Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 48% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18422406 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18158692 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17896534 | PHOTODIODE AND ELECTRONIC DEVICE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17690376 | TWO-DIMENSIONAL MATERIAL STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE TWO-DIMENSIONAL MATERIAL STRUCTURE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18041621 | Package-on-Package Assembly with Improved Thermal Management | Final Rejection | Google LLC |
| 17810901 | Semiconductor Device and Method of Heat Dissipation Using Graphene | Final Rejection | STATS ChipPAC Pte. Ltd. |
| 18759372 | PACKAGE COMPRISING A PASSIVE DEVICE WITH VARIABLE SIZED BUMP INTERCONNECTS | Non-Final OA | QUALCOMM Incorporated |
| 17350184 | MILLIMETER WAVE COMPONENTS IN A GLASS CORE OF A SUBSTRATE | Final Rejection | Intel Corporation |
| 17889395 | DEEP TRENCH CAPACITOR BRIDGE FOR MULTI-CHIP PACKAGE | Final Rejection | Altera Corporation |
| 18346505 | SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 17996604 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 17897737 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18060239 | LEAD FRAME APPARATUS, SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17893746 | INTEGRATED CIRCUIT HAVING AN IMPROVED METAL LAYER | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17812141 | MICROELECTRONIC DEVICES WITH CONTACTS EXTENDING THROUGH METAL OXIDE REGIONS OF STEP TREADS, AND RELATED SYSTEMS AND METHODS | Non-Final OA | Micron Technology, Inc. |
| 17696261 | TEST STRUCTURES FOR A WAFER, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS | Non-Final OA | Micron Technology, Inc. |
| 17891439 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17886466 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17885577 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17809432 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18829633 | MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 17981906 | COMPOSITE CATHODE CONTACT WITH SPACER LAYER FOR MONOLITHICALLY INTEGRATED MICRO-LEDS, MINI-LEDS, AND LED ARRAYS | Final Rejection | Lumileds LLC |
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