Tech Center 2800 • Art Units: 2823 2828 2897
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18380951 | SEMICONDUCTOR DEVICE INCLUDING BACKSIDE SOURCE/DRAIN CONTACT STRUCTURE WITH CONTACT SPACER AND BACKSIDE GATE CONTACT STRUCTURE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18370283 | SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18236122 | IMAGE SENSOR AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18531903 | LIGHT EMITTING DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd |
| 18321192 | ELECTRONIC DEVICE WITH A REINFORCING LAYER | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18059473 | SHAPE MEMORY POLYMER FOR USE IN SEMICONDUCTOR DEVICE FABRICATION | Non-Final OA | Texas Instruments Incorporated |
| 18398732 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18528513 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18381457 | DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY APPARATUS | Non-Final OA | Wuhan Tianma Microelectronics Co., Ltd. |
| 18387240 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | Xiamen Tianma Display Technology Co., Ltd. |
| 18394352 | ISOLATION FORMATION METHOD IN HIGH-ASPECT RATIO CMOS STACKED DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18537444 | STACKED DEVICE STRUCTURES WITH VARYING LAYER CHARACTERISTICS | Non-Final OA | International Business Machines Corporation |
| 18531038 | LATERAL PASSIVE DIODES CO-INTEGRATED WITH NANOSHEET TECHNOLOGY | Non-Final OA | International Business Machines Corporation |
| 18147820 | HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TECHNOLOGIES | Non-Final OA | Intel Corporation |
| 17957349 | SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES | Final Rejection | Intel Corporation |
| 17956760 | SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING | Final Rejection | Intel Corporation |
| 18542052 | SUBSTRATE STRUCTURE INCLUDING STACKED SUBSTRATES DISPOSED IN A SHELL | Non-Final OA | QUALCOMM Incorporated |
| 18261518 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18553693 | SEMICONDUCTOR ELEMENT, SEMICONDUCTOR INTEGRATED CIRCUIT, AND PRODUCTION METHOD FOR SEMICONDUCTOR ELEMENT | Non-Final OA | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY |
| 18542228 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18558867 | INTEGRATED COLOR CONVERSION CARTRIDGE | Non-Final OA | VueReal Inc. |
| 18537778 | MULTI-CHANNEL VISIBLE LIGHT COMMUNICATION SYSTEM | Non-Final OA | HON HAI PRECISION INDUSTRY CO., LTD. |
| 18399742 | MEMS Microphone | Non-Final OA | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
| 18518184 | INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE | Non-Final OA | Advanced Micro Devices, Inc. |
| 18123612 | METHODS AND SYSTEMS FOR CONTROLLING UNDERFILL BLEED-OUT IN SEMICONDUCTOR PACKAGING | Final Rejection | SK Hynix NAND Product Solutions Corp. (dba Solidigm) |
| 18457549 | CONDUCTIVE AND TRANSPARENT INTERCONNECTION STRUCTURE, ASSOCIATED MANUFACTURING METHOD AND SYSTEM | Non-Final OA | COMMISSARIAT À L’ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18037081 | MICRO DEVICE, MICRO DEVICE ALIGNMENT APPARATUS, AND ALIGNMENT METHOD USING SAME | Non-Final OA | POINT ENGINEERING CO., LTD. |
| 18500504 | BARIUM TITANATE FILMS HAVING REDUCED INTERFACIAL STRAIN | Non-Final OA | Psiquantum, Corp. |
| 18565453 | OPTOELECTRONIC LIGHTING DEVICE | Non-Final OA | ams-OSRAM International GmbH |
| 18370402 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
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