Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2871 2899
This examiner grants 81% of resolved cases
Douglas Anthony Yap is an examiner in Tech Center 2800 and Art Unit 2871. The profile includes 67 resolved cases. The allowance rate is 80.6 percent, and the median days to allowance is 1180. These figures offer a view into the typical results and timing for applications in this art unit. The 1180 day median provides a specific benchmark for practitioners to estimate the duration of the examination process from filing to grant.
The interview lift for this examiner is 12.1 percent. This suggests that interviews have a positive impact on the probability of allowance. With 67 resolved cases, the 12.1 percent lift and the 80.6 percent allowance rate are key data points for practitioners to consider when planning their strategy. Engaging in an interview may be a helpful tactic to navigate the 1180 day median timeline for applications assigned to Art Unit 2871.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18737402 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18434263 | SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN REGION WITH UNDERBLOCKING LAYER THEREON | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18341345 | SEMICONDUCTOR PACKAGE WITH SUBSTRATE CAVITY | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18795008 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18513504 | MANUFACTURING METHOD OF OPTICAL MEMBER AND MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 17835861 | PACKAGE COMPRISING A SUBSTRATE WITH A BRIDGE CONFIGURED FOR A BACK SIDE POWER DISTRIBUTION NETWORK | Non-Final OA | QUALCOMM Incorporated |
| 17680607 | METHODS AND SYSTEMS FOR FILLING A GAP | Non-Final OA | ASM IP Holding B.V. |
| 18702617 | DISPLAY DEVICE | Non-Final OA | Sharp Display Technology Corporation |
| 17773145 | FLUID-INFUSED ENCAPSULATION OF WATER-SENSITIVE MATERIALS WITH REPLENISHABLE, MULTISCALE WATER REPELLENCY | Final Rejection | President and Fellows of Harvard College |
| 18188736 | IRREGULAR-SHAPED POWER RAIL IN CELL POWER DISTRIBUTION | Non-Final OA | International Business Machines Corporation |
| 17816105 | High-Speed Signal Transition Across Thick Package Cores | Non-Final OA | Marvell Asia Pte Ltd |
| 18979340 | IMAGE SENSING DEVICE | Non-Final OA | SK hynix Inc. |
| 18310300 | METAL WIRING OF SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 17891523 | ANTIFUSES USING A FINFET ARCHITECTURE | Final Rejection | Micron Technology, Inc. |
| 18659436 | PHASE CHANGE MEMORY ELEMENT PARTICULARLY SUITABLE FOR EMBEDDED AND AUTOMOTIVE APPLICATIONS | Non-Final OA | STMicroelectronics International N.V. |
| 18530248 | LATERALLY-DIFFUSED METAL-OXIDE SEMICONDUCTOR (LDMOS) DEVICE AND METHOD FOR FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18789467 | MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18621828 | METHOD OF MAKING SILICIDE IN HIGH-ASPECT RATIO STRUCTURES BY HYBRID PROCESSES | Non-Final OA | Applied Materials, Inc. |
| 18509560 | INTEGRATED NANOSHEET MEMORY ELEMENTS, DEVICES AND METHODS | Non-Final OA | Tokyo Electron Limited |
| 18004643 | SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 17675633 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING SYSTEM, AND RECORDING MEDIUM | Final Rejection | Kokusai Electric Corporation |
| 18187924 | HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES IMPLEMENTING THE SAME | Non-Final OA | WOLFSPEED, INC. |
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