Prosecution Insights
Last updated: May 29, 2026

Examiner: VU, VU A

Tech Center 2800 • Art Units: 2823 2828 2897

This examiner grants 92% of resolved cases

Performance Statistics

92.3%
Allow Rate
+24.3% vs TC avg
1,360
Total Applications
+6.6%
Interview Lift
662
Avg Prosecution Days
Based on 1328 resolved cases, 2023–2026

Rejection Statute Breakdown

0.3%
§101 Eligibility
13.5%
§102 Novelty
76.3%
§103 Obviousness
7.0%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18380951 SEMICONDUCTOR DEVICE INCLUDING BACKSIDE SOURCE/DRAIN CONTACT STRUCTURE WITH CONTACT SPACER AND BACKSIDE GATE CONTACT STRUCTURE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18486884 SOURCE/DRAIN ISOLATION OF TOP AND BOTTOM TIERS OF 3D FIELD-EFFECT TRANSISTORS Final Rejection Samsung Electronics Co., Ltd.
18362635 IC PACKAGE WITH IMMERSION TIN ON FLANK Final Rejection TEXAS INSTRUMENTS INCORPORATED
18321192 ELECTRONIC DEVICE WITH A REINFORCING LAYER Final Rejection TEXAS INSTRUMENTS INCORPORATED
18059473 SHAPE MEMORY POLYMER FOR USE IN SEMICONDUCTOR DEVICE FABRICATION Non-Final OA Texas Instruments Incorporated
18398732 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME Non-Final OA Samsung Display Co., LTD.
18528513 LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME Non-Final OA Samsung Display Co., Ltd.
18531038 LATERAL PASSIVE DIODES CO-INTEGRATED WITH NANOSHEET TECHNOLOGY Non-Final OA International Business Machines Corporation
18394352 ISOLATION FORMATION METHOD IN HIGH-ASPECT RATIO CMOS STACKED DEVICES Non-Final OA Applied Materials, Inc.
18121720 FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING TUNED UPPER NANOWIRES Non-Final OA Intel Corporation
17957349 SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES Final Rejection Intel Corporation
18542228 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF Non-Final OA YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18399742 MEMS Microphone Non-Final OA AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
18518184 INTEGRATED CIRCUIT DIE STACK WITH A BRIDGE DIE Final Rejection Advanced Micro Devices, Inc.
18037081 MICRO DEVICE, MICRO DEVICE ALIGNMENT APPARATUS, AND ALIGNMENT METHOD USING SAME Non-Final OA POINT ENGINEERING CO., LTD.
18500504 BARIUM TITANATE FILMS HAVING REDUCED INTERFACIAL STRAIN Non-Final OA Psiquantum, Corp.
18565453 OPTOELECTRONIC LIGHTING DEVICE Non-Final OA ams-OSRAM International GmbH
18392429 NANOPORE SENSING DEVICE WITH MULTIPLE SENSING LAYERS Non-Final OA IMEC VZW
18504593 METHOD FOR DETERMINING CROSSTALK OF QUANTUM BITS, QUANTUM CONTROL SYSTEM, AND QUANTUM COMPUTER Non-Final OA ORIGIN QUANTUM COMPUTING TECHNOLOGY (HEFEI) CO., LTD
18542211 TRENCH SEMICONDUCTOR POWER DEVICE AND LAYOUT THEREOF Non-Final OA Silicon-Magic Semiconductor Technology ( Hangzhou ) Co., Ltd
18498251 SEMICONDUCTOR DEVICE Non-Final OA WIN SEMICONDUCTORS CORP.
18380972 Display Module and Method for Manufacturing Display Module Non-Final OA Hudei Xinying Optoelectronics Co., Ltd.

Facing This Examiner?

IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.

Build Your Strategy

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month