Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 74% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18599910 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18467911 | FIELD EFFECT TRANSISTOR DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18402195 | DISPLAY APPARATUS | Final Rejection | Samsung Display Co., LTD. |
| 17781972 | CREATING STAGING IN BACKPLANE FOR MICRO DEVICE INTEGRATION | Final Rejection | VueReal Inc. |
| 16535866 | HIGHLY EFFICIENT MICRODEVICES | Non-Final OA | VueReal Inc. |
| 18438419 | STACKED DIE STRUCTURE | Non-Final OA | QUALCOMM Incorporated |
| 18425447 | INTEGRATED CIRCUIT (IC) PACKAGE WITH DIE INTERCONNECTS TERMINATING AT MULTIPLE METALLIZATION LAYERS IN A SUBSTRATE TO REDUCE SPACING REQUIREMENTS BETWEEN DIE INTERCONNECTS | Final Rejection | QUALCOMM Incorporated |
| 18175591 | METAL GATE FABRICATION FOR NANORIBBON-BASED TRANSISTORS | Final Rejection | Intel Corporation |
| 17891735 | THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHIP COMPOSITE DEVICES | Non-Final OA | Intel Corporation |
| 18404538 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18237259 | SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-DIE CONNECTIONS | Final Rejection | Micron Technology, Inc. |
| 18425306 | TRENCH CAPACITOR STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18513644 | SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18404785 | FIELD EFFECT TRANSISTOR WITH RECRYSTALLIZED SOURCE/DRAINS AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18379304 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18435091 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Final Rejection | Kioxia Corporation |
| 18357379 | SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT | Non-Final OA | Sandisk Technologies, Inc. |
| 18169998 | INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
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