Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2848 2892 2898
This examiner grants 90% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18399573 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18091349 | PACKAGE SUBSTRATE HAVING DEPRESSION | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17958254 | MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR DEVICE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18356386 | METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES | Non-Final OA | International Business Machines Corporation |
| 18340052 | METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR) | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17520690 | SEMICONDUCTOR DEVICE WITH BOTTOM DIELECTRIC ISOLATION | Non-Final OA | International Business Machines Corporation |
| 17907660 | MAGNETORESISTANCE SENSOR AND METHOD OF FABRICATION | Final Rejection | National University of Singapore |
| 18211551 | Semiconductor devices with a structure capable of suppressing coupling noise suppression | Non-Final OA | MEDIATEK INC. |
| 18119805 | SEMICONDUCTOR DEVICE USING ONE OR MORE SLOTS ADDED TO ISOLATION REGION SURROUNDING INDUCTOR FOR ISOLATION IMPROVEMENT | Final Rejection | MEDIATEK INC. |
| 18346495 | CAPACITOR STRUCTURE INCLUDING WORK FUNCTION METAL LAYERS AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18135598 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18165754 | VIA WITH SACRIFICIAL STRESS BARRIER RING | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18097970 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18545325 | MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18378839 | IMAGE PICKUP UNIT AND ENDOSCOPE | Non-Final OA | OLYMPUS MEDICAL SYSTEMS CORP. |
| 18099308 | CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE | Non-Final OA | Infineon Technologies Austria AG |
| 18531966 | MEMORY DEVICE HAVING IMPROVED P-N JUNCTION AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18060835 | DIELECTRIC THIN FILM COMPRISING PEROVSKITE MATERIAL, CAPACITOR INCLUDING THE DIELECTRIC THIN FILM, AND ELECTRONIC DEVICE INCLUDING THE CAPACITOR | Non-Final OA | Cornell University |
| 18482382 | Light emitting device and apparatus having the same | Non-Final OA | SEOUL VIOSYS CO., LTD. |
| 18493120 | BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MANUFACTURING SAME | Non-Final OA | DB HiTek Co., Ltd. |
| 17938967 | MAGNETIC TUNNEL JUNCTION STRUCTURE WITH NON-MAGNETIC AMORPHOUS INSERTION LAYER | Final Rejection | HeFeChip Corporation Limited |
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