Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 88% of resolved cases
Thomas Wilson McCoy is an examiner in Tech Center 2800 and Art Unit 2814. Based on 32 resolved cases, the examiner has a high allowance rate of 87.5%. This suggests a very positive environment for applicants, as the vast majority of cases reach issuance. The 87.5% allowance rate indicates that the examiner is generally receptive to the arguments and claim sets presented in this art unit.
The interview lift is 11.0%, which shows that interviews provide a modest benefit in securing an allowance. While the baseline rate is already high, an interview can still be a useful tool for resolving final details. The median days to allowance is 1215, which is a typical duration for the prosecution process. This 1215-day timeline, combined with the 87.5% allowance rate, suggests a predictable path to issuance. For practitioners, the 32 resolved cases provide enough data to recommend a strategy focused on clear technical disclosure, with the 11.0% interview lift available as a secondary tactic to ensure success within the 1215-day median timeframe in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18767490 | DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18754254 | IMAGING DEVICE | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18543987 | METHOD FOR PRODUCING DOPED TRANSISTOR SOURCE AND DRAIN | Non-Final OA | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18217049 | METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT STRUCTURES | Non-Final OA | Intel Corporation |
| 18216315 | STACKED CHIPS WITH EDGE MOUNTED ANTENNAS FOR SMALL PITCH PHASED ARRAYS | Non-Final OA | Intel Corporation |
| 17935627 | INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS | Final Rejection | Intel Corporation |
| 17561824 | STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER | Final Rejection | Intel Corporation |
| 18293044 | SOLID-STATE IMAGING DEVICE | Non-Final OA | SONY GROUP CORPORATION |
| 18549372 | FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTURE, AND CONNECTION METHOD THEREFOR | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18457664 | ELECTRONIC COMPONENT WITH REDUCED STRESS | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18524138 | HOT ION IMPLANTATION FOR CONDENSATION DEFECT REDUCTION | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18244040 | METHODS FOR FORMING GATE OXIDE LAYER FOR HIGH-VOLTAGE TRANSISTOR | Final Rejection | Taiwan Semiconductor Manufacturing Company LTD |
| 18335754 | METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17685584 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18403298 | PACKAGED DEVICE WITH AIR GAP AND METHODS OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17973641 | WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18512857 | FERROELECTRIC BASED MEMORY DEVICE AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION |
| 18562058 | COMPOUND SEMICONDUCTOR LAYERED STRUCTURES AND PROCESSES FOR MAKING THE SAME | Non-Final OA | UMICORE |
| 18058932 | STRUCTURE WITH COPPER BOND PAD AND COPPER INTERCONNECT | Final Rejection | GlobalFoundries Singapore Pte. Ltd. |
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