Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2811 4100
This examiner grants 60% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18396258 | ELECTRONIC DEVICE INCLUDING FERROELECTRIC MATERIAL AND ELECTRONIC APPARATUS INCLUDING THE ELECTRONIC DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18457803 | VERTICAL TRANSISTOR AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17827751 | WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18446871 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18361441 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18589766 | SEMICONDUCTOR DEVICE | Non-Final OA | KABUSHIKI KAISHA TOSHIBA |
| 18669147 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18596237 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18503839 | COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET) CIRCUITS WITH DIRECT VERTICAL CONNECTORS AND METHODS FOR MAKING THE SAME | Final Rejection | QUALCOMM Incorporated |
| 18072564 | FABRICATION OF INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORMITY AMONG VARYING GATE TRENCH WIDTHS | Final Rejection | Intel Corporation |
| 17742638 | DOPING CONTACTS OF THIN FILM TRANSISTORS | Non-Final OA | Intel Corporation |
| 17969023 | SEMICONDUCTOR DEVICE | Final Rejection | DENSO CORPORATION |
| 17819538 | ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES ISOLATED BY SLOT STRUCTURES, AND RELATED SYSTEMS AND METHODS | Non-Final OA | Micron Technology, Inc. |
| 18405919 | IMAGE SENSOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18491486 | VARACTORS HAVING INCREASED TUNING RATIO | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18404639 | DIFFRACTION-BASED OVERLAY MARK DESIGN | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18344615 | SEMICONDUCTOR DEVICE | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 18594034 | MICRO LIGHT-EMITTING DIODE (LED) STRUCTURE | Non-Final OA | JADE BIRD DISPLAY (SHANGHAI) LIMITED |
| 17883716 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | Final Rejection | Infineon Technologies AG |
| 17882064 | POWER SEMICONDUCTOR DEVICE HAVING COUNTER-DOPED REGIONS IN BOTH AN ACTIVE CELL REGION AND AN INACTIVE CELL REGION | Non-Final OA | Infineon Technologies Austria AG |
| 18531010 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTRATE AND SEMICONDUCTOR DEVICE | Non-Final OA | STMicroelectronics International N.V. |
| 18664638 | PACKAGE STRUCTURE INCLUDING AT LEAST TWO DICE, ASSEMBLY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18640229 | PACKAGE STRUCTURE INCLUDING AT LEAST TWO DICE, ASSEMBLY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18509629 | SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18237015 | SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18357169 | SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18596631 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | United Microelectronics Corp. |
| 18526546 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | Non-Final OA | Socionext Inc. |
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