Tech Center 2800 • Art Units: 2817
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18143915 | SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17969942 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17876099 | SEMICONDUCTOR PACKAGE INCLUDING STIFFENER | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18501819 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 17855480 | BOND PAD TOPOLOGY TO MITIGATE CRACK FORMATION | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18332028 | DIELECTRIC FEATURES FOR PARASITIC CAPACITANCE REDUCTION | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18107658 | MULTICHANNEL TRANSISTORS WITH SOURCE/DRAIN REGIONS HAVING WAVY INNER PROFILES AND METHODS FOR MANUFACTURING THEREOF | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17731255 | OPTICAL SUBSTRATE AND MANUFACTURING METHOD THEREOF | Final Rejection | Innolux Corporation |
| 18479457 | THREE-DIMENSIONAL MEMORY DEVICES INCLUDING SELF-ALIGNED SOURCE-CHANNEL JUNCTIONS AND METHODS FOR FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 18450095 | THREE-DIMENSIONAL MEMORY DEVICES INCLUDING SELF-ALIGNED CHANNEL CAP STRUCTURES AND METHODS FOR FORMING THE SAME | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC. |
| 17699209 | MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS | Final Rejection | Intel Corporation |
| 18140201 | METHODS AND STRUCTURES FOR REDUCING DEFORMATIONS OF GALLIUM NITRIDE (GaN) DEVICES | Final Rejection | Robert Bosch GmbH |
| 17823162 | SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD | Non-Final OA | Micron Technology, Inc. |
| 18507146 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18356223 | SEMICONDUCTOR SUBSTRATE AND FABRICATION METHOD OF THE SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 17896731 | THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18330229 | FIELD EFFECT TRANSISTOR WITH STRAINED CHANNELS AND METHOD | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18327998 | Front Side to Backside Interconnection for CFET Devices | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18366300 | SURFACE-WATER-ASSISTED DEPOSITION OF PATTERNED FILMS OF ALIGNED NANOPARTICLES | Final Rejection | Wisconsin Alumni Research Foundation |
| 17966081 | METHODS OF FORMING SEMICONDUCTOR STRUCTURES AND RESULTING SEMICONDUCTOR STRUCTURES | Non-Final OA | Wolfspeed, Inc. |
| 18197420 | PN JUNCTION | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18175878 | Method for Manufacturing Metal Zero Layer | Final Rejection | Shanghai Huali Integrated Circuit Corporation |
| 18324752 | SEMICONDUCTOR SUBSTRATES AND METHODS OF PRODUCING THE SAME | Final Rejection | IMEC vzw |
| 17820059 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| 17951135 | SEMICONDUCTOR DEVICE 5 WITH GETTERING SITES AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Vanguard International Semiconductor Corporation |
| 18206110 | METHOD FOR WAFER TREATMENT | Non-Final OA | Hua Hsu Silicon Materials Co., Ltd. |
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