Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2871 2899
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17773145 | FLUID-INFUSED ENCAPSULATION OF WATER-SENSITIVE MATERIALS WITH REPLENISHABLE, MULTISCALE WATER REPELLENCY | Non-Final OA | President and Fellows of Harvard College |
| 18162144 | PACKAGED ELECTRONIC DEVICES AND METHODS OF MAKING SAME | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18513504 | MANUFACTURING METHOD OF OPTICAL MEMBER AND MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 17707157 | GLASS BRIDGE FOR CONNECTING DIES | Final Rejection | Intel Corporation |
| 17557134 | TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY | Final Rejection | Intel Corporation |
| 18497637 | PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE | Final Rejection | Micron Technology, Inc. |
| 18004643 | SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 18562502 | SUBSTRATE PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18509560 | INTEGRATED NANOSHEET MEMORY ELEMENTS, DEVICES AND METHODS | Non-Final OA | Tokyo Electron Limited |
| 18499570 | IMAGE SENSING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 18090708 | INTEGRATED CIRCUIT SUBSTRATE DESIGN WITH INTEGRATED POWER CONVERTER MODULE AND METHOD OF MANUFACTURING THEREOF | Non-Final OA | NVIDIA Corporation |
| 17675633 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING SYSTEM, AND RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 18125275 | CHIP-ON-CHIP POWER CARD HAVING IMMERSION COOLING | Final Rejection | Toyota Motor Engineering & Manufacturing North America, Inc. |
| 17987090 | MODULE PACKAGE WITH COAXIAL LEAD ASSEMBLY | Final Rejection | Qorvo US, Inc. |
| 18150406 | COOLED POWER MODULE | Non-Final OA | GM GLOBAL TECHNOLOGY OPERATIONS LLC |
| 18187924 | HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES IMPLEMENTING THE SAME | Non-Final OA | WOLFSPEED, INC. |
| 17879585 | CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION | Non-Final OA | PAC TECH - PACKAGING TECHNOLOGIES GMBH |
| 18558365 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Infovision Optoelectronic (Kunshan) Co., LTD. |
| 18546467 | ELECTRONIC COMPONENT SEALING LID | Non-Final OA | Tomoegawa Co., Ltd |
| 18074512 | SEMICONDUCTOR PACKAGE HAVING NEGATIVE PATTERNED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | JMJ Korea Co., Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy