Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2144 2444 2448 2813 2893
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17959812 | INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18345939 | SUBSTRATE CONTACT INTEGRATION IN GALLIUM NITRIDE DEVICES | Non-Final OA | Texas Instruments Incorporated |
| 18308303 | LASER DICING TO CONTROL SPLASH | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18128506 | SEMICONDUCTOR DEVICE COMPRISING CONTACT PAD STRUCTURE | Non-Final OA | Infineon Technologies AG |
| 18456647 | SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18216328 | Three Dimensional Crackstop Interweave Architectural Design Using Supervia. | Non-Final OA | International Business Machines Corporation |
| 18053772 | INTERCONNECT STRUCTURE WITH SKIPVIA | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18060596 | THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING | Non-Final OA | Intel Corporation |
| 17031719 | 3D HETEROGENEOUS INTEGRATED CRYSTALLINE PIEZOELECTRIC BULK ACOUSTIC RESONATORS | Non-Final OA | Intel Corporation |
| 17682514 | ELECTRONIC DEVICES INCLUDING PILLARS INCLUDING A MEMORY MATERIAL, AND RELATED MEMORY DEVICES, SYSTEMS, AND METHODS | Non-Final OA | Micron Technology, Inc. |
| 18493634 | BOTTOM CHANNEL TRENCH ISOLATED GATE ALL AROUND (GAA) FIELD EFFECT TRANSISTOR (FET) | Non-Final OA | QUALCOMM Incorporated |
| 18365791 | MODIFIED REVERSE SELECTIVE BARRIER STRUCTURE | Non-Final OA | QUALCOMM Incorporated |
| 17938999 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 17884817 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18549610 | SEMICONDUCTOR CHIP MANUFACTURING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18363096 | INTEGRATED CIRCUIT PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18444826 | BACKSIDE AND SIDEWALL METALLIZATION OF SEMICONDUCTOR DEVICES | Final Rejection | NXP B.V. |
| 18108587 | Chip Package Based On Through-Silicon-Via Connector And Silicon Interconnection Bridge | Non-Final OA | iCometrue Company Ltd. |
| 17814750 | POWER DEVICE INCLUDING METAL LAYER | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18319591 | CARRIER SUBSTRATE | Final Rejection | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18458633 | SEMICONDUCTOR DEVICE AND METHOD FORMING THE SAME | Non-Final OA | Winbond Electronics Corp. |
| 18587291 | HYBRID PANEL METHOD OF MANUFACTURING ELECTRONIC DEVICES AND ELECTRONIC DEVICES MANUFACTURED THEREBY | Final Rejection | Amkor Technology Portugal, S.A. |
| 18064815 | INTERCONNECT STRUCTURES | Final Rejection | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
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