Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 74% of resolved cases
Tyler J. Wiegand is an examiner in Art Unit 2812 of Tech Center 2800. He has resolved 104 cases, providing a reliable dataset for analysis. His allowance rate is 74.0 percent, which indicates that a strong majority of the applications he reviews result in a patent grant. This 74.0 percent rate suggests a generally successful path for applicants in his docket.
A notable feature of this profile is the interview lift of 12.5 percent. This positive lift value indicates that conducting an interview is an effective strategy for increasing the probability of allowance. Practitioners should consider scheduling an interview to leverage this 12.5 percent lift, as it represents a meaningful advantage over standard written prosecution. The 104 resolved cases highlight the impact of direct communication.
The median time to allowance is 1256 days. This 1256-day timeframe is relatively long, and practitioners should prepare their clients for a multi-year prosecution cycle. By considering the 74.0 percent allowance rate alongside the 1256-day median, attorneys can provide their clients with a realistic outlook. These data points define the current examination landscape in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18672349 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18400128 | ELECTROLUMINESCENT DEVICE, PRODUCTION METHOD THEREOF, AND DISPLAY DEVICE INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18221146 | INTEGRATED CIRCUIT AND NON-VOLATILE MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18595511 | SIGE HBT AND METHODS OF MANUFACTURING THE SAME | Non-Final OA | NXP B.V. |
| 18794491 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18193154 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18595027 | METHODS FOR LED TRANSFER IN MICRO-LED DISPLAYS | Non-Final OA | Google LLC |
| 18305391 | DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18491603 | THREE-DIMENSIONAL MEMORY DEVICE AND FORMATION METHOD THEREOF | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18453965 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | Final Rejection | Mitsubishi Electric Corporation |
| 18718878 | DISPLAY APPARATUS | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18706096 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18580265 | DISPLAY APPARATUS | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18893704 | SUBSTRATE FOR IMAGE SENSOR | Non-Final OA | LG INNOTEK CO., LTD. |
| 18440926 | HYBRID BOND FEATURES IN PROGRAMMABLE CIRCUITS | Non-Final OA | International Business Machines Corporation |
| 18434610 | THIN WAFER, METHOD OF MANUFACTURING THE THIN WAFER, STACK TYPE SEMICONDUCTOR DEVICE INCLUDING THE THIN WAFER AND METHOD OF MANUFACTURING THE STACK TYPE SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18595315 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18595321 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18589820 | SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL HEAT SLUG AND ISOLATION | Non-Final OA | Texas Instruments Incorporated |
| 18779390 | METHODS FOR INTEGRATED CIRCUIT DESIGN AND FABRICATION | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18780842 | TRANSISTOR SOURCE/DRAIN REGIONS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17318166 | HIGH MOBILITY SEMICONDUCTOR CHANNEL BASED THIN-FILM TRANSISTORS AND MANUFACTURING METHODS | Non-Final OA | Applied Materials, Inc. |
| 18587461 | SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | Non-Final OA | ROHM CO., LTD. |
| 18580608 | IDENTIFICATION KEY GENERATION CIRCUIT BASED ON PROCESS VARIATION | Non-Final OA | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
| 18177684 | STAGED BIASED DEEP TRENCH ISOLATION (DTI) STRUCTURE FOR HIGH FULL WELL CAPACITY (FWC) | Final Rejection | OMNIVISION TECHNOLOGIES, INC. |
| 18486370 | METHOD FOR INTERCONNECTING A BURIED WIRING LINE AND A SOURCE/DRAIN BODY | Final Rejection | IMEC VZW |
| 18219236 | MAGNETIC RANDOM ACCESS MEMORY CELL AND MAGNETIC RANDOM ACCESS MEMORY | Non-Final OA | Semiconductor Manufacturing International (Shanghai) Corporation |
| 18451565 | MEMORY STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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