Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2892
This examiner grants 66% of resolved cases
Laura M. Dykes serves in Tech Center 2800 and Art Unit 2892. Her record includes 527 resolved cases with an allowance rate of 66.0 percent. The median days to allowance for these applications is 995. This 995-day timeline is a useful benchmark for practitioners working on the 527 resolved cases under her review in Art Unit 2892.
The interview lift is 27.1 percent, which suggests that direct communication is a very effective tactic for applicants. This 27.1 percent lift provides a strong boost to the 66.0 percent base allowance rate. Given the 995 median days to allowance, an interview may be a key step in securing a grant. The 527 resolved cases in Tech Center 2800 provide a reliable statistical basis for these prosecution strategies.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18761886 | SEMICONDUCTOR DEVICE AND INTERCONNECTION STRUCTURE IN SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18667670 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO.,LTD. |
| 18613471 | CAPACITOR STRUCTURE AND SEMICONDUCTOR MEMORY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18827874 | FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18618854 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18382200 | DISPLAY PANEL AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18476454 | DISPLAY MODULE AND MANUFACTURING METHOD FOR THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18235275 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18771351 | Transparent Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18531300 | Display Device and Method for Manufacturing the Same | Final Rejection | LG Display Co., Ltd. |
| 18575411 | DISPLAY APPARATUS | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 17880117 | SEMICONDUCTOR DEVICE WITH FIRST AND SECOND SIDEWALL SPACERS ON BURIED INSULATOR | Final Rejection | Sony Group Corporation |
| 18578633 | METHOD OF MANUFACTURING A PLURALITY OF LIGHT EMITTING DEVICES AND COMPONENT | Non-Final OA | ams-OSRAM International GmbH |
| 18743276 | STACKED NANOSHEET CAPACITOR-TRANSISTOR DEVICE | Non-Final OA | International Business Machines Corporation |
| 18599586 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | Kioxia Corporation |
| 17946109 | WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE | Non-Final OA | Texas Instruments Incorporated |
| 18599771 | IMAGE SENSING DEVICE | Final Rejection | SK hynix Inc. |
| 18111525 | METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS REFLOW | Final Rejection | Micron Technology, Inc. |
| 18471219 | SIC-BASED ELECTRONIC DEVICE WITH IMPROVED BODY-SOURCE COUPLING, AND MANUFACTURING METHOD | Final Rejection | STMICROELECTRONICS S.r.l. |
| 18787569 | CAPACITOR IN NANOSHEET | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18581058 | SEMICONDUCTOR STRUCTURES FOR MONITORING PLASMA PROCESS-INDUCED DAMAGES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18431950 | SEMICONDUCTOR DEVICES WITH LOWERED EPITAXIAL SOURCE/DRAIN REGIONS AND METHODS OF FABRICATION THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18412129 | MEMORY DEVICES WITH DIFFERENTLY SIZED ACTIVE REGIONS IN PERIPHERY CIRCUITS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18820928 | DEVICE CHIP MANUFACTURING METHOD | Non-Final OA | DISCO CORPORATION |
| 18581006 | CHIP CARRIER STRUCTURE | Final Rejection | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
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