Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2828 2899
This examiner grants 78% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18533899 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18338037 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18355245 | HEAT DISSIPATION DEVICE FOR A CONVERTER FOR A VEHICLE, POWER CONVERTER, ELECTRIC AXLE DRIVE, VEHICLE AND METHOD FOR PRODUCING A HEAT DISSIPATION DEVICE | Final Rejection | ZF Friedrichshafen AG |
| 18756147 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18091555 | APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRID BONDING | Non-Final OA | Intel Corporation |
| 17482681 | MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES | Final Rejection | Intel Corporation |
| 18777790 | METHOD FOR FORMING SILICON NITRIDE FILM SELECTIVELY ON SIDEWALLS OF TRENCHES | Non-Final OA | ASM IP Holding B.V. |
| 17938132 | POWER AMPLIFIER PACKAGES CONTAINING ELECTRICALLY-ROUTED LIDS AND METHODS FOR THE FABRICATION THEREOF | Final Rejection | NXP USA, Inc. |
| 18711091 | METHOD FOR MARKING SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR CHIP | Non-Final OA | Mitsubishi Electric Corporation |
| 18069804 | SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND POWER CONVERSION APPARATUS | Final Rejection | Mitsubishi Electric Corporation |
| 18360873 | ELECTRONIC DEVICE WITH LEAD LOCK | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 19265546 | INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18169579 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18169177 | PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18099697 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17813637 | SEMICONDUCTOR ASSEMBLY | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 17825748 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18525945 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 17862693 | ANTI-FUSE DEVICE WITH A CUP-SHAPED INSULATOR | Final Rejection | Microchip Technology Incorporated |
| 18300638 | LATERAL COILS USED FOR ENERGY TRANSFER OVER ISOLATION REGION IN MULTI-VOLTAGE DEVICES | Non-Final OA | Infineon Technologies AG |
| 17994743 | Semiconductor Package with Insert | Non-Final OA | Infineon Technologies Austria AG |
| 17816944 | METHODS FOR CONSTRUCTING PACKAGE SUBSTRATES WITH HIGH DENSITY | Non-Final OA | Advanced Micro Devices, Inc. |
| 17819710 | WAFER SIGNAL AND POWER ARRANGEMENT FOR NANOSHEET DEVICES | Non-Final OA | International Business Machines Corporation |
| 18059583 | SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE | Non-Final OA | RENESAS ELECTRONICS CORPORATION |
| 18776578 | MAGNETORESISTIVE DEVICES AND METHODS OF FABRICATING MAGNETORESISTIVE DEVICES | Non-Final OA | Everspin Technologies, Inc. |
| 18085560 | SEMICONDUCTOR STRUCTURE | Final Rejection | United Microelectronics Corp. |
| 18444251 | FLUIDIC-CHANNEL COOLED SUBSTRATES | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18491369 | MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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