Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2815
This examiner grants 45% of resolved cases
David Z. Chen, an examiner in Tech Center 2800 and Art Unit 2811, has 689 resolved cases. The allowance rate is 44.7%, which is below the average for many units. The median days to allowance is 1311, reflecting a standard duration for successful cases. This 1311-day timeline is a key metric for practitioners to manage. The 44.7% rate suggests a rigorous examination process in Art Unit 2811.
The interview lift is 50.1%, which is very high. This suggests that interviews are nearly essential for improving the 44.7% allowance rate. In Tech Center 2800, the 1311-day median pendency can be managed more effectively by engaging the examiner directly. The 50.1% lift is one of the most impactful metrics in this profile. With 689 resolved cases, the data provides a very strong statistical basis for this recommendation.
Practitioners should prioritize interviews given the 50.1% lift over the 44.7% baseline. The 1311-day median to allowance should be the expected timeline for those who succeed. Overall, the 689 cases show that direct communication is a decisive factor for success with this examiner. Applicants in Art Unit 2811 should use the 50.1% lift to navigate the 1311-day duration.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18901283 | SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18612828 | CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18610790 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18507905 | TRANSISTOR, METHOD OF MANUFACTURING THE TRANSISTOR, ELECTRONIC DEVICE INCLUDING TRANSISTOR, AND ELECTRONIC APPARATUS INCLUDING THE TRANSISTOR | Final Rejection | Samsung Electronics Co., Ltd. |
| 18370149 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18496902 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS | Final Rejection | SEIKO EPSON CORPORATION |
| 18028791 | LIGHT-EMITTING DIODE CHIP, MANUFACTURING METHOD THEREOF AND DISPLAY APPARATUS | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18314993 | DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18127555 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17993252 | DISPLAY DEVICE INCLUDING HEAT DISSIPATION PART AND MANUFACTURING METHOD FOR THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18540557 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18522699 | Display Device | Final Rejection | LG Display Co., Ltd. |
| 18193539 | OPTICAL MEMBER AND LIGHT-EMITTING DEVICE | Final Rejection | NICHIA CORPORATION |
| 18787281 | LIGHT-EMITTING DEVICE HAVING A SUBSTRATE WITH HIGH ACCURACY | Non-Final OA | InnoLux Corporation |
| 18153984 | DISPLAY DEVICE HAVING BAND-PASS FILTER AND LIGHT CONVERSION LAYER | Final Rejection | Innolux Corporation |
| 18244354 | MULTI-PLANARITY OF LIGHT EMITTING SURFACES IN LED COMPONENTS | Non-Final OA | CreeLED, Inc. |
| 18817038 | INKJET PRINTING DEDICATED TEST PINS | Non-Final OA | QUALCOMM Incorporated |
| 18607986 | DIE PACKAGE WITH ENTANGLED VERTICAL INTERCONNECTS COUPLED TO A ROUTING SUBSTRATE FOR REDUCED ROUTING SUBSTRATE LAYERS, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18532318 | QUANTUM DOT IMAGE SENSOR DEVICES AND METHODS OF MANUFACTURING THE SAME | Non-Final OA | Adeia Semiconductor Bonding Technologies Inc. |
| 17451026 | SEMICONDUCTOR DEVICE WITH SEAL RING | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18568584 | LIGHT DETECTING DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18006622 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17534224 | SELECTIVE HEAT SINK | Non-Final OA | BAE Systems Information and Electronic Systems Integration Inc. |
| 17551081 | TESTING SEMICONDUCTOR COMPONENTS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18789668 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18733880 | PACKAGE STRUCTURE WITH REWIRING LAYER AND METHOD OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18363077 | INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17837664 | GRAPHENE-CLAD METAL INTERCONNECT | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18591695 | IN SITU REMOVABLE BLOCKING LAYER FORMATION | Non-Final OA | Tokyo Electron Limited |
| 18369310 | INTERPOSER WITH LINES HAVING PORTIONS SEPARATED BY BARRIER LAYERS | Non-Final OA | Microchip Technology Incorporated |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy