Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 79% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18678374 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18607849 | CHIP-ON-FILM PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18485378 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18200609 | CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18086225 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY MODULE COMPRISING SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18027553 | LIGHT EMITTING DIODE CHIP, DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 17890041 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 17963382 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 17954681 | DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18609837 | PACKAGE COMPRISING AN EMBEDDED HEAT PIPE | Non-Final OA | QUALCOMM Incorporated |
| 19088493 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC GATE WALL AND DIELECTRIC GATE PLUG | Non-Final OA | Intel Corporation |
| 17559342 | FORMATION OF CAVITY SPACER AND SOURCE-DRAIN EPITAXIAL GROWTH FOR SCALING OF GATE-ALL-AROUND TRANSISTORS | Final Rejection | Intel Corporation |
| 17482228 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC GATE WALL AND DIELECTRIC GATE PLUG | Non-Final OA | Intel Corporation |
| 18608394 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18200886 | METHOD OF FABRICATING A WAFER STACK AND WAFER STACK PRODUCED THEREBY | Non-Final OA | Taiwan Semiconductor Manufacturing Company LTD |
| 17745562 | EXTREME ULTRAVIOLET MASK WITH CAPPING LAYER | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17651335 | Packages With Deep Bond Pads and Method Forming Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18751347 | DISPLAY DEVICE | Non-Final OA | AUO Corporation |
| 17902551 | SiC MOSFET Including Trench with Rounded Corners | Non-Final OA | Applied Materials, Inc. |
| 18137782 | WIDE BAND GAP SEMICONDUCTOR DEVICE | Non-Final OA | Infineon Technologies AG |
| 17990142 | SEMICONDUCTOR DEVICE INCLUDING A TRENCH GATE STRUCTURE | Final Rejection | Infineon Technologies AG |
| 18215675 | INTEGRATED CIRCUIT LOW CAPACITANCE ELECTROSTATIC DISCHARGE DIODES | Final Rejection | Advanced Micro Devices, Inc. |
| 18679248 | DESTRESSING STRUCTURE FOR SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | STMicroelectronics International N.V. |
| 17808568 | CONTACTS FOR STACKED FIELD EFFECT TRANSISTOR | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18280207 | SILICON CARBIDE SUBSTRATE AND METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE | Non-Final OA | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 18347583 | ELECTRONIC DEVICE | Final Rejection | CARUX TECHNOLOGY PTE. LTD. |
| 17808320 | METHOD OF MANUFACTURING CHIPS | Non-Final OA | DISCO CORPORATION |
| 18305387 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 17846461 | SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 17857065 | Static random access memory array pattern | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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