Prosecution Insights
Last updated: October 02, 2026

Examiner: DEGRASSE, IAN ISAAC

Tech Center 2800 • Art Units: 2818

This examiner grants 81% of resolved cases

Analysis

Ian Isaac Degrasse is in Tech Center 2800, Art Unit 2818. He has 26 resolved cases. His allowance rate is 80.8 percent. The median days to allowance is 1299, which is the timeframe for reaching a grant.

The interview lift is 1.8 percent. This 1.8 percent lift suggests that interviews have almost no impact on the outcome, likely because the 80.8 percent allowance rate is already high. The 1299 days to allowance is the median time for his cases.

In Art Unit 2818, the 26 resolved cases and 80.8 percent allowance rate indicate a favorable environment. The 1.8 percent interview lift and 1299 days to allowance suggest that applications often succeed without an interview. The 80.8 percent rate is the dominant metric.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

80.8%
Allow Rate
+12.8% vs TC avg
78
Total Applications
+1.8%
Interview Lift
1299
Avg Prosecution Days
Based on 26 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
29.0%
§102 Novelty
58.0%
§103 Obviousness
13.0%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18678374 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18485378 SEMICONDUCTOR PACKAGE Non-Final OA Samsung Electronics Co., Ltd.
18200609 CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
17963382 DISPLAY DEVICE Non-Final OA Samsung Display Co., Ltd.
17954681 DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE Non-Final OA Samsung Display Co., LTD.
17900742 DISPLAY DEVICE AND TILED DISPLAY DEVICE INCLUDING THE SAME Non-Final OA Samsung Display Co., LTD.
17890041 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Final Rejection TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
18194452 LIGHT EMITTING MODULE WITH INTEGRATED LAMP AND DRIVER AND DISPLAY DEVICE Final Rejection WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
18122714 ELECTRONIC DEVICE Final Rejection InnoLux Corporation
18347583 ELECTRONIC DEVICE Final Rejection CARUX TECHNOLOGY PTE. LTD.
18799825 METHOD FOR PRODUCING A MICROELECTRONIC DEVICE COMPRISING A WRAPPING GRID Non-Final OA COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
18485181 DEVICE FOR ACQUIRING A 2D IMAGE AND A DEPTH IMAGE OF A SCENE Final Rejection Commissariat à I'Énergie Atomique et aux Énergies Alternatives
18760977 PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM, AND MOVING BODY Non-Final OA CANON KABUSHIKI KAISHA
19088493 INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC GATE WALL AND DIELECTRIC GATE PLUG Non-Final OA Intel Corporation
17559342 FORMATION OF CAVITY SPACER AND SOURCE-DRAIN EPITAXIAL GROWTH FOR SCALING OF GATE-ALL-AROUND TRANSISTORS Final Rejection Intel Corporation
18664558 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Non-Final OA Semiconductor Energy Laboratory Co., Ltd.
18280207 SILICON CARBIDE SUBSTRATE AND METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE Non-Final OA SUMITOMO ELECTRIC INDUSTRIES, LTD.
18517129 EXTENDED BACKSIDE CONTACT FOR STACKED FIELD-EFFECT TRANSISTOR Final Rejection International Business Machines Corporation
18472470 SPACER MODIFICATION FOR SELECTIVE AIRGAP SPACER FORMATION Non-Final OA INTERNATIONAL BUSINESS MACHINES CORPORATION
17808568 CONTACTS FOR STACKED FIELD EFFECT TRANSISTOR Non-Final OA INTERNATIONAL BUSINESS MACHINES CORPORATION
18137782 WIDE BAND GAP SEMICONDUCTOR DEVICE Non-Final OA Infineon Technologies AG
18679248 DESTRESSING STRUCTURE FOR SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME Non-Final OA STMicroelectronics International N.V.
17745562 EXTREME ULTRAVIOLET MASK WITH CAPPING LAYER Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
17902551 SiC MOSFET Including Trench with Rounded Corners Non-Final OA Applied Materials, Inc.
18013569 SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER STRUCTURAL OBJECT Final Rejection ROHM CO., LTD.
18215675 INTEGRATED CIRCUIT LOW CAPACITANCE ELECTROSTATIC DISCHARGE DIODES Non-Final OA Advanced Micro Devices, Inc.
18751347 DISPLAY DEVICE Non-Final OA AUO Corporation
18256910 WAFER-LEVEL MANUFACTURE OF OPTICAL PACKAGES Non-Final OA ams-OSRAM Asia Pacific Pte. Ltd.
18836429 INCREASING AVALANCHE PROBABILITY IN PHOTODIODES Non-Final OA SRI International
17846461 SEMICONDUCTOR DEVICE Non-Final OA FUJI ELECTRIC CO., LTD.

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