Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17846245 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17719721 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18082285 | INTEGRATED CIRCUIT HAVING EXPOSED LEADS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17561445 | METHOD OF CONTROLLED PROPAGATION OF LASER INDUCED SILICON CRACKS THROUGH A BALANCED COMPRESSIVE AND RETRACTIVE CYCLICAL FORCE FOR LASER DICING | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18345012 | SEMICONDUCTOR DEVICE | Non-Final OA | Canon Kabushiki Kaisha |
| 17654637 | Method of Fine Pitch Hybrid Bonding with Dissimilar CTE Wafers and Resulting Structures | Final Rejection | Apple Inc. |
| 17813136 | STACKED SEMICONDUCTOR DEVICE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17792178 | METHOD FOR PRODUCING AN OHMIC CONTACT ON A CRYSTALLOGRAPHIC C-SIDE OF A SILICON CARBIDE SUBSTRATE, AND OHMIC CONTACT | Final Rejection | Robert Bosch GmbH |
| 17874206 | HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATED METHODS | Final Rejection | Micron Technology, Inc. |
| 17879594 | PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION PORTION COUPLED TO A SECOND METALLIZATION PORTION | Final Rejection | QUALCOMM Incorporated |
| 17991062 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18091055 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, MEMORY AND MEMORY SYSTEM | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 18089869 | THREE-DIMENSIONAL MEMORY DEVICE AND FABRICATION METHOD | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18343680 | DEVICE HAVING HYBRID NANOSHEET STRUCTURE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18124154 | METHOD FOR REPLACING SOLDER BALLS OF AN ELECTRONIC PACKAGE | Non-Final OA | SKYWORKS SOLUTIONS, INC. |
| 17830522 | ENHANCED REDISTRIBUTION VIA STRUCTURE FOR RELIABILITY IMPROVEMENT IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 17828066 | SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18186974 | SEMICONDUCTOR DEVICE WITH PAD STRUCTURE RESISTANT TO PLASMA DAMAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Richtek Technology Corporation |
| 18043080 | NOR-TYPE MEMORY DEVICE, METHOD OF MANUFACTURING NOR-TYPE MEMORY DEVICE, AND ELECTRONIC APPARATUS INCLUDING MEMORY DEVICE | Non-Final OA | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| 18043220 | SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT | Non-Final OA | MEIJO UNIVERSITY |
| 17923104 | 3D FLUSH MEMORY HAVING IMPROVED STRUCTURE | Non-Final OA | PeDiSem Co., Ltd. |
| 17822055 | Semiconductor Device and Method of Forming Radiation Hardened Substantially Defect Free Silicon Carbide Substrate | Final Rejection | IceMos Technology Limited |
| 17738711 | 3D-STACKED SEMICONDUCTOR DEVICE WITH IMPROVED ALIGNMENT USING CARRIER WAFER PATTERNING | Non-Final OA | SAMSUNG ELECTRONIC CO., LTD. |
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