Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2898 4100
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18214861 | INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18322842 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17742852 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18834732 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18408102 | MULTILAYER ANTIREFLECTION COATINGS ON TEXTURED SURFACE FOR BACK ILLUMINATED SILICON PHOTOMULTIPLIER | Non-Final OA | Georgia Tech Research Corporation |
| 18743068 | HIGH-BANDWIDTH INTEGRATED CIRCUIT PACKAGING OF MEMORY AND LOGIC | Non-Final OA | QUALCOMM Incorporated |
| 17710837 | INTEGRATED CIRCUIT STRUCTURES WITH FULL-WRAP CONTACT STRUCTURE | Non-Final OA | Intel Corporation |
| 17741621 | 3D Packaging Heterogeneous Area Array Interconnections | Non-Final OA | Avago Technologies International Sales Pte. Limited |
| 18361189 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 18082486 | THREE-DIMENSIONAL MEMORY AND FORMING METHOD THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 17991050 | THREE-DIMENSIONAL MEMORY DEVICES AND SYSTEM HAVING THE SAME | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18517496 | FERROELECTRIC MEMORY DEVICE AND MANUFACTURING METHOD OF THE FERROELECTRIC MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 17958735 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 17950740 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SK hynix Inc. |
| 18046650 | TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME | Non-Final OA | Micron Technology, Inc. |
| 18789212 | MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18403587 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18352708 | SOURCE/DRAIN FEATURES FOR STACKED MULTI-GATE DEVICE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18323179 | DIODE-CONTAINING COMPONENT AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18194748 | Blocking Structures on Isolation Structures | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18440209 | GRAIN GROWTH OF SILICON BY METAL INDUCED CRYSTALLIZATION | Non-Final OA | Applied Materials, Inc. |
| 17875535 | PATTERNING SCHEME TO IMPROVE EUV RESIST AND HARD MASK SELECTIVITY | Final Rejection | Applied Materials, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy