Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 75% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18364521 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18225777 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18533587 | ORGANIC LIGHT-EMITTING DIODE DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 17856383 | Display Device and Manufacturing Method Thereof | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18342821 | NANOSHEET HEIGHT CONTROL WITH DENSE OXIDE SHALLOW TRENCH ISOLATION | Non-Final OA | International Business Machines Corporation |
| 18338383 | FORK SHEET DEVICE | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18335691 | FUNNELED SOURCE/DRAIN INTERFACIAL REGION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18118017 | HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES | Final Rejection | Applied Materials, Inc. |
| 17889402 | TRANSISTOR HAVING A LOW-RESISTANCE LIGHT IRRADIATION REGION | Final Rejection | Magnolia White Corporation |
| 17849207 | MICROELECTRONIC DIE WITH TWO DIMENSIONAL (2D) COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICES IN AN INTERCONNECT STACK THEREOF | Non-Final OA | Intel Corporation |
| 18321433 | THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF | Non-Final OA | Electronics and Telecommunications Research Institute |
| 17889384 | DOPED DIELECTRIC MATERIAL | Non-Final OA | Micron Technology, Inc. |
| 18449988 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18355999 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18209655 | INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18100714 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17857938 | SEMICONDUCTOR MEMORY DEVICE HAVING MULTIPLE VARIABLE RESISTANCE LAYERS AND MANUFACTURING METHOD THEREOF | Final Rejection | SK hynix Inc. |
| 18344296 | TRANSISTORS WITH DIELECTRIC SPACERS AND METHODS OF FABRICATION THEREOF | Non-Final OA | NXP USA, Inc. |
| 18157079 | SEMICONDUCTOR STRUCTURE, PACKAGING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18332968 | PILLAR-SHAPED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Unisantis Electronics Singapore Pte. Ltd. |
| 18083319 | LED STRUCTURE HAVING ASYMMETRIC FACE, METHOD OF MANUFACTURING DIRECT-CURRENT-DRIVABLE LED ELECTRODE ASSEMBLY USING THE SAME, AND DIRECT-CURRENT-DRIVABLE LED ELECTRODE ASSEMBLY MANUFACTURED THEREBY | Final Rejection | Kookmin University Industry Academy Cooperation Foundation |
| 18067404 | HEIGHT ADAPTABLE MULTILAYER SPACER | Final Rejection | Heraeus Deutschland GmbH & Co. KG |
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