Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2822 2898
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17987378 | APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17879460 | Technique for Forming Cubic Silicon Carbide and Heterojunction Silicon Carbide Device | Final Rejection | Infineon Technologies AG |
| 17632340 | Display Device and Electronic Device | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 17968201 | METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE | Final Rejection | Applied Materials, Inc. |
| 18363841 | POSITION DETERMINING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18090471 | PROCESSES AND APPLICATIONS FOR CATALYST INFLUENCED CHEMICAL ETCHING | Non-Final OA | Board of Regents, The University of Texas System |
| 18010456 | PROCESSES AND APPLICATIONS FOR CATALYST INFLUENCED CHEMICAL ETCHING | Non-Final OA | Board of Regents, The University of Texas System |
| 18002525 | Method for Manufacturing Semiconductor Device | Final Rejection | NTT, Inc. |
| 17768709 | Optical Communication Element | Final Rejection | NTT, Inc. |
| 18328988 | VERIFICATION METHOD FOR DEVICE CHIPS | Non-Final OA | DISCO CORPORATION |
| 18328310 | METHOD OF HANDLING WAFER | Non-Final OA | DISCO CORPORATION |
| 18321411 | MANUFACTURING METHOD OF CHIPS | Non-Final OA | DISCO CORPORATION |
| 18490923 | PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18093477 | THIN-FILM TRANSISTOR, THIN-FILM TRANSISTOR ARRAY, AND METHOD OF PRODUCING THIN-FILM TRANSISTOR | Final Rejection | TOPPAN Inc. |
| 18237195 | TRANSISTOR WITH THERMAL PLUG | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18184078 | MEMORY DEVICE AND METHOD FOR FORMING THE SAME | Final Rejection | MACRONIX INTERNATIONAL CO., LTD. |
| 18420779 | WAFER WITH TEST STRUCTURE AND METHOD OF DICING WAFER | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 17674796 | SEMICONDUCTOR STRUCTURE WITH BACKSIDE THROUGH SILICON VIAS AND METHOD OF OBTAINING DIE IDS THEREOF | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 17990567 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD |
| 17750953 | SELECTIVE REMOVAL OF SEMICONDUCTOR FINS | Final Rejection | Adeia Semiconductor Solutions LLC |
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