Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 94% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18488409 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18464348 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18350999 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18046491 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17742852 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17720793 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17884479 | LIGHT EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18512894 | LOW RESISTIVITY GAPFILL | Non-Final OA | Applied Materials, Inc. |
| 17558046 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING SOURCE OR DRAIN-LAST STRUCTURES | Final Rejection | Intel Corporation |
| 17822421 | MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 17848021 | MEMORY DEVICE INCLUDING HIGH-ASPECT-RATIO CONDUCTIVE CONTACTS | Non-Final OA | Micron Technology, Inc. |
| 18011658 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR EPITAXIAL SUBSTRATE, AND SEMICONDUCTOR EPITAXIAL SUBSTRATE | Final Rejection | KYOCERA Corporation |
| 18352708 | SOURCE/DRAIN FEATURES FOR STACKED MULTI-GATE DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18323179 | DIODE-CONTAINING COMPONENT AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18150027 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18313177 | SURFACE ENERGY MODIFICATION IN HYBRID BONDING | Non-Final OA | Tokyo Electron Limited |
| 18464838 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18380345 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18098803 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18562249 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | Non-Final OA | ams-OSRAM International GmbH |
| 18124563 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | Final Rejection | Fujian Jinhua Integrated Circuit Co., Ltd. |
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