Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2822 2898 4100
This examiner grants 76% of resolved cases
Erik T Peterson is an examiner in Art Unit 2822 within Tech Center 4100. The examiner has 370 resolved cases and an allowance rate of 76.5 percent. This suggests a high likelihood of success for applications in this unit. The examiner's record provides a basis for understanding prosecution trends in this unit.
The interview lift is 11.0 percent, indicating that interviews are a helpful strategy for increasing the chances of allowance compared to the baseline rate of 76.5 percent. Practitioners should consider this to resolve any outstanding issues. The median time to allowance for successful applications is 952 days. This pendency figure provides a timeline for the expected duration of prosecution.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18620416 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18431190 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18233486 | SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR CHIP SPLIT BY THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18293487 | LIGHT EMITTING ELEMENT, DISPLAY SUBSTRATE, AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18575185 | DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 17987378 | APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18531070 | POWER MODULE FOR A VEHICLE | Non-Final OA | Robert Bosch GmbH |
| 18755987 | LAYOUT DESIGN SPECIFICATIONS AND METHODOLOGY FOR GENERATING SEMICONDUCTOR CHIP METAL INTERCONNECT LAYOUT FABRICS | Non-Final OA | Intel Corporation |
| 17632340 | Display Device and Electronic Device | Final Rejection | Semiconductor Energy Laboratory Co., Ltd. |
| 18822954 | METHOD FOR SINGULATING A SEMICONDUCTOR COMPONENT HAVING A PN JUNCTION AND SEMICONDUCTOR COMPONENT HAVING A PN JUNCTION | Non-Final OA | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
| 18002525 | Method for Manufacturing Semiconductor Device | Non-Final OA | NTT, Inc. |
| 17768709 | Optical Communication Element | Non-Final OA | NTT, Inc. |
| 18597807 | PINWHEEL-SHAPED CONNECTIONS BETWEEN DIAGONALLY OPPOSITE INTEGRATED CIRCUITS IN A MULTI-CHIP MODULE TO REDUCE NUMBER OF ROUTING LAYERS | Non-Final OA | International Business Machines Corporation |
| 17946471 | WAFER, ELECTRONIC COMPONENT AND METHOD USING LINED AND CLOSED SEPARATION TRENCH | Non-Final OA | Infineon Technologies AG |
| 18777380 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SK Hynix Inc. |
| 18087811 | METHOD OF MANUFACTURING SEMICONDUCTOR CHIP INCLUDING FORMING DICING GROOVES AND SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc |
| 18060305 | LASER DICING TO CONTROL SPLASH | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18767722 | ION IMPLANT PROCESS FOR DEFECT ELIMINATION IN METAL LAYER PLANARIZATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18618312 | HYBRID BULK SEMICONDUCTOR AND SEMICONDUCTOR ON INSULATOR (SOI) SUBSTRATE AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18425352 | SEMICONDUCTOR STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18109116 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18132324 | PROCESSES AND APPLICATIONS FOR CATALYST INFLUENCED CHEMICAL ETCHING | Non-Final OA | Board of Regents, The University of Texas System |
| 18010456 | PROCESSES AND APPLICATIONS FOR CATALYST INFLUENCED CHEMICAL ETCHING | Final Rejection | Board of Regents, The University of Texas System |
| 18328988 | VERIFICATION METHOD FOR DEVICE CHIPS | Final Rejection | DISCO CORPORATION |
| 18321411 | MANUFACTURING METHOD OF CHIPS | Final Rejection | DISCO CORPORATION |
| 18178794 | CHIP MANUFACTURING METHOD | Non-Final OA | DISCO CORPORATION |
| 18168827 | WAFER PROCESSING METHOD | Non-Final OA | DISCO CORPORATION |
| 18204398 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18415955 | STRUCTURE WITH TWO WORK FUNCTION METALS OVER CONDUCTIVE BRIDGE, AND METHOD TO FORM SAME | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18237195 | TRANSISTOR WITH THERMAL PLUG | Non-Final OA | GlobalFoundries U.S. Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy