Tech Center 4100 • Art Units: 2811 4100
This examiner grants 61% of resolved cases
Jonas Tyler Beardsley examines applications in Art Unit 2811 within Tech Center 4100. He has reached a final resolution in 289 cases, providing a solid basis for analyzing his prosecution trends. The allowance rate pct of 60.9 indicates a moderate success rate, where the majority of applications result in a patent grant. This 60.9 percent rate suggests that while success is achievable, applicants must be diligent in addressing examiner concerns. The median days to allowance is 1150, reflecting a prosecution timeline that typically involves a significant duration of examination. This 1150-day median indicates that practitioners should prepare for an extended period of examination in Tech Center 4100.
The interview lift pct of 28.5 is a key metric for developing a successful strategy. This substantial lift indicates that engaging in an interview is highly correlated with an increased probability of allowance compared to cases without verbal negotiation. By utilizing an interview, applicants can significantly improve their chances of success beyond the 60.9 percent baseline. Given the 289 resolved cases, this 28.5 percent lift is a reliable indicator that direct communication is an effective tool in Art Unit 2811. Practitioners should consider an interview as a primary tactic to overcome obstacles and potentially expedite the 1150-day median wait time. The data underscores the importance of proactive advocacy in this examination environment. Effectively leveraging the interview process can help move applications toward a favorable outcome more efficiently.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18753011 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17827751 | WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17914946 | ARRAY SUBSTRATES AND METHODS FOR MANUFACTURING THE SAME, DISPLAY PANELS AND DISPLAY DEVICES | Final Rejection | BOE Technology Group Co., Ltd. |
| 18669147 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18596237 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18589766 | SEMICONDUCTOR DEVICE | Non-Final OA | KABUSHIKI KAISHA TOSHIBA |
| 18821443 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18361441 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18413339 | LIGHT-EMITTING DIODE DISPLAY APPARATUS | Final Rejection | LG Display Co., Ltd. |
| 18503839 | COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET) CIRCUITS WITH DIRECT VERTICAL CONNECTORS AND METHODS FOR MAKING THE SAME | Final Rejection | QUALCOMM Incorporated |
| 18353908 | RESISTIVE RANDOM ACCESS MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Kioxia Corporation |
| 18405919 | IMAGE SENSOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18528465 | RESISTANCE REDUCTION BY FORMING CONDUCTIVE VIA ON BACK SIDE OF SOURCE/DRAIN CONTACTS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18787996 | FIELD EFFECT TRANSISTOR AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18780679 | Dielectric Fins With Different Dielectric Constants and Sizes in Different Regions of a Semiconductor Device | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18404639 | DIFFRACTION-BASED OVERLAY MARK DESIGN | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18237015 | SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18526546 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | Non-Final OA | Socionext Inc. |
| 18625430 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18357169 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18521014 | SILICON CARBIDE SUBSTRATE, SILICON CARBIDE WAFER, AND SILICON CARBIDE SEMICONDUCTOR DEVICE | Non-Final OA | MIRISE Technologies Corporation |
| 18411911 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES | Final Rejection | Amkor Technology Singapore Holding Pte. Ltd. |
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