Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 78% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18659091 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18738674 | Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18533587 | ORGANIC LIGHT-EMITTING DIODE DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18449988 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 17940194 | EPITAXIAL REGIONS EXTENDING BETWEEN INNER GATE SPACERS | Final Rejection | Intel Corporation |
| 18588629 | THIN FILM CAPACITOR | Non-Final OA | TDK Corporation |
| 17815500 | HIGH-PERFORMANCE HYBRID BONDED INTERCONNECT SYSTEMS | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18548433 | WAFER ALIGNMENT STRUCTURE | Non-Final OA | Tesla, Inc. |
| 18321433 | THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF | Non-Final OA | Electronics and Telecommunications Research Institute |
| 18360486 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18355999 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURES | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18221985 | TRANSISTORS WITH IMPROVED THERMAL STABILITY | Non-Final OA | Taiwan Semiconductor Manufacturing Company LTD |
| 18209655 | INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18100714 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18118017 | HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18261898 | METHOD FOR MANUFACTURING SUBSTRATE WITH CHIPS, AND SUBSTRATE PROCESSING DEVICE | Non-Final OA | Tokyo Electron Limited |
| 18342821 | NANOSHEET HEIGHT CONTROL WITH DENSE OXIDE SHALLOW TRENCH ISOLATION | Final Rejection | International Business Machines Corporation |
| 18338383 | FORK SHEET DEVICE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18335691 | FUNNELED SOURCE/DRAIN INTERFACIAL REGION | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18066671 | STRUCTURE AND METHOD TO FORM VIA TO BACKSIDE POWER RAIL WITHOUT SHORTING TO GATE TIP | Non-Final OA | International Business Machines Corporation |
| 17457444 | TOP VIA WITH PROTECTIVE LINER | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18645928 | LIGHT EMITTING MODULE AND DISPLAY DEVICE HAVING THE SAME | Non-Final OA | SEOUL VIOSYS CO., LTD. |
| 17040506 | A METHOD FOR MANUFACTURING A WAFER HAVING CRACK-STOPPING THROUGH-SILICON-VIAS, A WAFER HAVING CRACK-STOPPING THROUGH-SILICON-VIAS, AND A SEMICONDUCTOR DEVICE | Non-Final OA | ChangXin Memory Technologies, Inc. |
| 18157079 | SEMICONDUCTOR STRUCTURE, PACKAGING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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