Prosecution Insights
Last updated: August 17, 2026

Examiner: PARK, SAMUEL

Tech Center 4100 • Art Units: 2818 4100

This examiner grants 85% of resolved cases

Performance Statistics

84.6%
Allow Rate
+24.6% vs TC avg
508
Total Applications
+23.7%
Interview Lift
929
Avg Prosecution Days
Based on 479 resolved cases, 2023–2026

Rejection Statute Breakdown

0.9%
§101 Eligibility
23.2%
§102 Novelty
54.0%
§103 Obviousness
21.0%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18423117 SEMICONDUCTOR DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18493122 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18351422 SEMICONDUCTOR DEVICE INCLUDING SPACER STRUCTURE HAVING OXIDIZED REGION Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18191291 SEMICONDUCTOR MEMORY DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18186849 SEMICONDUCTOR DEVICE INCLUDING A FORROELECTRIC TRANSISTOR Final Rejection SAMSUNG ELECTRONICS CO., LTD.
17961688 METHOD OF FABRICATING A SEMICONDUCTOR DEVICE INCLUDING CONTACT PLUG AND SEMICONDUCTOR DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18769129 IMAGE PICKUP ELEMENT, STACKED IMAGE PICKUP ELEMENT, AND SOLID IMAGE PICKUP APPARATUS Final Rejection SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18257399 SOLID-STATE IMAGING ELEMENT, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE Non-Final OA SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18739591 DISPLAY DEVICE Non-Final OA InnoLux Corporation
18353211 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT Non-Final OA SK hynix Inc.
18656969 INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18596641 SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT AND METHODS OF MANUFACTURING THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18423215 SEMICONDUCTOR STRUCTURE Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
18348741 ELECTROSTATIC DISCHARGE IN GALLIUM NITRIDE DEVICES Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18590111 MICROWAVE ASSISTED PASSIVATION LAYER REMOVAL Non-Final OA Applied Materials, Inc.
18378850 SACRIFICIAL SOURCE/DRAIN FOR METALLIC SOURCE/DRAIN HORIZONTAL GATE ALL AROUND ARCHITECTURE Final Rejection Applied Materials, Inc.
18423110 SEMICONDUCTOR MEMORY DEVICE Non-Final OA Kioxia Corporation
18668639 INTEGRATED CIRCUIT INCLUDING A CAPACITIVE STRUCTURE OF THE METAL-INSULATOR-METAL TYPE AND CORRESPONDING MANUFACTURING METHOD Non-Final OA STMicroelectronics (Rousset) SAS
18380478 AIR GAP STRUCTURE IN INTERCONNECT WITH TOP VIA Final Rejection International Business Machines Corporation
18460610 MEMORY DEVICE AND MANUFACTURING METHOD THEREOF Final Rejection Winbond Electronics Corp.

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