Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2144 2444 2448 2813 2893
This examiner grants 83% of resolved cases
Thanh T. Nguyen serves as an examiner in Tech Center 2800 and Art Unit 2144. He has managed 1423 resolved cases, establishing a clear record of outcomes for practitioners to analyze. The allowance rate for these cases is 83.3%, which reflects the proportion of applications that successfully result in a patent grant. This 83.3% rate suggests a favorable environment for applicants seeking protection in Art Unit 2144.
The median days to allowance is 1021. This 1021-day figure provides a timeline for the duration of the examination process for successful applications. A median of 1021 days indicates the expected path to a grant in Tech Center 2800. Applicants can use this 1021-day metric to plan their intellectual property strategy and manage expectations regarding the speed of resolution.
The data highlights an interview lift of 14.3%. This 14.3% lift represents the increase in the allowance rate when an interview is conducted. While the base allowance rate of 83.3% is already high, the 14.3% lift shows that direct communication remains a useful tactic for resolving any remaining issues. Practitioners should consider the 14.3% lift as a supplemental strategy to ensure a successful outcome within the 1021-day median timeframe.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18444826 | BACKSIDE AND SIDEWALL METALLIZATION OF SEMICONDUCTOR DEVICES | Final Rejection | NXP B.V. |
| 18588698 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18433990 | DISPLAY APPARATUS AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18060596 | THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION BONDING | Non-Final OA | Intel Corporation |
| 17031719 | 3D HETEROGENEOUS INTEGRATED CRYSTALLINE PIEZOELECTRIC BULK ACOUSTIC RESONATORS | Non-Final OA | Intel Corporation |
| 18345939 | SUBSTRATE CONTACT INTEGRATION IN GALLIUM NITRIDE DEVICES | Final Rejection | Texas Instruments Incorporated |
| 18308303 | LASER DICING TO CONTROL SPLASH | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18684591 | IN-SITU CORE PROTECTION IN MULTI-PATTERNING | Non-Final OA | Lam Research Corporation |
| 18420232 | MICRO-ELECTROMECHANICAL MICROPHONES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18103676 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18482632 | INTEGRATED CIRCUIT PACKAGES AND METHODS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18462499 | FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing co., Ltd. |
| 18429479 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18456647 | SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18458633 | SEMICONDUCTOR DEVICE AND METHOD FORMING THE SAME | Final Rejection | Winbond Electronics Corp. |
| 17814750 | POWER DEVICE INCLUDING METAL LAYER | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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