Tech Center 2800 • Art Units: 2812
This examiner grants 76% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18133278 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18453965 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | Non-Final OA | Mitsubishi Electric Corporation |
| 17318166 | HIGH MOBILITY SEMICONDUCTOR CHANNEL BASED THIN-FILM TRANSISTORS AND MANUFACTURING METHODS | Non-Final OA | Applied Materials, Inc. |
| 18395614 | PIXEL STRUCTURE | Non-Final OA | AUO Corporation |
| 17749160 | SEMICONDUCTOR DEVICE COMPRISING CONNECTIONS THROUGH STACKED TRANSISTORS FOR ROUTING FLEXIBILITY | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18343162 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING BACKSIDE SEMICONDUCTOR SOURCE STRUCTURE AND METHODS FOR FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 17566603 | ADJUSTABLE WELL CAPACITY PIXEL FOR SEMICONDUCTOR IMAGING SENSORS | Non-Final OA | Shenzhen Goodix Technology Co., Ltd. |
| 18984274 | CIGS SOLAR CELL WITH BOTH TRANSPARENCY AND FLEXIBILITY AND ITS MANUFACTURING METHOD | Non-Final OA | KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY |
| 18323413 | SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18282556 | SEMICONDUCTOR DEVICE | Non-Final OA | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 18491603 | THREE-DIMENSIONAL MEMORY DEVICE AND FORMATION METHOD THEREOF | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18177684 | STAGED BIASED DEEP TRENCH ISOLATION (DTI) STRUCTURE FOR HIGH FULL WELL CAPACITY (FWC) | Final Rejection | OMNIVISION TECHNOLOGIES, INC. |
| 18358584 | NAND PLANE BOUNDARY SHRINK | Non-Final OA | Sandisk Technologies, Inc. |
| 17777873 | OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME | Non-Final OA | OSRAM Opto Semiconductors GmbH |
| 18134029 | SEMICONDUCTOR PROCESS FOR SOLVING CONTACT PIPING DEFECT | Final Rejection | Powerchip Semiconductor Manufacturing Corporation |
| 18287204 | METHOD FOR MANUFACTURING CURVED SURFACE SUPPORT STRUCTURE, AND HEMISPHERICAL RESONATOR GYROSCOPE | Non-Final OA | TOKYO KEIKI INC. |
| 18310693 | SEMICONDUCTOR DEVICE AND METHODS FOR FORMING THE SAME | Final Rejection | Winbond Electronics Corp. |
| 18236985 | PHOTONICS CHIP PACKAGE STRUCTURES INCLUDING A CONTROLLED UNDERFILL FILLET | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18356896 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SILICON OXYCARBIDE LINERS AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18256286 | PHOTODIODE DEVICE WITH ENHANCED CHARACTERISTICS | Non-Final OA | AMS-OSRAM AG |
| 18615446 | TRANSISTOR INTEGRATION FOR REDUCED LATERAL SPACE AND IMPROVED BREAKDOWN VOLTAGE | Final Rejection | GlobalFoundries Singapore Pte. Ltd. |
| 18155967 | SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT | Final Rejection | NIKKISO CO., LTD. |
| 18312275 | METHOD FOR CHECKING AND PRODUCING A COMPOSITE OF A SUBSTRATE STACK, AND HERMETICALLY SEALED ENCLOSURE PRODUCED ACCORDING TO SAID METHOD | Non-Final OA | SCHOTT Primoceler Oy |
| 17768476 | ELECTRICAL CONTACT-FREE uLED LIGHT EMITTING DEVICE BASED ON WAVELENGHT DOWN-CONVERSION | Final Rejection | MINDU INNOVATION LAB |
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