Prosecution Insights
Last updated: August 17, 2026

Examiner: NADAV, ORI

Tech Center 2800 • Art Units: 2800 2811

This examiner grants 60% of resolved cases

Performance Statistics

60.2%
Allow Rate
-7.8% vs TC avg
773
Total Applications
+21.3%
Interview Lift
1394
Avg Prosecution Days
Based on 704 resolved cases, 2023–2026

Rejection Statute Breakdown

0.5%
§101 Eligibility
9.9%
§102 Novelty
55.1%
§103 Obviousness
31.2%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18509483 SEMICONDUCTOR DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18498020 INTEGRATED CIRCUIT DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18192329 SEMICONDUCTOR DEVICES Final Rejection Samsung Electronics Co., Ltd.
17940323 SEMICONDUCTOR DEVICE Non-Final OA Samsung Electronics Co., Ltd.
17886652 SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18282979 DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE Non-Final OA BOE Technology Group Co., Ltd.
18546693 CONNECTION STRUCTURE, DISPLAY PANEL, MANUFACTURING METHOD, DETECTION CIRCUITRY, AND DISPLAY DEVICE Final Rejection BOE TECHNOLOGY GROUP CO., LTD.
18262678 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY ASSEMBLY, AND DISPLAY DEVICE Final Rejection BOE TECHNOLOGY GROUP CO., LTD.
18273032 ARRAY SUBSTRATE AND DISPLAY DEVICE Final Rejection BOE Technology Group Co., Ltd.
18272118 DISPLAY PANEL AND DISPLAYING DEVICE Non-Final OA BOE Technology Group Co., Ltd.
18493052 DISPLAY DEVICE Non-Final OA LG Display Co., Ltd.
18318748 SEMICONDUCTOR DEVICE Non-Final OA Magnolia White Corporation
18492967 CHIP PACKAGE STRUCTURE AND ELECTRONIC DEVICE Final Rejection HUAWEI TECHNOLOGIES CO., LTD.
17720840 Chip and Integrated Chip Non-Final OA Huawei Technologies Co., Ltd.
18221774 DISPLAY APPARATUS Non-Final OA Samsung Display Co., Ltd.
18310602 DISPLAY DEVICE Non-Final OA Samsung Display Co., LTD.
17576177 DISPLAY DEVICE Final Rejection Samsung Display Co., LTD.
18325083 MODULATION DEVICE Final Rejection Innolux Corporation
18090838 DOUBLE INTERCONNECTS FOR STITCHED DIES Non-Final OA Intel Corporation
18513145 STRUCTURES AND METHODS FOR BONDING DIES Non-Final OA ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
17190601 CONTACT PAD STRUCTURE AND METHOD OF FORMING THE SAME Non-Final OA Yangtze Memory Technologies Co., Ltd.
17813076 METHODS OF FORMING AN APPARATUS COMPRISING SILICON CARBIDE MATERIALS AND RELATED MICROELECTRONIC DEVICES AND SYSTEMS Non-Final OA Micron Technology, Inc.
17813080 APPARATUS COMPRISING SILICON CARBIDE MATERIALS AND RELATED ELECTRONIC SYSTEMS AND METHODS Non-Final OA Micron Technology, Inc.
18477940 SEMICONDUCTOR STRUCTURE WITH DOPED REGION AND METHOD FOR MANUFACTURING THE SAME Final Rejection Taiwan Semiconductor Manufacturing Company, Ltd.
18238247 SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18165595 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE Non-Final OA Kioxia Corporation
17701024 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE Final Rejection Kioxia Corporation
18493775 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND STATIC RANDOM ACCESS MEMORY CELL Final Rejection HON HAI PRECISION INDUSTRY CO., LTD.
18367064 SEMICONDUCTOR DEVICE WITH ASSISTANCE FEATURES AND METHOD FOR FABRICATING THE SAME Final Rejection NANYA TECHNOLOGY CORPORATION
17978336 SEMICONDUCTOR DEVICE WITH ASSISTANCE FEATURES AND METHOD FOR FABRICATING THE SAME Non-Final OA NANYA TECHNOLOGY CORPORATION

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