Tech Center 2800 • Art Units: 2892
This examiner grants 65% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18382205 | IMAGE SENSOR AND IMAGE SENSOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18531300 | Display Device and Method for Manufacturing the Same | Non-Final OA | LG Display Co., Ltd. |
| 17880117 | SEMICONDUCTOR DEVICE WITH FIRST AND SECOND SIDEWALL SPACERS ON BURIED INSULATOR | Final Rejection | Sony Group Corporation |
| 18264026 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18471223 | INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE | Non-Final OA | Texas Instruments Incorporated |
| 17946109 | WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE | Non-Final OA | Texas Instruments Incorporated |
| 18409602 | HEATSINK AND SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18382200 | DISPLAY PANEL AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18235275 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18575411 | DISPLAY APPARATUS | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18208888 | DISPLAY DEVICE WITH A SLIM FRAME AND DRIVER | Non-Final OA | Sharp Display Technology Corporation |
| 18111525 | METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS REFLOW | Non-Final OA | Micron Technology, Inc. |
| 18005264 | SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 18088498 | PACKAGE, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE PACKAGE | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 17781138 | LIGHT-EMITTING DEVICE HAVING PHOTOLUMINESCENT LAYER ON LIGHT-EMITTING SIDE OF LIGHT-EMITTING STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 18358411 | SEMICONDUCTOR DEVICE | Final Rejection | RENESAS ELECTRONICS CORPORATION |
| 18366009 | ELECTRONIC PACKAGE AND CARRIER STRUCTURE THEREOF | Final Rejection | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18224701 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTRATE AND SEMICONDUCTOR DEVICE | Non-Final OA | STMicroelectronics S.r.l. |
| 18538093 | Semiconductor Devices Having an Electro-static Discharge Protection Structure | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18327921 | PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARATUS FOR EFFECTING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18327908 | FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFECTING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18234645 | PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | CHIPBOND TECHNOLOGY CORPORATION |
| 18545228 | METHOD FOR MANUFACTURING SUPERJUNCTION TRENCH GATE MOSFET | Non-Final OA | Hua Hong Semiconductor (Wuxi) Limited |
| 18522527 | DEVICE AND METHOD FOR ALIGNING LIGHT-EMITTING DIODES | Non-Final OA | Century Technology (Shenzhen) Corporation Limited |
| 18450429 | APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR BONDING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE DISPLAY | Non-Final OA | Stroke Precision Advanced Engineering Co., Ltd. |
| 18447320 | APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BONDING ELECTRONIC COMPONENT | Non-Final OA | Stroke Precision Advanced Engineering Co., Ltd. |
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