Tech Center 2800 • Art Units: 2898
This examiner grants 93% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18464348 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18454261 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18350999 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18214861 | INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18329830 | SEMICONDUCTER DEVICE AND FABRICATING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18046491 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17742852 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17720793 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17884479 | LIGHT EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18077812 | TWO STEP IMPLANT TO CONTROL TIP-TO-TIP DISTANCE BETWEEN TRENCHES | Final Rejection | Applied Materials, Inc. |
| 17875535 | PATTERNING SCHEME TO IMPROVE EUV RESIST AND HARD MASK SELECTIVITY | Non-Final OA | Applied Materials, Inc. |
| 18352708 | SOURCE/DRAIN FEATURES FOR STACKED MULTI-GATE DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18323179 | DIODE-CONTAINING COMPONENT AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18314184 | FRONTSIDE DEEP TRENCH ISOLATION (FDTI) STRUCTURE FOR CMOS IMAGE SENSOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18150027 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17558046 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING SOURCE OR DRAIN-LAST STRUCTURES | Final Rejection | Intel Corporation |
| 17822421 | MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 17848021 | MEMORY DEVICE INCLUDING HIGH-ASPECT-RATIO CONDUCTIVE CONTACTS | Non-Final OA | Micron Technology, Inc. |
| 18028581 | EPITAXIAL WAFER FOR ULTRAVIOLET LIGHT EMITTING DEVICE, METHOD FOR PRODUCING METAL BONDED SUBSTRATE FOR ULTRAVIOLET LIGHT EMITTING DEVICE, METHOD FOR PRODUCING ULTRAVIOLET LIGHT EMITTING DEVICE, AND METHOD FOR PRODUCING ULTRAVIOLET LIGHT EMITTING DEVICE ARRAY | Non-Final OA | SHIN-ETSU CHEMICAL CO., LTD. |
| 18464838 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 17958735 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 17950740 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 18083556 | MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | Winbond Electronics Corp. |
| 18562249 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | Non-Final OA | ams-OSRAM International GmbH |
| 18124563 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | Final Rejection | Fujian Jinhua Integrated Circuit Co., Ltd. |
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