Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2828 2899
This examiner grants 76% of resolved cases
Cristian Alexandru Tivarus manages cases in Art Unit 2828 of Tech Center 2800, with 50 resolved cases. The examiner has an allowance rate of 76.0 percent. The median time to reach an allowance is 1250 days, which applicants should factor into their prosecution strategy.
The interview lift is quite high at 26.1 percent, indicating that verbal advocacy is very successful with this examiner. This lift suggests that direct interaction can significantly improve the 76.0 percent baseline chance of a grant. Practitioners should prioritize interviews to navigate the relatively long 1250 day prosecution timeline. With 50 cases resolved, the 26.1 percent lift is a strong signal that the examiner is receptive to resolving issues through direct dialogue.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18685106 | DISPLAY DEVICE | Non-Final OA | LG ELECTRONICS INC. |
| 18800320 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18533899 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18338037 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18580096 | ENCAPSULATION SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND FUNCTIONAL SUBSTRATE AND MANUFACTURING METHOD THEREOF | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18756147 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17938132 | POWER AMPLIFIER PACKAGES CONTAINING ELECTRICALLY-ROUTED LIDS AND METHODS FOR THE FABRICATION THEREOF | Final Rejection | NXP USA, Inc. |
| 18355245 | HEAT DISSIPATION DEVICE FOR A CONVERTER FOR A VEHICLE, POWER CONVERTER, ELECTRIC AXLE DRIVE, VEHICLE AND METHOD FOR PRODUCING A HEAT DISSIPATION DEVICE | Final Rejection | ZF Friedrichshafen AG |
| 18406871 | INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER | Final Rejection | QUALCOMM Incorporated |
| 18219018 | INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL INTERPOSER | Non-Final OA | Intel Corporation |
| 17482681 | MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES | Final Rejection | Intel Corporation |
| 18777790 | METHOD FOR FORMING SILICON NITRIDE FILM SELECTIVELY ON SIDEWALLS OF TRENCHES | Non-Final OA | ASM IP Holding B.V. |
| 18129567 | EMBEDDED COOLING SYSTEMS FOR DEVICE PACKAGES AND METHODS OF COOLING PACKAGED DEVICES | Final Rejection | Adeia Semiconductor Bonding Technologies Inc. |
| 18711091 | METHOD FOR MARKING SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR CHIP | Non-Final OA | Mitsubishi Electric Corporation |
| 18525945 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18360873 | ELECTRONIC DEVICE WITH LEAD LOCK | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17936278 | REDISTRIBUTION LAYERS, AND RELATED METHODS AND DEVICES | Non-Final OA | Micron Technology, Inc. |
| 19265546 | INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18169579 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18099697 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17862693 | ANTI-FUSE DEVICE WITH A CUP-SHAPED INSULATOR | Non-Final OA | Microchip Technology Incorporated |
| 18300638 | LATERAL COILS USED FOR ENERGY TRANSFER OVER ISOLATION REGION IN MULTI-VOLTAGE DEVICES | Non-Final OA | Infineon Technologies AG |
| 17994743 | Semiconductor Package with Insert | Non-Final OA | Infineon Technologies Austria AG |
| 17956024 | CAPACITOR STRUCTURE TO SUPPORT VARIABLE SIGNAL AMPLITUDES IN AN ISOLATOR PRODUCT | Non-Final OA | Skyworks Solutions, Inc. |
| 18188630 | SEMICONDUCTOR DEVICE | Non-Final OA | MediaTek Singapore Pte. Ltd. |
| 18085560 | SEMICONDUCTOR STRUCTURE | Non-Final OA | United Microelectronics Corp. |
| 18444251 | FLUIDIC-CHANNEL COOLED SUBSTRATES | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18491369 | MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18068252 | PACKAGE-ON-PACKAGE AND SYSTEM-IN-PACKAGE PACKAGING ARCHITECTURES | Non-Final OA | Lumentum Operations LLC |
| 18213862 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
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