Tech Center 2800 • Art Units: 2892
This examiner grants 66% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18761886 | SEMICONDUCTOR DEVICE AND INTERCONNECTION STRUCTURE IN SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18613471 | CAPACITOR STRUCTURE AND SEMICONDUCTOR MEMORY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18382205 | IMAGE SENSOR AND IMAGE SENSOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18618854 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18382200 | DISPLAY PANEL AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18476454 | DISPLAY MODULE AND MANUFACTURING METHOD FOR THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18235275 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18575411 | DISPLAY APPARATUS | Final Rejection | Semiconductor Energy Laboratory Co., Ltd. |
| 17946109 | WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE | Final Rejection | Texas Instruments Incorporated |
| 18111525 | METHODS AND APPARATUS FOR STACKED DIE WARPAGE CONTROL DURING MASS REFLOW | Final Rejection | Micron Technology, Inc. |
| 18771548 | INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18431950 | SEMICONDUCTOR DEVICES WITH LOWERED EPITAXIAL SOURCE/DRAIN REGIONS AND METHODS OF FABRICATION THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18412129 | MEMORY DEVICES WITH DIFFERENTLY SIZED ACTIVE REGIONS IN PERIPHERY CIRCUITS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18471219 | SIC-BASED ELECTRONIC DEVICE WITH IMPROVED BODY-SOURCE COUPLING, AND MANUFACTURING METHOD | Final Rejection | STMICROELECTRONICS S.r.l. |
| 18578633 | METHOD OF MANUFACTURING A PLURALITY OF LIGHT EMITTING DEVICES AND COMPONENT | Non-Final OA | ams-OSRAM International GmbH |
| 17781138 | LIGHT-EMITTING DEVICE HAVING PHOTOLUMINESCENT LAYER ON LIGHT-EMITTING SIDE OF LIGHT-EMITTING STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 18581006 | CHIP CARRIER STRUCTURE | Final Rejection | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
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