Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2894
This examiner grants 77% of resolved cases
Examiner Zhijun Xu operates within Art Unit 2818 of Tech Center 2800, where they have managed 73 resolved cases. The data shows an allowance rate of 76.7 percent for these applications. Practitioners should note that the median days to allowance for this examiner is 1333, which provides a timeline for expectations regarding the duration of the prosecution process. This 1333 day duration reflects the time from filing to the final grant of a patent for applications under this examiner's review.
The interview lift for this profile is 11.9 percent. This figure indicates that conducting an interview with the examiner correlates with an increased probability of allowance compared to cases where no interview occurs. With 73 resolved cases as the baseline, the 11.9 percent lift offers a strategic reason to engage in direct communication during the examination of applications in Art Unit 2818. This 11.9 percent lift suggests that oral advocacy may help clarify technical issues or resolve examiner concerns more effectively than written responses alone, potentially aiding in navigating the 1333 day median timeline.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18662164 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18609885 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18502903 | IMAGE SENSORS HAVING IMPROVED OPTICAL CHARACTERISTICS USING ENHANCED ELECTRICAL CONNECTION OF SPACED-APART FLOATING DIFFUSION REGIONS | Final Rejection | Samsung Electronics Co., Ltd. |
| 18163573 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18764405 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18704475 | LIGHT-EMITTING DEVICE, DISPLAY PANEL, AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18441335 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 17883181 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17388727 | DISPLAY DEVICE WITH LIGHT BLOCKING LAYER THAT OVERLAPS AN EMISSION LAYER | Final Rejection | Samsung Display Co., LTD. |
| 18589641 | LIGHT-EMITTING DIODE CHIP STRUCTURES WITH ELECTRODE EXTENSIONS AND GRADIENT VIAS | Final Rejection | CreeLED, Inc. |
| 17903856 | SEMICONDUCTOR PACKAGE INCLUDING GLASS INTERPOSER STRUCTURE WITH SELF-ALIGNED THROUGH GLASS VIAS | Final Rejection | Intel Corporation |
| 17891666 | DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES | Final Rejection | Intel Corporation |
| 16912136 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING STRAINED SOURCE OR DRAIN STRUCTURES ON GATE DIELECTRIC LAYER | Final Rejection | Intel Corporation |
| 18554701 | RADIATION-EMITTING SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING A RADIATION-EMITTING SEMICONDUCTOR CHIP | Final Rejection | ams-OSRAM International GmbH |
| 17920479 | Semiconductor Device and Method of Manufacturing the Same | Final Rejection | NTT, Inc. |
| 18417792 | MEMS DEVICE WITH MEMBRANE AND UPRIGHT NANOSTRUCTURES | Non-Final OA | Infineon technologies AG |
| 18457337 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SK hynix Inc. |
| 18441210 | HYBRID MULTI-DIE QFP-QFN PACKAGE | Non-Final OA | STMicroelectronics International N.V. |
| 17809099 | HIGH-VOLTAGE SEMICONDUCTOR DEVICES AND METHODS OF FORMATION | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17825698 | SEMICONDUCTOR DEVICES WITH REDUCED EFFECT OF CAPACITIVE COUPLING | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18152390 | METHOD OF SACRIFICIAL NANOSTRUCTURE REPLACEMENT IN SEMICONDUCTOR DEVICES | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18613918 | GRADIENT METAL LINER FOR INTERCONNECT STRUCTURES | Non-Final OA | Applied Materials, Inc. |
| 17865355 | SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES | Non-Final OA | Advanced Micro Devices, Inc. |
| 18751540 | GROUP III ELEMENT NITRIDE SEMICONDUCTOR SUBSTRATE AND BONDED SUBSTRATE | Non-Final OA | NGK INSULATORS, LTD. |
| 18662077 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COAXIAL DOUBLE CONTACT VIA STRUCTURES AND METHODS FOR FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18152202 | MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 17891618 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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