Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 74% of resolved cases
Evren Seven, based in Tech Center 2800 and Art Unit 2812, has managed 750 resolved cases. The allowance rate is 74.5%, and the median days to allowance is 831. These figures indicate a relatively efficient and successful prosecution environment compared to other units in the same tech center.
The interview lift is 8.6%, which provides a modest but helpful boost to the already high 74.5% allowance rate. For the 750 cases processed, the 831-day median suggests that applicants can expect a relatively quick resolution. The data points to a consistent and favorable experience for those in Art Unit 2812. The 8.6% lift from interviews is a useful secondary strategy for cases that encounter initial resistance during the 831-day median prosecution period.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18802083 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18599910 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18402195 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., LTD. |
| 18599965 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18467911 | FIELD EFFECT TRANSISTOR DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18667899 | PACKAGE COMPRISING A PASSIVE DEVICE WITH A FRONT SIDE PROTECTION LAYER | Non-Final OA | QUALCOMM Incorporated |
| 18438419 | STACKED DIE STRUCTURE | Final Rejection | QUALCOMM Incorporated |
| 18425447 | INTEGRATED CIRCUIT (IC) PACKAGE WITH DIE INTERCONNECTS TERMINATING AT MULTIPLE METALLIZATION LAYERS IN A SUBSTRATE TO REDUCE SPACING REQUIREMENTS BETWEEN DIE INTERCONNECTS | Non-Final OA | QUALCOMM Incorporated |
| 17781972 | CREATING STAGING IN BACKPLANE FOR MICRO DEVICE INTEGRATION | Non-Final OA | VueReal Inc. |
| 16535866 | HIGHLY EFFICIENT MICRODEVICES | Final Rejection | VueReal Inc. |
| 18175591 | METAL GATE FABRICATION FOR NANORIBBON-BASED TRANSISTORS | Final Rejection | Intel Corporation |
| 17891735 | THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHIP COMPOSITE DEVICES | Non-Final OA | Intel Corporation |
| 18435091 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Final Rejection | Kioxia Corporation |
| 18625366 | NORMALLY-ON GALLIUM NITRIDE BASED TRANSISTOR WITH P-TYPE GATE | Non-Final OA | Texas Instruments Incorporated |
| 18237259 | SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS | Final Rejection | Micron Technology, Inc. |
| 18757531 | PACKAGE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18674894 | APPARATUS INCLUDING COOLING STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18425306 | TRENCH CAPACITOR STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18513644 | SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18379304 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18647275 | Mass-transferable microLEDs with high wafer utilization | Final Rejection | Lumileds LLC |
| 18357379 | SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT | Non-Final OA | Sandisk Technologies, Inc. |
| 18752633 | APPARATUS AND METHOD FOR CURVED-SURFACE IMAGE SENSOR | Non-Final OA | OmniVision Technologies, Inc. |
| 18575609 | OPTOELECTRONIC DEVICE AND MANUFACTURING METHOD | Final Rejection | ALEDIA |
| 18679369 | MONOLITHIC ARRAY CHIP | Non-Final OA | EPISTAR CORPORATION |
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