Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811
This examiner grants 59% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17827751 | WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17914946 | ARRAY SUBSTRATES AND METHODS FOR MANUFACTURING THE SAME, DISPLAY PANELS AND DISPLAY DEVICES | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18225793 | ORGANIC LIGHT EMITTING DIODE DISPLAY | Non-Final OA | Samsung Display Co., Ltd. |
| 18625430 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18193750 | SILICON CARBIDE SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18072564 | FABRICATION OF INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORMITY AMONG VARYING GATE TRENCH WIDTHS | Non-Final OA | Intel Corporation |
| 17742638 | DOPING CONTACTS OF THIN FILM TRANSISTORS | Non-Final OA | Intel Corporation |
| 17755871 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL | Non-Final OA | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18446871 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18353908 | RESISTIVE RANDOM ACCESS MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Kioxia Corporation |
| 18528465 | RESISTANCE REDUCTION BY FORMING CONDUCTIVE VIA ON BACK SIDE OF SOURCE/DRAIN CONTACTS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18362835 | MAGNETIC TUNNEL JUNCTION STRUCTURES AND RELATED METHODS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18344615 | SEMICONDUCTOR DEVICE | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
| 17476418 | FIELD EFFECT TRANSISTOR AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18521014 | SILICON CARBIDE SUBSTRATE, SILICON CARBIDE WAFER, AND SILICON CARBIDE SEMICONDUCTOR DEVICE | Non-Final OA | MIRISE Technologies Corporation |
| 17870260 | TRANSISTOR DEVICE | Non-Final OA | Infineon Technologies Austria AG |
| 18237015 | SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18016813 | SEMICONDUCTOR DEVICE | Non-Final OA | SUZHOU ORIENTAL SEMICONDUCTOR CO., LTD. |
| 17977346 | SEMICONDUCTOR DEVICE | Non-Final OA | Infineon Technologies Dresden GmbH & Co. KG |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy