Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2828 2899
This examiner grants 78% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18338037 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18360873 | ELECTRONIC DEVICE WITH LEAD LOCK | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18355245 | HEAT DISSIPATION DEVICE FOR A CONVERTER FOR A VEHICLE, POWER CONVERTER, ELECTRIC AXLE DRIVE, VEHICLE AND METHOD FOR PRODUCING A HEAT DISSIPATION DEVICE | Final Rejection | ZF Friedrichshafen AG |
| 18509934 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 18300638 | LATERAL COILS USED FOR ENERGY TRANSFER OVER ISOLATION REGION IN MULTI-VOLTAGE DEVICES | Non-Final OA | Infineon Technologies AG |
| 18524581 | EMBEDDED JUMPER CONNECTION | Non-Final OA | International Business Machines Corporation |
| 17969260 | Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Downs and Associated Benefits | Non-Final OA | International Business Machines Corporation |
| 17550796 | FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD | Final Rejection | Intel Corporation |
| 17482681 | MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES | Final Rejection | Intel Corporation |
| 18057816 | MICRO-TRANSFORMER FOR ISOLATORS | Final Rejection | RENESAS ELECTRONICS AMERICA INC. |
| 18177644 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18207699 | ELECTRONIC DEVICE | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18169177 | PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18099697 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17862693 | ANTI-FUSE DEVICE WITH A CUP-SHAPED INSULATOR | Non-Final OA | Microchip Technology Incorporated |
| 18213200 | INTEGRATED DEVICE DIE WITH THERMAL CONNECTION | Final Rejection | Skyworks Solutions, Inc. |
| 18491369 | MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18059583 | SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE | Non-Final OA | RENESAS ELECTRONICS CORPORATION |
| 17994743 | Semiconductor Package with Insert | Non-Final OA | Infineon Technologies Austria AG |
| 18068252 | PACKAGE-ON-PACKAGE AND SYSTEM-IN-PACKAGE PACKAGING ARCHITECTURES | Non-Final OA | Lumentum Operations LLC |
| 18213862 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES | Final Rejection | Amkor Technology Singapore Holding Pte. Ltd. |
| 18505154 | METHOD FOR MANUFACTURING INTEGRATED DEVICE PACKAGES | Non-Final OA | ASMPT Singapore Pte. Ltd. |
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