Prosecution Insights
Prosecution Insights
15 pending office actions • 1 client • 14 examiners • 10 art units • 0 of 15 (0%) have an AI response strategy ready • 30 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 3 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 3 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 6 (40%) |
| §102 only | 4 (27%) |
| §112 only | 1 (7%) |
| Multi-statute (no §101) | 4 (27%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| BOWEN, ADAM S | 2 | 96.4% | +2.4% |
| MATTABONI, TIMOTHY JAMES | 1 | — | — |
| NUCKOLS, TIFFANY Z | 1 | 44.5% | +39.8% |
| LAOBAK, ANDREW KEELAN | 1 | 76.6% | +30.8% |
| MEHTA, RATISHA | 1 | 89.5% | +5.7% |
| SANDVIK, BENJAMIN P | 1 | 76.7% | +6.2% |
| MILLER, JR, JOSEPH ALBERT | 1 | 68.3% | +16.2% |
| AHMED, SHAMIM | 1 | 78.5% | +22.1% |
| SCHATZ, CHRISTOPHER T | 1 | 62.2% | +26.6% |
| AUGUSTINE, NICHOLAS | 1 | 73.0% | +27.5% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18597801 | THREE-DIMENSIONAL FERROELECTRIC MEMORY DEVICE AND METHODS OF FABRICATING THE SAME | BOWEN, ADAM S | — |
| 18597779 | 3D FET DEVICES AND METHODS FOR MANUFACTURING THE SAME | BOWEN, ADAM S | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18753777 | METHOD AND APPARATUS FOR DAMASCENE ETCHING | NUCKOLS, TIFFANY Z | — |
| 18607202 | HARC ETCH CHEMISTRY FOR SEMINCONDUCTORS | LAOBAK, ANDREW KEELAN | — |
| 18598907 | FERROELECTRIC 3D MEMORY BLOCK UNIT | MEHTA, RATISHA | — |
| 18530067 | COMPLIANT CHUCK EDGE RING | SCHATZ, CHRISTOPHER T | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18424262 | SELECTIVE ETCHING IN SEMICONDUCTOR DEVICES | AHMED, SHAMIM | 1d overdue |
| 18753777 | METHOD AND APPARATUS FOR DAMASCENE ETCHING | NUCKOLS, TIFFANY Z | — |
| 18607202 | HARC ETCH CHEMISTRY FOR SEMINCONDUCTORS | LAOBAK, ANDREW KEELAN | — |
| 18431887 | PLASMA PROCESSING SYSTEM WITH DIRECT CURRENT SUPERPOSITION | MILLER, JR, JOSEPH ALBERT | — |
| 18530067 | COMPLIANT CHUCK EDGE RING | SCHATZ, CHRISTOPHER T | — |
| 18389207 | SYSTEM FOR PROCESS DEVELOPMENT ASSISTANCE | AUGUSTINE, NICHOLAS | — |
| Client (Assignee) | Pending OAs |
|---|---|
| Tokyo Electron | 15 |
| Art Unit | Apps |
|---|---|
| 2897 | 3 |
| 1713 | 2 |
| 2812 | 2 |
| 1716 | 1 |
| 2817 | 1 |
| 2891 | 1 |
| 1746 | 1 |
| 2178 | 1 |
| 2899 | 1 |
| 2814 | 1 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 18786164 | METHODS FOR PROTECTING TO REUSE SILICON CARRIER WAFER BASED ON IR LASER LIFT-OFF PROCESS | Tokyo Electron Limited | MATTABONI, TIMOTHY JAMES | §103 | Non-Final OA | — | Pending | Jul 26, 2024 | |
| 18753777 | METHOD AND APPARATUS FOR DAMASCENE ETCHING | Tokyo Electron Limited | NUCKOLS, TIFFANY Z | 1716 | §102§103 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18607202 | HARC ETCH CHEMISTRY FOR SEMINCONDUCTORS | Tokyo Electron Limited | LAOBAK, ANDREW KEELAN | 1713 | §102§103§112 | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18598907 | FERROELECTRIC 3D MEMORY BLOCK UNIT | Tokyo Electron Limited | MEHTA, RATISHA | 2817 | §102§103 | Non-Final OA | — | Pending | Mar 07, 2024 |
| 18597801 | THREE-DIMENSIONAL FERROELECTRIC MEMORY DEVICE AND METHODS OF FABRICATING THE SAME | Tokyo Electron Limited | BOWEN, ADAM S | 2897 | §102 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18597779 | 3D FET DEVICES AND METHODS FOR MANUFACTURING THE SAME | Tokyo Electron Limited | BOWEN, ADAM S | 2897 | §102 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18586259 | MIXED ACTIVATING AND REDUCING AGENT FOR BONDING | Tokyo Electron Limited | SANDVIK, BENJAMIN P | 2812 | §103 | Non-Final OA | — | Pending | Feb 23, 2024 |
| 18431887 | PLASMA PROCESSING SYSTEM WITH DIRECT CURRENT SUPERPOSITION | Tokyo Electron Limited | MILLER, JR, JOSEPH ALBERT | 2891 | §102 | Final Rejection | — | Pending | Feb 02, 2024 |
| 18424262 | SELECTIVE ETCHING IN SEMICONDUCTOR DEVICES | Tokyo Electron Limited | AHMED, SHAMIM | 1713 | §103 | Non-Final OA | 1d overdue | Pending | Jan 26, 2024 |
| 18530067 | COMPLIANT CHUCK EDGE RING | Tokyo Electron Limited | SCHATZ, CHRISTOPHER T | 1746 | §102§103§112 | Non-Final OA | — | Pending | Dec 05, 2023 |
| 18389207 | SYSTEM FOR PROCESS DEVELOPMENT ASSISTANCE | Tokyo Electron Limited | AUGUSTINE, NICHOLAS | 2178 | §103 | Non-Final OA | — | Pending | Nov 13, 2023 |
| 18373098 | SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING | Tokyo Electron Limited | PATEL, REEMA | 2812 | §103 | Non-Final OA | — | Pending | Sep 26, 2023 |
| 17898104 | METHODS FOR FORMING SEMICONDUCTOR DEVICES WITH ISOLATION STRUCTURES | Tokyo Electron Limited | KIM, SU C | 2899 | §102 | Final Rejection | 22d | Pending | Aug 29, 2022 |
| 17896961 | PLASMA SURFACE TREATMENT FOR WAFER BONDING METHODS | Tokyo Electron Limited | KIM, JAHAE | 2897 | §103 | Non-Final OA | — | Pending | Aug 26, 2022 |
| 17893736 | METHOD OF MAKING A PLURALITY OF 3D SEMICONDUCTOR DEVICES WITH ENHANCED MOBILITY AND CONDUCTIVITY | Tokyo Electron Limited | BAIG, ANEESA RIAZ | 2814 | §112 | Final Rejection | 145d overdue | Pending | Aug 23, 2022 |
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