Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 75% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18422660 | 3-DIMENSIONAL (3D) FERROELECTRIC RANDOM ACCESS MEMORY (FeRAM) AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18400128 | ELECTROLUMINESCENT DEVICE, PRODUCTION METHOD THEREOF, AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18221146 | INTEGRATED CIRCUIT AND NON-VOLATILE MEMORY DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18133278 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18408137 | Plug Regrowth for Micro LED Uniformity and Efficiency Improvement | Non-Final OA | Apple Inc. |
| 18305391 | DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18193154 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18491603 | THREE-DIMENSIONAL MEMORY DEVICE AND FORMATION METHOD THEREOF | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 18580265 | DISPLAY APPARATUS | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18453965 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | Final Rejection | Mitsubishi Electric Corporation |
| 18434610 | THIN WAFER, METHOD OF MANUFACTURING THE THIN WAFER, STACK TYPE SEMICONDUCTOR DEVICE INCLUDING THE THIN WAFER AND METHOD OF MANUFACTURING THE STACK TYPE SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18323413 | SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18589820 | SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL HEAT SLUG AND ISOLATION | Non-Final OA | Texas Instruments Incorporated |
| 18779390 | METHODS FOR INTEGRATED CIRCUIT DESIGN AND FABRICATION | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18440926 | HYBRID BOND FEATURES IN PROGRAMMABLE CIRCUITS | Non-Final OA | International Business Machines Corporation |
| 18530641 | BURIED METAL JUMPER STRUCTURE FOR BEOL | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18282556 | SEMICONDUCTOR DEVICE | Non-Final OA | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 18310693 | SEMICONDUCTOR DEVICE AND METHODS FOR FORMING THE SAME | Non-Final OA | Winbond Electronics Corp. |
| 18486370 | METHOD FOR INTERCONNECTING A BURIED WIRING LINE AND A SOURCE/DRAIN BODY | Final Rejection | IMEC VZW |
| 17777873 | OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME | Non-Final OA | OSRAM Opto Semiconductors GmbH |
| 18451565 | MEMORY STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy