Prosecution Insights
Last updated: August 18, 2026

Examiner: MCCOY, THOMAS WILSON

Tech Center 2800 • Art Units: 2814

This examiner grants 88% of resolved cases

Performance Statistics

87.5%
Allow Rate
+19.5% vs TC avg
63
Total Applications
+6.3%
Interview Lift
1250
Avg Prosecution Days
Based on 24 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
18.4%
§102 Novelty
61.6%
§103 Obviousness
13.2%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18754254 IMAGING DEVICE Non-Final OA Panasonic Intellectual Property Management Co., Ltd.
18549372 FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTURE, AND CONNECTION METHOD THEREFOR Final Rejection SONY SEMICONDUCTOR SOLUTIONS CORPORATION
18234734 LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME Non-Final OA LG Display Co., Ltd.
18543987 METHOD FOR PRODUCING DOPED TRANSISTOR SOURCE AND DRAIN Non-Final OA COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
18527825 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME Non-Final OA Samsung Display Co., Ltd.
18217049 METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT STRUCTURES Non-Final OA Intel Corporation
17935627 INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS Final Rejection Intel Corporation
17561735 SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCESSES Final Rejection Intel Corporation
17561824 STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER Final Rejection Intel Corporation
18512857 FERROELECTRIC BASED MEMORY DEVICE AND MANUFACTURING METHOD OF THE SAME Final Rejection KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
18402984 METHOD AND CHEMICAL VAPOR DEPOSITION APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18492258 EPITAXIAL STRUCTURES FOR SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18335754 METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18457664 ELECTRONIC COMPONENT WITH REDUCED STRESS Non-Final OA Murata Manufacturing Co., Ltd.
18526384 INTEGRATED CIRCUIT COMPRISING A CAPACITIVE TRANSISTOR Final Rejection STMicroelectronics (Rousset) SAS
18230423 MOSFET TRANSISTOR Non-Final OA STMicroelectronics (Crolles 2) SAS
18439249 SEMICONDUCTOR DEVICE Non-Final OA Renesas Electronics Corporation
19077336 SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME Non-Final OA NANYA TECHNOLOGY CORPORATION
17973641 WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE Final Rejection NANYA TECHNOLOGY CORPORATION
18220501 ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF Final Rejection SILICONWARE PRECISION INDUSTRIES CO., LTD.
18323403 PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME Non-Final OA NATIONAL YANG MING CHIAO TUNG UNIVERSITY

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