Tech Center 2800 • Art Units: 2814
This examiner grants 100% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18524135 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18346371 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18491552 | METHOD INCLUDING POSITIONING A DUMMY SOURCE DIE OR A DESTINATION SITE TO COMPENSATE FOR OVERLAY ERROR | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18454657 | ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PADS FOR PROBING A WAFER | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18213523 | TRENCH ISOLATION STRUCTURES FOR BACKSIDE CONTACTS | Non-Final OA | International Business Machines Corporation |
| 18512857 | FERROELECTRIC BASED MEMORY DEVICE AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION |
| 18524138 | HOT ION IMPLANTATION FOR CONDENSATION DEFECT REDUCTION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18244040 | METHODS FOR FORMING GATE OXIDE LAYER FOR HIGH-VOLTAGE TRANSISTOR | Non-Final OA | Taiwan Semiconductor Manufacturing Company LTD |
| 18335754 | METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17690685 | ANTI-FERROELECTRIC TUNNEL JUNCTION WITH ASYMMETRICAL METAL ELECTRODES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17685584 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17935627 | INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS | Final Rejection | Intel Corporation |
| 17561824 | STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER | Non-Final OA | Intel Corporation |
| 17561735 | SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCESSES | Non-Final OA | Intel Corporation |
| 17517152 | NO-REMELT SOLDER ENFORCEMENT JOINT | Final Rejection | Intel Corporation |
| 17485158 | SINGLE-SIDED NANOSHEET TRANSISTORS | Non-Final OA | Intel Corporation |
| 17485149 | TRANSISTORS WITH REDUCED EPITAXIAL SOURCE/DRAIN SPAN VIA ETCH-BACK FOR IMPROVED CELL SCALING | Final Rejection | Intel Corporation |
| 18254029 | WIDE BANDGAP SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18524036 | SEMICONDUCTOR DEVICE | Non-Final OA | MIRISE Technologies Corporation |
| 18220501 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 17973641 | WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18347904 | CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE | Final Rejection | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18230423 | MOSFET TRANSISTOR | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18562058 | COMPOUND SEMICONDUCTOR LAYERED STRUCTURES AND PROCESSES FOR MAKING THE SAME | Non-Final OA | UMICORE |
| 18526384 | INTEGRATED CIRCUIT COMPRISING A CAPACITIVE TRANSISTOR | Non-Final OA | STMicroelectronics (Rousset) SAS |
| 18058932 | STRUCTURE WITH COPPER BOND PAD AND COPPER INTERCONNECT | Non-Final OA | GlobalFoundries Singapore Pte. Ltd. |
| 18459777 | Semiconductor Device and Method of Making Face-Up Wafer-Level Package Using Intensive Pulsed Light Irradiation | Final Rejection | STATS ChipPAC Pte. Ltd. |
| 18312013 | DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS FOR MANUFACTURING THE SAME | Non-Final OA | CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD. |
| 17870209 | DISPLAY PANEL HAVING WHITE INSULATION LAYER AND SPACER LAYER FOR INCREASING THE RESOLUTION | Final Rejection | AU Optronics Corporation |
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