Tech Center 2800 • Art Units: 2818
This examiner grants 81% of resolved cases
Ian Isaac Degrasse is in Tech Center 2800, Art Unit 2818. He has 26 resolved cases. His allowance rate is 80.8 percent. The median days to allowance is 1299, which is the timeframe for reaching a grant.
The interview lift is 1.8 percent. This 1.8 percent lift suggests that interviews have almost no impact on the outcome, likely because the 80.8 percent allowance rate is already high. The 1299 days to allowance is the median time for his cases.
In Art Unit 2818, the 26 resolved cases and 80.8 percent allowance rate indicate a favorable environment. The 1.8 percent interview lift and 1299 days to allowance suggest that applications often succeed without an interview. The 80.8 percent rate is the dominant metric.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18678374 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18485378 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18200609 | CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17963382 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 17954681 | DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17900742 | DISPLAY DEVICE AND TILED DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 17890041 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18194452 | LIGHT EMITTING MODULE WITH INTEGRATED LAMP AND DRIVER AND DISPLAY DEVICE | Final Rejection | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18122714 | ELECTRONIC DEVICE | Final Rejection | InnoLux Corporation |
| 18347583 | ELECTRONIC DEVICE | Final Rejection | CARUX TECHNOLOGY PTE. LTD. |
| 18799825 | METHOD FOR PRODUCING A MICROELECTRONIC DEVICE COMPRISING A WRAPPING GRID | Non-Final OA | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18485181 | DEVICE FOR ACQUIRING A 2D IMAGE AND A DEPTH IMAGE OF A SCENE | Final Rejection | Commissariat à I'Énergie Atomique et aux Énergies Alternatives |
| 18760977 | PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM, AND MOVING BODY | Non-Final OA | CANON KABUSHIKI KAISHA |
| 19088493 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC GATE WALL AND DIELECTRIC GATE PLUG | Non-Final OA | Intel Corporation |
| 17559342 | FORMATION OF CAVITY SPACER AND SOURCE-DRAIN EPITAXIAL GROWTH FOR SCALING OF GATE-ALL-AROUND TRANSISTORS | Final Rejection | Intel Corporation |
| 18664558 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18280207 | SILICON CARBIDE SUBSTRATE AND METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE | Non-Final OA | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 18517129 | EXTENDED BACKSIDE CONTACT FOR STACKED FIELD-EFFECT TRANSISTOR | Final Rejection | International Business Machines Corporation |
| 18472470 | SPACER MODIFICATION FOR SELECTIVE AIRGAP SPACER FORMATION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17808568 | CONTACTS FOR STACKED FIELD EFFECT TRANSISTOR | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18137782 | WIDE BAND GAP SEMICONDUCTOR DEVICE | Non-Final OA | Infineon Technologies AG |
| 18679248 | DESTRESSING STRUCTURE FOR SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | STMicroelectronics International N.V. |
| 17745562 | EXTREME ULTRAVIOLET MASK WITH CAPPING LAYER | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17902551 | SiC MOSFET Including Trench with Rounded Corners | Non-Final OA | Applied Materials, Inc. |
| 18013569 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER STRUCTURAL OBJECT | Final Rejection | ROHM CO., LTD. |
| 18215675 | INTEGRATED CIRCUIT LOW CAPACITANCE ELECTROSTATIC DISCHARGE DIODES | Non-Final OA | Advanced Micro Devices, Inc. |
| 18751347 | DISPLAY DEVICE | Non-Final OA | AUO Corporation |
| 18256910 | WAFER-LEVEL MANUFACTURE OF OPTICAL PACKAGES | Non-Final OA | ams-OSRAM Asia Pacific Pte. Ltd. |
| 18836429 | INCREASING AVALANCHE PROBABILITY IN PHOTODIODES | Non-Final OA | SRI International |
| 17846461 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
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