Tech Center 2800 • Art Units: 2800 2811
This examiner grants 60% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18213250 | Transistor and Display Device | Final Rejection | LG Display Co., Ltd. |
| 18282979 | DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18546693 | CONNECTION STRUCTURE, DISPLAY PANEL, MANUFACTURING METHOD, DETECTION CIRCUITRY, AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18261688 | ARRAY SUBSTRATE AND DISPLAY APPARATUS | Final Rejection | BOE Technology Group Co., Ltd. |
| 17773314 | DISPLAY PANEL, MANUFACTURE METHOD THEREFOR, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18221774 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18310602 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 17576177 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18492967 | CHIP PACKAGE STRUCTURE AND ELECTRONIC DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18378183 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, MODULE, AND ELECTRONIC DEVICE | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 17358051 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18206590 | ELECTRONIC DEVICE | Final Rejection | InnoLux Corporation |
| 18318748 | SEMICONDUCTOR DEVICE | Non-Final OA | Magnolia White Corporation |
| 17701024 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18477940 | SEMICONDUCTOR STRUCTURE WITH DOPED REGION AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18238247 | SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17598285 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | Non-Final OA | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 18485966 | POWER MODULE PACKAGE HAVING MIRRORED LEADS | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18367064 | SEMICONDUCTOR DEVICE WITH ASSISTANCE FEATURES AND METHOD FOR FABRICATING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 17978336 | SEMICONDUCTOR DEVICE WITH ASSISTANCE FEATURES AND METHOD FOR FABRICATING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 17826178 | EMBEDDED COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | Unimicron Technology Corp. |
| 18371377 | PACKAGE STRUCTURE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 17276809 | SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHODS THEREOF | Non-Final OA | ENKRIS SEMICONDUCTOR, INC. |
| 17724438 | PACKAGE CHIP AND METHOD OF MANUFACTURING THE SAME, REWIRING PACKAGE CHIP AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SHENNAN CIRCUITS CO., LTD. |
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