Prosecution Insights
Last updated: October 02, 2026

Examiner: NADAV, ORI

Tech Center 2800 • Art Units: 2800 2811

This examiner grants 60% of resolved cases

Performance Statistics

60.0%
Allow Rate
-8.0% vs TC avg
778
Total Applications
+21.2%
Interview Lift
1394
Avg Prosecution Days
Based on 710 resolved cases, 2023–2026

Rejection Statute Breakdown

0.4%
§101 Eligibility
9.8%
§102 Novelty
55.5%
§103 Obviousness
30.9%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18640451 SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18509483 SEMICONDUCTOR DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18498020 INTEGRATED CIRCUIT DEVICE Final Rejection SAMSUNG ELECTRONICS CO., LTD.
18192329 SEMICONDUCTOR DEVICES Final Rejection Samsung Electronics Co., Ltd.
18126395 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME Final Rejection Samsung Electronics Co., Ltd.
18050179 Semiconductor Devices Final Rejection Samsung Electronics Co., Ltd.
17940323 SEMICONDUCTOR DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18777935 DISPLAY SUBSTRATE AND DISPLAY DEVICE Non-Final OA BOE TECHNOLOGY GROUP CO., LTD.
18282979 DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE Final Rejection BOE Technology Group Co., Ltd.
18764112 FOLDABLE DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF Non-Final OA SAMSUNG DISPLAY CO., LTD.
18221774 DISPLAY APPARATUS Final Rejection Samsung Display Co., Ltd.
17705024 DISPLAY DEVICE Final Rejection SAMSUNG DISPLAY CO., LTD.
17576177 DISPLAY DEVICE Non-Final OA Samsung Display Co., LTD.
18493052 DISPLAY DEVICE Non-Final OA LG Display Co., Ltd.
18138203 DISPLAY DEVICE Non-Final OA LG Display Co., Ltd.
18492967 CHIP PACKAGE STRUCTURE AND ELECTRONIC DEVICE Non-Final OA HUAWEI TECHNOLOGIES CO., LTD.
17720840 Chip and Integrated Chip Non-Final OA Huawei Technologies Co., Ltd.
18325083 MODULATION DEVICE Final Rejection Innolux Corporation
18090838 DOUBLE INTERCONNECTS FOR STITCHED DIES Non-Final OA Intel Corporation
18513145 STRUCTURES AND METHODS FOR BONDING DIES Final Rejection ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
17190601 CONTACT PAD STRUCTURE AND METHOD OF FORMING THE SAME Non-Final OA Yangtze Memory Technologies Co., Ltd.
17358051 SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE Non-Final OA SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
18805929 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Non-Final OA SUMITOMO ELECTRIC INDUSTRIES, LTD.
18429974 DIFFERENT DEPTH BACKSIDE S/D CONTACT PLACEHOLDER STRUCTURES Non-Final OA International Business Machines Corporation
18467773 SEMICONDUCTOR MEMORY DEVICE Non-Final OA Kioxia Corporation
18165595 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE Non-Final OA Kioxia Corporation
17701024 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE Non-Final OA Kioxia Corporation
17379549 SEMICONDUCTOR DEVICE WITH A MULTILAYER PACKAGE SUBSTRATE Non-Final OA TEXAS INSTRUMENTS INCORPORATED
17813076 METHODS OF FORMING AN APPARATUS COMPRISING SILICON CARBIDE MATERIALS AND RELATED MICROELECTRONIC DEVICES AND SYSTEMS Final Rejection Micron Technology, Inc.
17813080 APPARATUS COMPRISING SILICON CARBIDE MATERIALS AND RELATED ELECTRONIC SYSTEMS AND METHODS Final Rejection Micron Technology, Inc.

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