Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 39% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18158692 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18125442 | METHOD FOR PRODUCING AN APPARATUS HAVING A METAL BODY FOR COOLING A SEMICONDUCTOR ARRANGEMENT | Final Rejection | Siemens Aktiengesellschaft |
| 18060239 | LEAD FRAME APPARATUS, SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17893746 | INTEGRATED CIRCUIT HAVING AN IMPROVED METAL LAYER | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18346505 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18305577 | SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18159973 | SEMICONDUCTOR JOINING, SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18041621 | Package-on-Package Assembly with Improved Thermal Management | Final Rejection | Google LLC |
| 17957257 | EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS | Non-Final OA | Intel Corporation |
| 17696261 | TEST STRUCTURES FOR A WAFER, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS | Final Rejection | Micron Technology, Inc. |
| 17885577 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17672355 | FERROELECTRIC MEMORY DEVICE WITH LEAKAGE BARRIER LAYERS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18255415 | NATURAL CONVECTION INDUCTION HEAT SLUG DESIGN AND SEMICONDUCTOR PACKAGE EQUIPPED WITH THE SAME | Non-Final OA | TELECHIPS INC. |
| 18162718 | SEMICONDUCTOR STRUCTURE FOR 3D MEMORY AND MANUFACTURING METHOD THEREOF | Final Rejection | MACRONIX International Co., Ltd. |
| 17930450 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | MACRONIX INTERNATIONAL CO., LTD. |
| 17994382 | SEMICONDUCTOR DEVICE | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 17958965 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES | Final Rejection | Amkor Technology Singapore Holding Pte. Ltd. |
| 18116269 | PACKAGE STRUCTURE | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 17889395 | DEEP TRENCH CAPACITOR BRIDGE FOR MULTI-CHIP PACKAGE | Non-Final OA | Altera Corporation |
| 17823430 | STACKED STRUCTURE WITH INTERPOSER | Non-Final OA | INVENSAS LLC |
| 17691934 | MONOLITHIC COLOR-TUNABLE LIGHT EMITTING DIODES AND METHODS THEREOF | Non-Final OA | INNOVATION SEMICONDUCTOR |
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