Prosecution Insights
Last updated: May 29, 2026

Examiner: DUREN, TIMOTHY EDWARD

Tech Center 2800 • Art Units: 2817

This examiner grants 82% of resolved cases

Performance Statistics

82.1%
Allow Rate
+14.1% vs TC avg
81
Total Applications
+12.7%
Interview Lift
1202
Avg Prosecution Days
Based on 39 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
7.7%
§102 Novelty
83.4%
§103 Obviousness
8.3%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
17969942 THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
17876099 SEMICONDUCTOR PACKAGE INCLUDING STIFFENER Non-Final OA Samsung Electronics Co., Ltd.
18501819 DISPLAY APPARATUS Non-Final OA LG Display Co., Ltd.
18450095 THREE-DIMENSIONAL MEMORY DEVICES INCLUDING SELF-ALIGNED CHANNEL CAP STRUCTURES AND METHODS FOR FORMING THE SAME Non-Final OA WESTERN DIGITAL TECHNOLOGIES, INC.
17964529 GATE-ALL-AROUND TRANSISTORS WITH DUAL PFET AND NFET CHANNELS Non-Final OA International Business Machines Corporation
17731255 OPTICAL SUBSTRATE AND MANUFACTURING METHOD THEREOF Final Rejection Innolux Corporation
17853500 IN-SITU MULTI-LAYER DIELECTRIC FILMS FOR APPLICATION AS GATE SPACER AND ETCH STOP LAYERS Non-Final OA Intel Corporation
17823162 SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD Final Rejection Micron Technology, Inc.
18507146 SEMICONDUCTOR DEVICE Non-Final OA ROHM CO., LTD.
18362688 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE Final Rejection SK hynix Inc.
17896731 THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME Non-Final OA Yangtze Memory Technologies Co., Ltd.
18330229 FIELD EFFECT TRANSISTOR WITH STRAINED CHANNELS AND METHOD Final Rejection Taiwan Semiconductor Manufacturing Co., Ltd.
17885765 LIGHT EMITTING DEVICE WITH LIGHT-ALTERING MATERIAL LAYER, AND FABRICATION METHOD UTILIZING SEALING TEMPLATE Final Rejection CreeLED, Inc.
18324752 SEMICONDUCTOR SUBSTRATES AND METHODS OF PRODUCING THE SAME Final Rejection IMEC vzw
18175878 Method for Manufacturing Metal Zero Layer Final Rejection Shanghai Huali Integrated Circuit Corporation
17820059 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Non-Final OA SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
18206110 METHOD FOR WAFER TREATMENT Non-Final OA Hua Hsu Silicon Materials Co., Ltd.

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