Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2800 2812 2817 2823 2828 2893 2897 4100
This examiner grants 92% of resolved cases
Vu A Vu is an examiner in Tech Center 4100, specifically Art Unit 2800. The examiner has handled 1362 resolved cases. The allowance rate is 92.4 percent. This is an exceptionally high rate, indicating that nearly all applications reaching a resolution are granted. Practitioners can approach prosecution with this examiner with a high degree of confidence in the probability of success.
The interview lift is 6.6 percent. This positive lift suggests that interviews can further improve the 92.4 percent allowance rate. Practitioners should consider this approach to resolve any remaining issues quickly. Even with a high baseline, the data shows that direct communication can still provide a marginal benefit in securing a grant in Art Unit 2800.
The median days to allowance is 671. This timeframe is very short, reflecting a highly efficient prosecution process. With 1362 resolved cases, the examiner's data shows a consistent and fast approach in Tech Center 4100. This combination of a high allowance rate and short pendency makes this examiner's process very efficient for applicants.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18742376 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18620333 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18521965 | SEMICONDUCTOR CHIP HAVING A FRICTION STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD |
| 18887335 | LIGHT EMITTING ELEMENT | Non-Final OA | TOYODA GOSEI CO., LTD. |
| 18841905 | Light-Emitting Substrate, Backlight Module, and Display Apparatus | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18790855 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18646268 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18620407 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18620497 | DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18607631 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18738095 | BUMP MANUFACTURING METHOD AND IMPRINT DIE USED IN SAME | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18716691 | Optic for an Under-Display Image Sensor of an Electronic Device | Non-Final OA | Google LLC |
| 18779147 | LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE | Non-Final OA | SHARP KABUSHIKI KAISHA |
| 18121720 | FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING TUNED UPPER NANOWIRES | Final Rejection | Intel Corporation |
| 17956760 | SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING | Non-Final OA | Intel Corporation |
| 18841160 | PATTERN INSPECTION METHOD, METHOD FOR MANUFACTURING RESIST PATTERN, TARGET SUBSTRATE SELECTION METHOD, AND METHOD FOR MANUFACTURING TARGET SUBSTRATE | Non-Final OA | Resonac Corporation |
| 18839951 | METHOD OF MANUFACTURING A SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE | Non-Final OA | ams-OSRAM International GmbH |
| 18798659 | IMAGE SENSING DEVICE | Non-Final OA | SK hynix Inc. |
| 18766673 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18645288 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18544590 | THERMALLY CONDUCTIVE WAFER LAYER | Non-Final OA | Texas Instruments Incorporated |
| 18362635 | IC PACKAGE WITH IMMERSION TIN ON FLANK | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18781293 | SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMING THE SEMICONDUCTOR STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18659745 | SEMICONDUCTOR PACKAGE WITH HEAT SPREADING LID | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18785053 | Semiconductor Devices and Methods of Manufacture | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18741654 | DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18745485 | REDUCED STRAIN AND STOP LAYER FOR Si/SiGe EPI STACKS | Non-Final OA | Applied Materials, Inc. |
| 18895404 | NITRIDE SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18777108 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18785246 | BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER | Non-Final OA | SCREEN Holdings Co., Ltd. |
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