Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 87% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18586789 | INFRARED IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | Final Rejection | Samsung Electronics Co., Ltd. |
| 18439983 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18417150 | CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR STRUCTURE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17846245 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18440207 | DEVICE PACKAGES WITH PARTIALLY MOLDED CONNECTORS | Non-Final OA | NXP USA, Inc. |
| 18656470 | DISPLAY DEVICE AND MANUFACTURING METHOD FOR SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18440136 | LIGHT EMITTING ELEMENT ARRAY, DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17792178 | METHOD FOR PRODUCING AN OHMIC CONTACT ON A CRYSTALLOGRAPHIC C-SIDE OF A SILICON CARBIDE SUBSTRATE, AND OHMIC CONTACT | Non-Final OA | Robert Bosch GmbH |
| 17485295 | MULTICHIP PACKAGE STAIRCASE CAVITIES | Non-Final OA | Altera Corporation |
| 18332330 | SEMICONDUCTOR DEVICE, BATTERY MANAGEMENT SYSTEM AND METHOD OF PRODUCING A SEMICONDUCTOR DEVICE | Final Rejection | Infineon Technologies Austria AG |
| 17991062 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18082285 | INTEGRATED CIRCUIT HAVING EXPOSED LEADS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17929933 | ELECTRONIC DEVICES INCLUDING A METAL SILICIDE MATERIAL OVER A SOURCE CONTACT, AND RELATED MEMORY DEVICES, SYSTEMS, AND METHODS OF FORMING | Non-Final OA | Micron Technology, Inc. |
| 17874206 | HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATED METHODS | Non-Final OA | Micron Technology, Inc. |
| 18659212 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18405450 | THIN FILM RESISTORS AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18166109 | METHODS FOR FORMING SEMICONDUCTOR PACKAGE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17830522 | ENHANCED REDISTRIBUTION VIA STRUCTURE FOR RELIABILITY IMPROVEMENT IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18124154 | METHOD FOR REPLACING SOLDER BALLS OF AN ELECTRONIC PACKAGE | Final Rejection | SKYWORKS SOLUTIONS, INC. |
| 18812168 | METHOD OF MANUFACTURING WAFER | Non-Final OA | DISCO CORPORATION |
| 18404718 | FORMATION METHOD OF MEMORY CELL | Non-Final OA | NATIONAL TAIWAN UNIVERSITY |
| 18708028 | METHOD FOR MANUFACTURING GATE-ALL-AROUND TFET DEVICE | Non-Final OA | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
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