Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 78% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18027553 | LIGHT EMITTING DIODE CHIP, DISPLAY SUBSTRATE AND DISPLAY DEVICE | Final Rejection | BOE Technology Group Co., Ltd. |
| 17990142 | SEMICONDUCTOR DEVICE INCLUDING A TRENCH GATE STRUCTURE | Non-Final OA | Infineon Technologies AG |
| 18305387 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18160198 | SILICON CARBIDE SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 17846461 | SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18472470 | SPACER MODIFICATION FOR SELECTIVE AIRGAP SPACER FORMATION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17808568 | CONTACTS FOR STACKED FIELD EFFECT TRANSISTOR | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18122714 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 18089604 | MODULATION DEVICE | Final Rejection | Innolux Corporation |
| 17890041 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18153674 | METHOD OF MANUFACTURING GALLIUM NITRIDE SUBSTRATE | Non-Final OA | National University Corporation Tokai National Higher Education and Research System |
| 17808320 | METHOD OF MANUFACTURING CHIPS | Non-Final OA | DISCO CORPORATION |
| 18192653 | DISPLAY PANEL | Non-Final OA | Guangzhou China Star Optoelectronics Semiconductor Display Technology Co., LTd. |
| 18263802 | METHOD FOR PREPARING THE RESIDUE OF A DONOR SUBSTRATE, A LAYER OF WHICH HAS BEEN REMOVED BY DELAMINATION | Final Rejection | Soitec |
| 18200683 | PHOTODETECTORS WITH ONE OR MORE CONFINING FEATURES | Final Rejection | GlobalFoundries U.S. Inc. |
| 18271919 | SOLID OXYGEN IONIC CONDUCTOR BASED FIELD-EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA |
| 18177130 | WAFER AND METHOD OF PROCESSING WAFER | Final Rejection | GlobalWafers Co., Ltd. |
| 18326077 | INSULATED GATE BIPOLAR TRANSISTOR AND METHOD OF MANUFACTURING SAME | Final Rejection | DB HiTek Co., Ltd. |
| 18025030 | DEVICE HAVING FERROELECTRIC OR NEGATIVE CAPACITANCE MATERIAL AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS | Non-Final OA | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| 18011544 | Manufacturing Method of Display Panel and Display Panel | Non-Final OA | Shenzhen China Star Optoelectronics Semiconductor Display Techonology Co., Ltd. |
| 17776648 | METHOD AND CARRIER ELEMENT FOR PRODUCING A WAFER LAYER | Non-Final OA | NexWafe GmbH |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy