Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 93% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18346371 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18549372 | FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTURE, AND CONNECTION METHOD THEREFOR | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18213523 | TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS | Non-Final OA | International Business Machines Corporation |
| 18512857 | FERROELECTRIC BASED MEMORY DEVICE AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION |
| 17935627 | INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS | Final Rejection | Intel Corporation |
| 17561735 | SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCESSES | Non-Final OA | Intel Corporation |
| 17517152 | NO-REMELT SOLDER ENFORCEMENT JOINT | Final Rejection | Intel Corporation |
| 17485158 | SINGLE-SIDED NANOSHEET TRANSISTORS | Non-Final OA | Intel Corporation |
| 18347904 | CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE | Final Rejection | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18254029 | WIDE BANDGAP SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18524138 | HOT ION IMPLANTATION FOR CONDENSATION DEFECT REDUCTION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18492258 | EPITAXIAL STRUCTURES FOR SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18335754 | METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17690685 | ANTI-FERROELECTRIC TUNNEL JUNCTION WITH ASYMMETRICAL METAL ELECTRODES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18524036 | SEMICONDUCTOR DEVICE | Non-Final OA | MIRISE Technologies Corporation |
| 18220501 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18323403 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Final Rejection | NATIONAL YANG MING CHIAO TUNG UNIVERSITY |
| 18562058 | COMPOUND SEMICONDUCTOR LAYERED STRUCTURES AND PROCESSES FOR MAKING THE SAME | Non-Final OA | UMICORE |
| 18230423 | MOSFET TRANSISTOR | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18058932 | STRUCTURE WITH COPPER BOND PAD AND COPPER INTERCONNECT | Non-Final OA | GlobalFoundries Singapore Pte. Ltd. |
| 18312013 | DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS FOR MANUFACTURING THE SAME | Non-Final OA | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
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