Tech Center 2800 • Art Units: 2821 2893
This examiner grants 71% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18483331 | SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS OF THE SAME, AND ELECTRONIC SYSTEMS INCLUDING SEMICONDUCTOR DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18450836 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18138339 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18020494 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18552067 | DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18497089 | SEMICONDUCTOR DEVICE | Non-Final OA | DENSO CORPORATION |
| 18533509 | ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18178902 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING LIGHT-EMITTING DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 17752586 | PIXEL WITH DIFFRACTIVE SCATTERING GRATING AND HIGH COLOR RESOLUTION ASSIGNING SIGNAL PROCESSING | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18091968 | BACKSIDE-CONNECTING VIA WITH NANOSHEET SPACERS FOR TRANSISTORS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18232580 | MEMORY DEVICES WITH PARTIALLY MISALIGNED GAP LOCATIONS AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18089491 | LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES | Non-Final OA | Intel Corporation |
| 18080907 | GALLIUM NITRIDE (GAN) WITH INTERLAYERS FOR INTEGRATED CIRCUIT TECHNOLOGY | Non-Final OA | Intel Corporation |
| 18071257 | SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE | Non-Final OA | Intel Corporation |
| 17356023 | SIGNAL AND GROUND VIAS IN A GLASS CORE TO CONTROL IMPEDANCE | Final Rejection | Intel Corporation |
| 17826776 | MEMORY DEVICE INCLUDING CONTACT STRUCTURES HAVING MULTI-LAYER DIELECTRIC LINER | Non-Final OA | Micron Technology, Inc. |
| 18454185 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18381269 | SUBSTRATE STAGE, SUBSTRATE PROCESSING APPARATUS, AND TEMPERATURE CONTROL METHOD | Non-Final OA | Tokyo Electron Limited |
| 18229471 | INFORMATION PROCESSING SYSTEM, POWER ADJUSTMENT METHOD, AND HEAT TREATMENT APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18390460 | OPTICAL SEMICONDUCTOR ELEMENT | Non-Final OA | HAMAMATSU PHOTONICS K.K. |
| 17339764 | APPARATUS AND METHOD FOR CONTROLLING WAFER UNIFORMITY | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18519056 | APPARATUS AND METHOD FOR FLIP CHIP LASER BONDING | Non-Final OA | PROTEC CO., LTD. |
| 18036938 | WAVELENGTH-CONVERTING NEAR-INFRARED OPTICAL RECEIVER AND METHOD | Non-Final OA | KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY |
| 17989775 | HYBRID BONDING OF A THIN SEMICONDUCTOR DIE | Final Rejection | ASMPT Singapore Pte. Ltd. |
| 18450435 | STACKED CHIP AND FABRICATION METHOD OF STACKED CHIP | Final Rejection | Tokyo Institute of Technology |
| 18169826 | DEVICE AND METHOD FOR WAFER BONDING ALIGNMENT | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18581213 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
| 18270663 | OPTOELECTRONIC DEVICE | Final Rejection | TCL TECHNOLOGY GROUP CORPORATION |
| 17948453 | NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT | Final Rejection | NIKKISO CO., LTD. |
| 18533720 | SEMICONDUCTOR DEVICE STRUCTURE WITH EFFICIENT HEAT-REMOVAL STRUCTURES ACROSS THE CHIP AND MONOLITHIC FABRICATION METHOD THEREFOR | Non-Final OA | Invention and Collaboration Laboratory, Inc. |
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