Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2821 2893
This examiner grants 71% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18649591 | LIGHT FIELD DISPLAY | Non-Final OA | SAMSUNG ELECTRONICS CO, LTD. |
| 18625690 | SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT PACKAGE WITH CAPACITOR EMBEDDED THEREIN | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18483331 | SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS OF THE SAME, AND ELECTRONIC SYSTEMS INCLUDING SEMICONDUCTOR DEVICES | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18364656 | ORGANOMETALLIC COMPOUND, ORGANIC LIGHT-EMITTING DEVICE INCLUDING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE ORGANIC LIGHT-EMITTING DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18427328 | DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18463973 | ORGANIC LIGHT EMITTING DIODE AND ORGANIC LIGHT EMITTING DISPLAY DEVICE INCLUDING THE SAME | Final Rejection | LG Display Co., Ltd. |
| 18602927 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18496918 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18178902 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING LIGHT-EMITTING DEVICE | Final Rejection | Samsung Display Co., Ltd. |
| 18080907 | GALLIUM NITRIDE (GAN) WITH INTERLAYERS FOR INTEGRATED CIRCUIT TECHNOLOGY | Final Rejection | Intel Corporation |
| 18071257 | SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE | Final Rejection | Intel Corporation |
| 18631472 | Organic electroluminescent device | Final Rejection | The Regents of the University of Michigan |
| 18280600 | MANUFACTURING SYSTEM AND METHOD OF SEMICONDUCTOR DEVICE | Final Rejection | HITACHI HIGH-TECH CORPORATION |
| 17948453 | NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT | Final Rejection | NIKKISO CO., LTD. |
| 18679134 | HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWER SEMICONDUCTOR MODULE INCLUDING THE HEAT DISSIPATION SUBSTRATE, AND A POWER CONVERTER INCLUDING THE POWER SEMICONDUCTOR MODULE | Non-Final OA | LX SEMICON CO., LTD. |
| 18632485 | ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18610829 | TRANSISTOR MANUFACTURING METHOD | Non-Final OA | STMicroelectronics International N.V. |
| 18632599 | SCALED STACKED FET USING COMBINED STRUCTURES IN ADJACENT CELLS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18496941 | RADIO FREQUENCY DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18036938 | WAVELENGTH-CONVERTING NEAR-INFRARED OPTICAL RECEIVER AND METHOD | Final Rejection | KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY |
| 18716376 | METHOD FOR MANUFACTURING A 3D CIRCUIT WITH SHARED RECRYSTALLISATION AND DOPANT ACTIVATION STEPS | Non-Final OA | SOITEC |
| 17989775 | HYBRID BONDING OF A THIN SEMICONDUCTOR DIE | Non-Final OA | ASMPT Singapore Pte. Ltd. |
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