Tech Center 2800 • Art Units: 2817
This examiner grants 75% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18195074 | SEMICONDUCTOR DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18188311 | THREE DIMENSIONAL NON-VOLATILE MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17852614 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17830488 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18550281 | SEMICONDUCTOR DEVICE AND IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17863656 | CONDUCTIVE OXIDE SILICIDES FOR RELIABLE LOW CONTACT RESISTANCE | Final Rejection | Applied Materials, Inc. |
| 17542377 | GATE ALL AROUND SEMICONDUCTOR DEVICE WITH STRAINED CHANNELS | Non-Final OA | International Business Machines Corporation |
| 18323688 | LAYOUT OF SCRIBE LINE FEATURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18318726 | METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING CRYSTALLINE SEMICONDUCTOR FILM | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18308026 | DIELECTRIC GAS SPACER FORMATION FOR REDUCING PARASITIC CAPACITANCE IN A TRANSISTOR INCLUDING NANOSHEET STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18166730 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18150809 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 17858056 | INTERFACE FOR A SEMICONDUCTOR CHIP WITH ADAPTIVE VIA REGION ARRANGEMENT AND SEMICONDUCTOR DEVICE WITH STACKED SEMICONDUCTOR CHIPS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18347404 | SEMICONDUCTOR DEVICE INCLUDING METAL INTERCONNECT STRUCTURES THAT CONTAIN SELECTIVELY-GROWN DIELECTRIC SPACERS AND METHODS FOR FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 17557290 | ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE | Final Rejection | Intel Corporation |
| 18258380 | METHOD FOR PRODUCING A III-N MATERIAL-BASED LAYER | Non-Final OA | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18186237 | SEMICONDUCTOR DEVICE | Final Rejection | Kioxia Corporation |
| 18175873 | SEMICONDUCTOR MEMORY DEVICE | Final Rejection | Kioxia Corporation |
| 18058956 | NANOSTRUCTURE-BASED SUBSTRATE FOR SURFACE-ENHANCED RAMAN SPECTROSCOPY, AND MANUFACTURING METHOD THEREFOR | Non-Final OA | UNIVERSITY OF ULSAN FOUNDATION FOR INDUSTRY COOPERATION |
| 18050753 | THIN-FILM TRANSISTOR HAVING VERTICAL STRUCTURE AND ELECTRONIC DEVICE | Final Rejection | WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 18277564 | COMPOUND SEMICONDUCTOR LAYERED STRUCTURE AND PROCESS FOR PREPARING THE SAME | Non-Final OA | UMICORE |
| 18338415 | METHODS FOR MAKING SEMICONDUCTOR DEVICES WITH SUPERLATTICE AND EMBEDDED QUANTUM DOTS | Final Rejection | ATOMERA INCORPORATED |
| 18078075 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Fujian Jinhua Integrated Circuit Co., Ltd. |
| 18277360 | A METHOD FOR THE MANUFACTURE OF AN IMPROVED GRAPHENE SUBSTRATE AND APPLICATIONS THEREFOR | Final Rejection | Paragraf Limited |
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