Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2818 4100
This examiner grants 75% of resolved cases
Kenneth Mark Sipling has resolved 12 cases in Art Unit 2818. The 75.0% allowance rate is high, suggesting a favorable environment for applicants in Tech Center 4100. This rate indicates that the examiner is generally open to granting patents, though the sample size is relatively small.
The median days to allowance is 1283, which is a typical timeline for reaching a grant. An interview lift pct of 16.7% suggests that interviews are a useful tactic for resolving issues and moving cases toward an allowance. This lift indicates that the examiner is responsive to direct communication and that such engagement can be a productive way to address any concerns. Practitioners should consider an interview as a helpful tool for clarifying the examiner's position and securing a positive outcome. The data points to a generally accessible prosecution environment where direct dialogue can provide a meaningful benefit to the applicant.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18823171 | FAN-OUT LEVEL SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18659091 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18364521 | SEMICONDUCTOR DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18499136 | LIGHT EMITTING ELEMENT, MANUFACTURING METHOD OF LIGHT EMITTING ELEMENT, AND DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18449988 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18738674 | Display Device | Non-Final OA | LG Display Co., Ltd. |
| 17940194 | EPITAXIAL REGIONS EXTENDING BETWEEN INNER GATE SPACERS | Final Rejection | Intel Corporation |
| 17849207 | MICROELECTRONIC DIE WITH TWO DIMENSIONAL (2D) COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICES IN AN INTERCONNECT STACK THEREOF | Final Rejection | Intel Corporation |
| 18342821 | NANOSHEET HEIGHT CONTROL WITH DENSE OXIDE SHALLOW TRENCH ISOLATION | Non-Final OA | International Business Machines Corporation |
| 18338383 | FORK SHEET DEVICE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18335691 | FUNNELED SOURCE/DRAIN INTERFACIAL REGION | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18355999 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR NANOSTRUCTURES | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18209655 | INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18327082 | SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18118017 | HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18588629 | THIN FILM CAPACITOR | Non-Final OA | TDK Corporation |
| 17870662 | INPUT/OUTPUT DEVICES THAT ARE COMPATIBLE WITH GATE-ALL-AROUND TECHNOLOGY | Final Rejection | Synopsys, Inc. |
| 17040506 | A METHOD FOR MANUFACTURING A WAFER HAVING CRACK-STOPPING THROUGH-SILICON-VIAS, A WAFER HAVING CRACK-STOPPING THROUGH-SILICON-VIAS, AND A SEMICONDUCTOR DEVICE | Non-Final OA | ChangXin Memory Technologies, Inc. |
| 18157079 | SEMICONDUCTOR STRUCTURE, PACKAGING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18604368 | Passive Stereoscopic Led Display Modules Having Optically Isolated Light Emitters | Non-Final OA | Liminal Space, Inc. |
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