Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 90% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18485558 | SEMICONDUCTOR MEMORY DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18240017 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18299117 | IMAGE SENSORS HAVING GRATING STRUCTURES THEREIN THAT PROVIDE ENHANCED DIFFRACTION OF INCIDENT LIGHT | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18198043 | MEMORY DEVICE WITH HIGH-MOBILITY OXIDE SEMICONDUCTOR CHANNEL AND METHODS FOR FORMING THE SAME | Non-Final OA | Applied Materials, Inc. |
| 17955187 | SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS | Non-Final OA | Intel Corporation |
| 17485185 | THIN FILM TRANSISTORS HAVING CMOS FUNCTIONALITY INTEGRATED WITH 2D CHANNEL MATERIALS | Final Rejection | Intel Corporation |
| 18312726 | RESISTOR STRUCTURE HAVING CAVITIES FOR INCREASED RESISTOR PERFORMANCE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18299199 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18128601 | INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18149215 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17818607 | TRANSISTOR HEAT DISSIPATION STRUCTURE | Non-Final OA | NXP B.V. |
| 18251781 | BACKSIDE ILLUMINATED IMAGE SENSOR SUBSTRATE AND METHOD FOR MANUFACTURING BACKSIDE ILLUMINATED IMAGE SENSOR | Non-Final OA | WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. |
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