Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2894
This examiner grants 78% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18016220 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND METHOD FOR MANUFACTURING SAME | Final Rejection | LG ELECTRONICS INC. |
| 18662164 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18623860 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18609885 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18674957 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18704475 | LIGHT-EMITTING DEVICE, DISPLAY PANEL, AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18554635 | Display Substrate and Display Device | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18717888 | DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT EMITTING ELEMENT | Non-Final OA | LG DISPLAY CO., LTD. |
| 18638680 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 17883181 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17388727 | DISPLAY DEVICE WITH LIGHT BLOCKING LAYER THAT OVERLAPS AN EMISSION LAYER | Final Rejection | Samsung Display Co., LTD. |
| 17903856 | SEMICONDUCTOR PACKAGE INCLUDING GLASS INTERPOSER STRUCTURE WITH SELF-ALIGNED THROUGH GLASS VIAS | Final Rejection | Intel Corporation |
| 17891666 | DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES | Final Rejection | Intel Corporation |
| 17191615 | PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS | Non-Final OA | Intel Corporation |
| 18016745 | SEMICONDUCTOR DEVICE | Final Rejection | Semiconductor Energy Laboratory Co., Ltd. |
| 18457337 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SK hynix Inc. |
| 17835180 | SEMICONDUCTOR STORAGE DEVICE HAVING A COLUMNAR PART PROVIDED IN A MULTI-LAYER BODY AND AN INTERCONNECTION REGION THEREOF | Final Rejection | Kioxia Corporation |
| 18751540 | GROUP III ELEMENT NITRIDE SEMICONDUCTOR SUBSTRATE AND BONDED SUBSTRATE | Non-Final OA | NGK INSULATORS, LTD. |
| 18441210 | HYBRID MULTI-DIE QFP-QFN PACKAGE | Non-Final OA | STMicroelectronics International N.V. |
| 18554701 | RADIATION-EMITTING SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING A RADIATION-EMITTING SEMICONDUCTOR CHIP | Non-Final OA | ams-OSRAM International GmbH |
| 18152202 | MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 17891618 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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