Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2848 2892 2898
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18535561 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18522352 | SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18399573 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 17955361 | FLEXIBLE DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18183367 | POWER MODULE AND MANUFACTURING METHOD THEREOF, CONVERTER, AND ELECTRONIC DEVICE | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18520126 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18516043 | COVER WINDOW AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18422127 | INTEGRATED DEVICES HAVING MULTIPLE DIE ORIENTATIONS | Non-Final OA | QUALCOMM Incorporated |
| 18182080 | COUPLED INDUCTORS THROUGH SUBSTRATE-ASSEMBLY PROCESS AND/OR WAFER-LEVEL PROCESS | Non-Final OA | QUALCOMM Incorporated |
| 18161021 | INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MATERIAL | Non-Final OA | QUALCOMM Incorporated |
| 18518345 | STACKED ELECTRONIC PACKAGES | Non-Final OA | NXP USA, Inc. |
| 18545325 | MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE | Final Rejection | SK hynix Inc. |
| 18795747 | MULTI-LAYER POLYSILICON STACK FOR SEMICONDUCTOR DEVICES | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18143446 | HIGH THERMAL CONDUCTIVITY VIAS BY ADDITIVE PROCESSING | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18091349 | PACKAGE SUBSTRATE HAVING DEPRESSION | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18070530 | LEADFRAME BASED POWER MODULE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18097970 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18619016 | VERTICALLY STACKED CAPACITORS AND METHOD OF FORMING THE SAME | Non-Final OA | Tokyo Electron Limited |
| 18552957 | FILM FORMING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18584286 | PACKAGE WITH ENCAPSULANT AND FURTHER ENCAPSULANT THEREON | Final Rejection | Infineon Technologies AG |
| 18609127 | METAL-INSULATOR-METAL CAPACITOR STRUCTURE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18407502 | INTERCONNECT WITH TOPVIA | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18528917 | CHANNEL ISOLATION FOR A LOW-POWER SEMICONDUCTOR DEVICE | Non-Final OA | International Business Machines Corporation |
| 18524693 | PHASE CHANGE MEMORY WITH PARTIAL SIDEWALL SPACER CONTACT | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18356386 | METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES | Final Rejection | International Business Machines Corporation |
| 18340052 | METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR) | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18443683 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 17952267 | METAL-INSULATOR-METAL CAPACITOR DEVICE WITH INTEGRATED WIRE BONDING SURFACE | Non-Final OA | MACOM Technology Solutions Holdings, Inc |
| 18534804 | ETCHED DIE SINGULATION SYSTEMS AND RELATED METHODS | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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