Tech Center 2800 • Art Units: 2814
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18754254 | IMAGING DEVICE | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18549372 | FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTURE, AND CONNECTION METHOD THEREFOR | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18234734 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18543987 | METHOD FOR PRODUCING DOPED TRANSISTOR SOURCE AND DRAIN | Non-Final OA | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18527825 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18217049 | METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT STRUCTURES | Non-Final OA | Intel Corporation |
| 17935627 | INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS | Final Rejection | Intel Corporation |
| 17561735 | SUSPENDED STRUCTURES IN GLASS USING MODIFIED GLASS PATTERNING PROCESSES | Final Rejection | Intel Corporation |
| 17561824 | STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER | Final Rejection | Intel Corporation |
| 18512857 | FERROELECTRIC BASED MEMORY DEVICE AND MANUFACTURING METHOD OF THE SAME | Final Rejection | KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION |
| 18402984 | METHOD AND CHEMICAL VAPOR DEPOSITION APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18492258 | EPITAXIAL STRUCTURES FOR SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18335754 | METAL-INSULATOR-METAL STRUCTURE AND METHODS THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18457664 | ELECTRONIC COMPONENT WITH REDUCED STRESS | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18526384 | INTEGRATED CIRCUIT COMPRISING A CAPACITIVE TRANSISTOR | Final Rejection | STMicroelectronics (Rousset) SAS |
| 18230423 | MOSFET TRANSISTOR | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18439249 | SEMICONDUCTOR DEVICE | Non-Final OA | Renesas Electronics Corporation |
| 19077336 | SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 17973641 | WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18220501 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18323403 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | NATIONAL YANG MING CHIAO TUNG UNIVERSITY |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy