Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2821 2893 2894
This examiner grants 71% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17784455 | DISPLAY DEVICE AND VIDEO WALL DISPLAY SYSTEM INCLUDING SAME | Final Rejection | SAMSUNG DISPLAY CO., LTD. |
| 17685305 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17423321 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18074551 | ACTIVE MATRIX SUBSTRATE AND METHOD FOR MANUFACTURING SAME | Final Rejection | Sharp Display Technology Corporation |
| 18187995 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | InnoLux Corporation |
| 17699031 | MICROELECTRONIC STRUCTURE INCLUDING CONDUCTIVE POLYMER IN TRENCHES OF A CORE SUBSTRATE, AND METHOD OF MAKING SAME | Final Rejection | Intel Corporation |
| 18401082 | EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 17730765 | MACROCHIP WITH INTERCONNECT STACK FOR POWER DELIVERY AND SIGNAL ROUTING | Final Rejection | Avago Technologies International Sales Pte. Limited |
| 18090440 | 3D NAND MEMORY DEVICE AND FORMING METHOD THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18432491 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE HAVING A SUPPORT PATTERN IN CONTACT WITH A SIDE SURFACE OF A CONTACT PLUG | Non-Final OA | SK hynix Inc. |
| 17823472 | METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS | Final Rejection | Micron Technology, Inc. |
| 17893718 | FOLDED STAIRCASE VIA ROUTING FOR MEMORY | Final Rejection | Micron Technology, Inc. |
| 18397398 | REDUCTION OF METAL LOSS DURING GATE PATTERNING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18093472 | LOW RESISTANCE BOTTOM ELECTRODE VIA | Non-Final OA | Taiwan Semiconductor Manufacturing Company |
| 17898796 | LANTHANUM NITRIDE AS A DRAM MOLYBDENUM LINER | Final Rejection | Applied Materials, Inc. |
| 18027722 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Tokyo Electron Limited |
| 18308734 | TRANSISTOR HAVING WRAP-AROUND SOURCE/DRAIN CONTACTS | Non-Final OA | International Business Machines Corporation |
| 18093713 | VIA STRUCTURE WITHOUT LINER INTERFACE | Final Rejection | International Business Machines Corporation |
| 18080828 | TRANSISTORS WITH DIELECTRIC STACK ISOLATING BACKSIDE POWER RAIL | Non-Final OA | International Business Machines Corporation |
| 18065747 | SKIP VIA WITH DISCONTINUOUS DIELECTRIC CAP | Non-Final OA | International Business Machines Corporation |
| 18763037 | VERTICAL MEMORY STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18219844 | VERTICAL MEMORY STRUCTURE WITH AIR GAPS AND METHOD FOR PREPARING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18739352 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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