Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2892 2898
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18753548 | WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18381908 | IMAGE SENSOR | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18219396 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18715347 | LIGHT DETECTION APPARATUS AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18790747 | Organic Light Emitting Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18534971 | LIGHT EMITTING DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd |
| 18539599 | LIGHT-EMITTING DEVICE | Final Rejection | NICHIA CORPORATION |
| 18357914 | ELECTRONIC DEVICE MADE OF CARBON SILICIDE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Commissariat à I'Énergie Atomique et aux Énergies Alternatives |
| 18595810 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18539529 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., Ltd. |
| 18513697 | DISPLAY APPARATUS | Final Rejection | Samsung Display Co., Ltd. |
| 18362003 | LIGHT-EMITTING COMPONENT, OPTICAL MEASUREMENT DEVICE, IMAGE FORMING APPARATUS, AND METHOD FOR MANUFACTURING LIGHT-EMITTING COMPONENT | Final Rejection | FUJIFILM Business Innovation Corp. |
| 17958094 | TECHNOLOGIES FOR TRANSISTORS WITH A THIN-FILM FERROELECTRIC | Non-Final OA | Intel Corporation |
| 17887154 | MULTI-PORTED REGISTER FILE WITH CFETS | Final Rejection | Intel Corporation |
| 17485232 | COMPLEX FIELD-SHAPING BY FINE VARIATION OF LOCAL MATERIAL DENSITY OR PROPERTIES | Final Rejection | Intel Corporation |
| 18035397 | SINGLE PHASE HIGH ENTROPY INTERMETALLICS AND METHOD FOR MANUFACTURING | Non-Final OA | THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
| 18568226 | DISPLAY DEVICE, DECORATIVE SHEET, AND METHOD FOR PRODUCING DISPLAY DEVICE | Final Rejection | TOPPAN INC. |
| 18556509 | SUBSTRATE, PACKAGE, ELECTRONIC COMPONENT, AND LIGHT EMITTING DEVICE | Final Rejection | KYOCERA Corporation |
| 18832489 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 17958205 | TRENCH SHIELDED TRANSISTOR | Non-Final OA | Texas Instruments Incorporated |
| 18435212 | Array Of Capacitors, Array Of Memory Cells, And Methods Used In Forming An Array Of Capacitors | Non-Final OA | Micron Technology, Inc. |
| 18731465 | DEVICE WITH EPITAXIAL SOURCE/DRAIN REGION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18672044 | PHOTODETECTOR DEVICE HAVING LIGHTLY DOPED LAYER | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18421111 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH PHOTOSENSING STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18787593 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED |
| 17367698 | SEMICONDUCTOR ARRANGEMENT INCLUDING A SPACER ADJACENT A CONDUCTIVE LAYER AND METHOD OF MAKING | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED |
| 18523903 | TRANSPARENT DISPLAY DEVICE | Final Rejection | AUO Corporation |
| 17706958 | BILAYER DIELECTRIC STACK FOR A FERROELECTRIC TUNNEL JUNCTION AND METHOD OF FORMING | Final Rejection | Tokyo Electron Limited |
| 18768307 | SEMICONDUCTOR DIE WITH A SILICON CARBIDE SUBSTRATE | Non-Final OA | Infineon Technologies AG |
| 18658557 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A P-I-N JUNCTION SOURCE CONTACT STRUCTURE AND METHODS FOR FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
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