Tech Center 2800 • Art Units: 2812
This examiner grants 74% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18407064 | DISPLAY MODULE INCLUDING SELF-LUMINESCENCE ELEMENTS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18478978 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co .,LTD |
| 18208459 | SEMICONDUCTOR DEVICE, ELECTRONIC SYSTEM INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18397305 | ORGANIC LIGHT EMITTING DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18526582 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND POWER CONVERSION APPARATUS | Non-Final OA | Mitsubishi Electric Corporation |
| 18467911 | FIELD EFFECT TRANSISTOR DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18396771 | BIMETALLIC FUSE ELEMENT BETWEEN METAL LEVELS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18397217 | INTEGRATED CIRCUIT DEVICE USING OXIDE SEMICONDUCTOR WITH OXYGEN VACANCY STABILIZING MATERIAL | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18518413 | GATE STRUCTURE, FIN FIELD-EFFECT TRANSISTOR, AND METHOD OF MANUFACTURING FIN-FIELD EFFECT TRANSISTOR | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18513644 | SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18452737 | THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE CONTACT LAYER HAVING HORIZONTALLY AND VERTICALLY EXTENDING PORTIONS AND METHODS OF FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 17891735 | THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHIP COMPOSITE DEVICES | Non-Final OA | Intel Corporation |
| 17854799 | ONE-DIMENSIONAL OVERLAY MARKS | Non-Final OA | Intel Corporation |
| 18237259 | SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS | Non-Final OA | Micron Technology, Inc. |
| 18458804 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18105019 | SEMICONDUCTOR WAFER HAVING CONTACT PADS CONFIGURED TO ACT AS PROBE PADS | Final Rejection | Skyworks Solutions, Inc. |
| 18596923 | HIGHLY EFFICIENT MICRODEVICES | Non-Final OA | VueReal Inc. |
| 17781972 | CREATING STAGING IN BACKPLANE FOR MICRO DEVICE INTEGRATION | Non-Final OA | VueReal Inc. |
| 16535866 | HIGHLY EFFICIENT MICRODEVICES | Final Rejection | VueReal Inc. |
| 18379304 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18583049 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | Hubei Yangtze Industrial Innovation Center Of Advanced Display Co., Ltd. |
| 18357379 | SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT | Final Rejection | Sandisk Technologies, Inc. |
| 18324362 | METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18685147 | Non-Volatile Resistive Random-Access Memory and a Manufacturing Method Thereof | Non-Final OA | University of South Africa |
| 18396035 | SEMICONDUCTOR DEVICE | Non-Final OA | POWER MASTER SEMICONDUCTOR CO., LTD. |
| 18392121 | MICRO LIGHT EMITTING DIODE CHIP AND DISPLAY DEVICE | Non-Final OA | Xiamen Extremely PQ Display Technology Co., Ltd. |
| 18261015 | THREE-DIMENSIONAL FLASH MEMORY FOR IMPROVING CONTACT RESISTANCE OF IGZO CHANNEL LAYER | Final Rejection | IUCF-HYU (Industry University Cooperation Foundation Hanyang University) |
| 18279181 | CRYSTALLOGRAPHIC- AND OXYNITRIDE-BASED SURFACE | Non-Final OA | Tuan Anh Pham |
| 18140692 | Optoelectronic Semiconductor Structure | Final Rejection | SENSORTEK TECHNOLOGY CORP. |
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