Prosecution Insights
Last updated: August 18, 2026

Examiner: NGUYEN, THANH T

Tech Center 2800 • Art Units: 2144 2444 2448 2813 2893

This examiner grants 83% of resolved cases

Performance Statistics

83.3%
Allow Rate
+15.3% vs TC avg
1,441
Total Applications
+14.1%
Interview Lift
1020
Avg Prosecution Days
Based on 1416 resolved cases, 2023–2026

Rejection Statute Breakdown

3.7%
§101 Eligibility
26.3%
§102 Novelty
54.6%
§103 Obviousness
5.8%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18462010 SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
17959812 INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18060596 THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING Final Rejection Intel Corporation
17031719 3D HETEROGENEOUS INTEGRATED CRYSTALLINE PIEZOELECTRIC BULK ACOUSTIC RESONATORS Non-Final OA Intel Corporation
18064815 INTERCONNECT STRUCTURES Non-Final OA ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
18501108 PACKAGE ON PACKAGE SEMICONDUCTOR DEVICE WITH INTEGRATED WAVEGUIDE AND METHOD THEREFOR Non-Final OA NXP USA, INC.
18103676 SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18482632 INTEGRATED CIRCUIT PACKAGES AND METHODS Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18462499 FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF Non-Final OA Taiwan Semiconductor Manufacturing co., Ltd.
18242812 CORRECTION OF GLOBAL CURVATURE DURING STRESS MANAGEMENT Final Rejection Applied Materials, Inc.
18429479 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Non-Final OA Tokyo Electron Limited
18456647 SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE Non-Final OA FUJI ELECTRIC CO., LTD.
18458633 SEMICONDUCTOR DEVICE AND METHOD FORMING THE SAME Final Rejection Winbond Electronics Corp.
18319591 CARRIER SUBSTRATE Non-Final OA SILICONWARE PRECISION INDUSTRIES CO., LTD.
17968349 ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF Non-Final OA SILICONWARE PRECISION INDUSTRIES CO., LTD.

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