Tech Center 2800 • Art Units: 2818 2894
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18163573 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17352139 | N-POLAR III-N SEMICONDUCTOR DEVICE STRUCTURES WITH WET ETCHING | Final Rejection | The Regents of the University of California |
| 17883181 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 17388727 | DISPLAY DEVICE WITH LIGHT BLOCKING LAYER THAT OVERLAPS AN EMISSION LAYER | Final Rejection | Samsung Display Co., LTD. |
| 18016220 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND METHOD FOR MANUFACTURING SAME | Non-Final OA | LG ELECTRONICS INC. |
| 17455937 | REDUCED PARASITIC RESISTANCE TWO-DIMENSIONAL MATERIAL FIELD-EFFECT TRANSISTOR | Non-Final OA | International Business Machines Corporation |
| 17809099 | HIGH-VOLTAGE SEMICONDUCTOR DEVICES AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17847450 | IMAGE SENSOR GATE STRUCTURE AND DOPING PROFILE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17825698 | SEMICONDUCTOR DEVICES WITH REDUCED EFFECT OF CAPACITIVE COUPLING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17903856 | SEMICONDUCTOR PACKAGE INCLUDING GLASS INTERPOSER STRUCTURE WITH SELF-ALIGNED THROUGH GLASS VIAS | Non-Final OA | Intel Corporation |
| 17891666 | DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES | Non-Final OA | Intel Corporation |
| 17550861 | STACKED TRANSISTORS WITH REMOVED EPI BARRIER | Non-Final OA | Intel Corporation |
| 16912136 | GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING STRAINED SOURCE OR DRAIN STRUCTURES ON GATE DIELECTRIC LAYER | Non-Final OA | Intel Corporation |
| 18177318 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | KABUSHIKI KAISHA TOSHIBA |
| 17301915 | ELECTRONIC DEVICES COMPRISING BLOCKS WITH DIFFERENT MEMORY CELLS, AND RELATED METHODS AND SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 17621682 | METHOD FOR PRODUCTION OF MICROWIRES OR NANOWIRES | Final Rejection | Aledia |
| 17964557 | SPACE-FREE VERTICAL FIELD EFFECT TRANSISTOR INCLUDING ACTIVE LAYER HAVING VERTICALLY GROWN CRYSTAL GRAINS | Final Rejection | Research & Business Foundation SUNGKYUNKWAN UNIVERSITY |
| 17835180 | SEMICONDUCTOR STORAGE DEVICE HAVING A COLUMNAR PART PROVIDED IN A MULTI-LAYER BODY AND AN INTERCONNECTION REGION THEREOF | Final Rejection | Kioxia Corporation |
| 17682810 | SEMICONDUCTOR DEVICE HAVING WIRING WITH REDUCED SCATTERING OF FREE ELECTRONS AND MANUFACTURING METHOD THEREOF | Final Rejection | Kioxia Corporation |
| 18457337 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18151761 | METHOD OF FORMING A NANO-FET SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17920479 | Semiconductor Device and Method of Manufacturing the Same | Non-Final OA | NTT, Inc. |
| 17865355 | SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES | Final Rejection | Advanced Micro Devices, Inc. |
| 18447544 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | National Yang Ming Chiao Tung University |
| 18152202 | MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 17994412 | PROCESSING METHOD OF PROCESSING APPARATUS | Final Rejection | PlayNitride Display Co., Ltd. |
| 17591002 | METHOD FOR FORMING BISMUTH DOPED SEMI-CONDUCTOR OR CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | National University Corporation Kyoto Institute of Technology |
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