Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2815 2848 2892 2898
This examiner grants 89% of resolved cases
Omar F Mojaddedi serves in Tech Center 2800 and Art Unit 2815. The examiner has a substantial record of 536 resolved cases. The allowance rate is 89.4 percent. This high rate suggests that most applications are likely to be granted under his review.
The interview lift is 10.4 percent. This figure indicates that while interviews are helpful, they are not strictly necessary for success given the high 89.4 percent allowance rate. The median days to allowance is 856, which suggests a relatively efficient prosecution process.
With 536 resolved cases, the examiner demonstrates a consistent pattern of allowing applications. The 856 median days to allowance provides a reliable benchmark for timing. Practitioners can use these statistics to support a strategy focused on clear documentation and efficient resolution in Art Unit 2815.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18522352 | SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18520126 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18516043 | COVER WINDOW AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18823940 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18399573 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18183367 | POWER MODULE AND MANUFACTURING METHOD THEREOF, CONVERTER, AND ELECTRONIC DEVICE | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18822687 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 18583833 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 18422127 | INTEGRATED DEVICES HAVING MULTIPLE DIE ORIENTATIONS | Non-Final OA | QUALCOMM Incorporated |
| 18487022 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18568570 | PASSIVE ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | Sumitomo Electric Device Innovations, Inc. |
| 18609127 | METAL-INSULATOR-METAL CAPACITOR STRUCTURE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18407502 | INTERCONNECT WITH TOPVIA | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18544506 | INNER SPACER AND SOURCE DRAIN EPI | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18524693 | PHASE CHANGE MEMORY WITH PARTIAL SIDEWALL SPACER CONTACT | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18482213 | ELECTRONIC FUSE VIA AND LOGIC DEVICE CO-INTEGRATION WITH BACKSIDE POWER DELIVERY NETWORK | Final Rejection | International Business Machines Corporation |
| 18610037 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18545325 | MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE | Final Rejection | SK hynix Inc. |
| 18795747 | MULTI-LAYER POLYSILICON STACK FOR SEMICONDUCTOR DEVICES | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18143446 | HIGH THERMAL CONDUCTIVITY VIAS BY ADDITIVE PROCESSING | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18091349 | PACKAGE SUBSTRATE HAVING DEPRESSION | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18070530 | LEADFRAME BASED POWER MODULE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18780581 | INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18309874 | PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FORMING THE PACKAGE MODULE | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18438067 | FORMATION OF GATE ALL AROUND DEVICE | Non-Final OA | Applied Materials, Inc. |
| 18433681 | METHODS OF MANUFACTURING INTERCONNECT STRUCTURES | Final Rejection | Applied Materials, Inc. |
| 18619016 | VERTICALLY STACKED CAPACITORS AND METHOD OF FORMING THE SAME | Final Rejection | Tokyo Electron Limited |
| 18307101 | STRUCTURAL ENCLOSURE FOR PROTECTION AGAINST FOREIGN OBJECT DEBRIS | Final Rejection | Raytheon Company |
| 18765112 | SEMICONDUCTOR STRUCTURE HAVING A MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18733103 | SEMICONDUCTOR STRUCTURE HAVING A MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
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