Tech Center 2800 • Art Units: 2817
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17969942 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17876099 | SEMICONDUCTOR PACKAGE INCLUDING STIFFENER | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18501819 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18450095 | THREE-DIMENSIONAL MEMORY DEVICES INCLUDING SELF-ALIGNED CHANNEL CAP STRUCTURES AND METHODS FOR FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC. |
| 17964529 | GATE-ALL-AROUND TRANSISTORS WITH DUAL PFET AND NFET CHANNELS | Non-Final OA | International Business Machines Corporation |
| 17731255 | OPTICAL SUBSTRATE AND MANUFACTURING METHOD THEREOF | Final Rejection | Innolux Corporation |
| 17853500 | IN-SITU MULTI-LAYER DIELECTRIC FILMS FOR APPLICATION AS GATE SPACER AND ETCH STOP LAYERS | Non-Final OA | Intel Corporation |
| 17823162 | SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD | Final Rejection | Micron Technology, Inc. |
| 18507146 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18362688 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 17896731 | THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18330229 | FIELD EFFECT TRANSISTOR WITH STRAINED CHANNELS AND METHOD | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17885765 | LIGHT EMITTING DEVICE WITH LIGHT-ALTERING MATERIAL LAYER, AND FABRICATION METHOD UTILIZING SEALING TEMPLATE | Final Rejection | CreeLED, Inc. |
| 18324752 | SEMICONDUCTOR SUBSTRATES AND METHODS OF PRODUCING THE SAME | Final Rejection | IMEC vzw |
| 18175878 | Method for Manufacturing Metal Zero Layer | Final Rejection | Shanghai Huali Integrated Circuit Corporation |
| 17820059 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| 18206110 | METHOD FOR WAFER TREATMENT | Non-Final OA | Hua Hsu Silicon Materials Co., Ltd. |
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