SiGe/Ge | Final Rejection | Commissariat à l'énergie atomique et aux énergies alternatives |
| 18113161 | DISPLAY DEVICE | Final Rejection | Magnolia White Corporation |
| 18172218 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 17968371 | DISPLAY DEVICE HAVING METAL LAYER WITH PROTRUDING PARTS AND RECESSED PARTS | Non-Final OA | Samsung Display Co., LTD. |
| 17554004 | INDUCTORS AND TRANSFORMERS FORMED BY BURIED POWER RAILS | Final Rejection | Intel Corporation |
| 18397729 | MULTI-DIE TRANSFORMER POWER MODULES | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18194126 | POST-LASER DICING WAFER-LEVEL TESTING | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18745962 | MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING VERTICALLY SPACED TRANSISTORS AND STORAGE DEVICES, AND RELATED ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 17993579 | FOCAL PLANE ARRAY HAVING AN INDIUM ARSENIDE ABSORBER LAYER | Non-Final OA | CORNING INCORPORATED |
| 18398437 | CIRCUIT CELLS HAVING CONDUCTION PATH BETWEEN FRONTSIDE POWER RAIL AND BACKSIDE POWER RAIL | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18510011 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18304350 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17819482 | POWER VIAS FOR BACKSIDE POWER DISTRIBUTION NETWORK | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18775995 | SEMICONDUCTOR DEVICE WITH DOPED REGION DIELECTRIC LAYER | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18506641 | DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17816782 | Trimming Through Etching in Wafer to Wafer Bonding | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17845356 | DOPED TANTALUM-CONTAINING BARRIER FILMS | Final Rejection | Applied Materials, Inc. |
| 17957194 | HYBRID INSERTED DIELECRIC GATE-ALL-AROUND DEVICE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18065918 | Method for Bonding Dies to a Carrier Substrate | Non-Final OA | IMEC VZW |
| 18151621 | Alignment Mark Design for Wafer-Level Testing and Method Forming the Same | Non-Final OA | Taiwan Semiconductor Mamufacturing Co., Ltd. |
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