Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2821 2893 2894
This examiner grants 70% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18184561 | DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18004664 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18014012 | DISPLAY DEVICE USING MICRO LED | Non-Final OA | LG ELECTRONICS INC. |
| 18093713 | VIA STRUCTURE WITHOUT LINER INTERFACE | Non-Final OA | International Business Machines Corporation |
| 17536269 | BEOL TOP VIA WIRINGS WITH DUAL DAMASCENE VIA AND SUPER VIA REDUNDANCY | Non-Final OA | International Business Machines Corporation |
| 17699031 | MICROELECTRONIC STRUCTURE INCLUDING CONDUCTIVE POLYMER IN TRENCHES OF A CORE SUBSTRATE, AND METHOD OF MAKING SAME | Final Rejection | Intel Corporation |
| 18397967 | METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 17823472 | METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 17893718 | FOLDED STAIRCASE VIA ROUTING FOR MEMORY | Non-Final OA | Micron Technology, Inc. |
| 18099771 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING INTERCONNECTING METAL LAYER THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18027722 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Tokyo Electron Limited |
| 18090440 | 3D NAND MEMORY DEVICE AND FORMING METHOD THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18186264 | SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Kokusai Electric Corporation |
| 17730765 | MACROCHIP WITH INTERCONNECT STACK FOR POWER DELIVERY AND SIGNAL ROUTING | Final Rejection | Avago Technologies International Sales Pte. Limited |
| 17999255 | LOW RESISTIVITY CONTACTS AND INTERCONNECTS | Final Rejection | Lam Research Corporation |
| 18924884 | CONFIGURABLE CAPACITOR | Non-Final OA | Empower Semiconductor, Inc. |
| 18648334 | ELECTRODE CONNECTION ELEMENT, LIGHT-EMITTING DEVICE COMPRISING SAME, AND METHOD FOR PRODUCING LIGHT-EMITTING DEVICE | Non-Final OA | JUSUNG ENGINEERING CO., LTD. |
| 17899296 | METHOD FOR FORMING GRAPHENE BARRIER LAYER FOR SEMICONDUCTOR DEVICE AND CONTACT STRUCTURE FORMED BY THE SAME | Final Rejection | WONIK IPS CO., LTD. |
| 18255811 | HIGH-DENSITY THREE-DIMENSIONAL MEMORY DEVICE WITH INTERCONNECTION OF LOW RESISTANCE AND MANUFACTURING METHOD THEREOF | Non-Final OA | CHENGDU PBM TECHNOLOGY LTD. |
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