Tech Center 2800 • Art Units: 2815 2817
This examiner grants 94% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18394926 | SEMICONDUCTOR DEVICES HAVING ENHANCED KEY PATTERNS THEREIN AND METHODS OF FABRICATING SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17721271 | POWER MODULE PACKAGE WITH MAGNETIC MOLD COMPOUND | Non-Final OA | Texas Instruments Incorporated |
| 17683253 | FABRICATION PROCESS FOR PROTECTING CIRCUIT COMPONENTS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18212652 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17966659 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17698485 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 17953465 | METHOD OF MANUFACTURING WAVELENGTH CONVERTOR | Non-Final OA | SEIKO EPSON CORPORATION |
| 18740889 | METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DESIGN | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17826100 | MEMORY CELL ISOLATION | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17825411 | SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17722302 | INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17862412 | DISPLAY DEVICE CAPABLE OF IMPROVING HEAT DISSIPATION | Final Rejection | Innolux Corporation |
| 17935639 | ARRANGEMENTS FOR MEMORY WITH ONE ACCESS TRANSISTOR FOR MULTIPLE CAPACITORS | Non-Final OA | Intel Corporation |
| 17844476 | PACKAGE WITH PERMALLOY CORE INDUCTOR AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17882329 | DISPLAY DEVICE | Non-Final OA | PanelSemi Corporation |
| 18083212 | LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE | Non-Final OA | SEOUL VIOSYS CO., LTD. |
| 18279645 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT, AND METHOD FOR PRODUCING AT LEAST ONE OPTOELECTRONIC SEMICONDUCTOR COMPONENT | Non-Final OA | ams-OSRAM International GmbH |
| 17994007 | Semiconductor structure and the forming method thereof | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 17635437 | FAN-OUT TYPE PACKAGE PREPARATION METHOD OF FAN-OUT TYPE PACKAGE | Non-Final OA | Shenzhen Xiuyuan Electronic Technology Co., Ltd. |
| 17518987 | Chip Module, Use of Chip Module, Test Arrangement and Test Method | Non-Final OA | First Sensor AG |
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