Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2898
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18439983 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18434041 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17846245 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17738711 | 3D-STACKED SEMICONDUCTOR DEVICE WITH IMPROVED ALIGNMENT USING CARRIER WAFER PATTERNING | Non-Final OA | SAMSUNG ELECTRONIC CO., LTD. |
| 17654637 | Method of Fine Pitch Hybrid Bonding with Dissimilar CTE Wafers and Resulting Structures | Final Rejection | Apple Inc. |
| 18440136 | LIGHT EMITTING ELEMENT ARRAY, DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17879594 | PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION PORTION COUPLED TO A SECOND METALLIZATION PORTION | Non-Final OA | QUALCOMM Incorporated |
| 17485295 | MULTICHIP PACKAGE STAIRCASE CAVITIES | Non-Final OA | Altera Corporation |
| 17769582 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | SHARP KABUSHIKI KAISHA |
| 18440207 | DEVICE PACKAGES WITH PARTIALLY MOLDED CONNECTORS | Non-Final OA | NXP USA, Inc. |
| 18082285 | INTEGRATED CIRCUIT HAVING EXPOSED LEADS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17719241 | SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCTURES FOR THERMAL DISSIPATION AND METHODS OF MAKING THE SAME | Non-Final OA | Micron Technology, Inc. |
| 18405450 | THIN FILM RESISTORS AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18304913 | BACKSIDE VIA AND METAL GATE SEPARATION | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18168884 | SEMICONDUCTOR STRUCTURE WITH DEVICES HAVING DIFFERENT EFFECTIVE CHANNELS AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18166109 | METHODS FOR FORMING SEMICONDUCTOR PACKAGE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18343680 | DEVICE HAVING HYBRID NANOSHEET STRUCTURE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17830522 | ENHANCED REDISTRIBUTION VIA STRUCTURE FOR RELIABILITY IMPROVEMENT IN SEMICONDUCTOR DIE PACKAGING AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 17828066 | SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18404718 | FORMATION METHOD OF MEMORY CELL | Non-Final OA | NATIONAL TAIWAN UNIVERSITY |
| 18593971 | EMBEDDED MEMORY DEVICE AND FABRICATION METHOD THEREOF | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18708028 | METHOD FOR MANUFACTURING GATE-ALL-AROUND TFET DEVICE | Non-Final OA | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| 18043080 | NOR-TYPE MEMORY DEVICE, METHOD OF MANUFACTURING NOR-TYPE MEMORY DEVICE, AND ELECTRONIC APPARATUS INCLUDING MEMORY DEVICE | Final Rejection | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
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