Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 52% of resolved cases
Michael Anguiano serves in Tech Center 2800 within Art Unit 2899. The examiner has 27 resolved cases with an allowance rate of 51.9 percent. This indicates that about half of the applications are allowed. The median days to allowance for these cases is 1313, which practitioners should use to set timeline expectations for their clients.
The interview lift is 19.9 percent, suggesting that conducting an interview is a beneficial strategy that improves the 51.9 percent baseline allowance rate. For practitioners, the 19.9 percent lift indicates that direct engagement can be effective in resolving outstanding issues. With 27 resolved cases, the data provides an initial look at the examiner's tendencies. Managing the 1313-day median pendency may be more successful through an interview, as it offers a statistical advantage in Art Unit 2899.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18666962 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18158692 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18041621 | Package-on-Package Assembly with Improved Thermal Management | Final Rejection | Google LLC |
| 18759372 | PACKAGE COMPRISING A PASSIVE DEVICE WITH VARIABLE SIZED BUMP INTERCONNECTS | Non-Final OA | QUALCOMM Incorporated |
| 18188577 | STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY | Non-Final OA | Intel Corporation |
| 17957257 | EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS | Final Rejection | Intel Corporation |
| 17350184 | MILLIMETER WAVE COMPONENTS IN A GLASS CORE OF A SUBSTRATE | Final Rejection | Intel Corporation |
| 18798770 | POWER MODULES | Non-Final OA | Kia Corporation |
| 18346505 | SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18663782 | MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18829737 | NANOSHEET DEVICE BACKSIDE CONNECTING TO BOTH VDD AND VSS AT THE SAME LEVEL | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17897737 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 17896329 | THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | SK hynix Inc. |
| 18830312 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PATTERN FORMING METHOD | Non-Final OA | Kioxia Corporation |
| 18829633 | MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18060239 | LEAD FRAME APPARATUS, SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17893746 | INTEGRATED CIRCUIT HAVING AN IMPROVED METAL LAYER | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17940715 | ACCESS CIRCUITRY STRUCTURES FOR THREE-DIMENSIONAL MEMORY ARRAY | Final Rejection | Micron Technology, Inc. |
| 17886466 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17885577 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18594527 | BARRIER ENCAPSULATION FOR ORGANIC LIGHT-EMITTING DIODES | Non-Final OA | Applied Materials, Inc. |
| 17931256 | ELECTRONIC APPARATUS | Non-Final OA | ROHM Co., LTD. |
| 18676665 | CHIP COMPLEX WITH EMBEDDED INTERPOSER | Non-Final OA | Advanced Micro Devices, Inc. |
| 18090055 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 17958965 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES | Final Rejection | Amkor Technology Singapore Holding Pte. Ltd. |
| 18085684 | EDGE-STRUCTURED LEADFRAME FOR EMBEDDED DIE PACKAGING OF POWER SEMICONDUCTOR DEVICES | Final Rejection | Infineon Technologies Canada Inc. |
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