Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2821 2893
This examiner grants 71% of resolved cases
Ermias T. Woldegeorgis is an examiner in Tech Center 2800 and Art Unit 2821. He has 764 resolved cases with an allowance rate of 70.9 percent. This 70.9 percent rate suggests a favorable environment for applicants seeking patent grants. The median days to allowance of 1059 provides a timeline for the duration of the prosecution process for successful cases. Practitioners should use this timing metric to plan their patent strategy and manage expectations in Tech Center 2800.
The interview lift of 11.9 percent suggests that conducting an interview provides a measurable increase in the probability of a grant. This 11.9 percent lift is a metric for practitioners deciding whether to engage in direct communication with the examiner to resolve rejections. With 764 resolved cases, the data reflects a consistent examination history. The median days to allowance of 1059 is a useful figure for managing the expected timeline of a patent application. Utilizing the interview process can be a helpful component for navigating Art Unit 2821.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18660335 | SEMICONDUCTOR DEVICES INCLUDING CAPACITORS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18483331 | SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS OF THE SAME, AND ELECTRONIC SYSTEMS INCLUDING SEMICONDUCTOR DEVICES | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18450836 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Samsung Electronics Co., Ltd. |
| 18138339 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18552067 | DISPLAY PANEL AND DISPLAY APPARATUS | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18029883 | TO-BE-EVAPORATED SUBSTRATES, DISPLAY SUBSTRATES AND MANUFACTURING METHODS THEREOF | Final Rejection | BOE Technology Group Co., Ltd. |
| 18762142 | METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18663696 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18628716 | DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 18582115 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18533509 | ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE | Final Rejection | Samsung Display Co., Ltd. |
| 18178902 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING LIGHT-EMITTING DEVICE | Final Rejection | Samsung Display Co., Ltd. |
| 18020494 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18089491 | LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES | Non-Final OA | Intel Corporation |
| 18080907 | GALLIUM NITRIDE (GAN) WITH INTERLAYERS FOR INTEGRATED CIRCUIT TECHNOLOGY | Final Rejection | Intel Corporation |
| 18071257 | SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE | Final Rejection | Intel Corporation |
| 18806900 | SOLID-STATE IMAGING ELEMENT AND ELECTRONIC EQUIPMENT | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18631472 | Organic electroluminescent device | Final Rejection | The Regents of the University of Michigan |
| 18632599 | SCALED STACKED FET USING COMBINED STRUCTURES IN ADJACENT CELLS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18091968 | BACKSIDE-CONNECTING VIA WITH NANOSHEET SPACERS FOR TRANSISTORS | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18280600 | MANUFACTURING SYSTEM AND METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | HITACHI HIGH-TECH CORPORATION |
| 18639503 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 18651018 | FABRICATION METHOD FOR FORMING HIGH VOLTAGE RESISTOR NETWORKS OVER SILICON SUBSTRATES FOR USE WITHIN MULTICHIP MODULE ASSEMBLIES | Non-Final OA | Texas Instruments Incorporated |
| 18013749 | EXCLUSION RING FOR SUBSTRATE PROCESSING | Final Rejection | Lam Research Corporation |
| 17826776 | MEMORY DEVICE INCLUDING CONTACT STRUCTURES HAVING MULTI-LAYER DIELECTRIC LINER | Final Rejection | Micron Technology, Inc. |
| 18610829 | TRANSISTOR MANUFACTURING METHOD | Non-Final OA | STMicroelectronics International N.V. |
| 18785612 | APPARATUS AND METHOD OF MANUFACTURING INTERCONNECT STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18410734 | ONE-TIME-PROGRAMMABLE MEMORY ARRAY HAVING DIFFERENT DEVICE CHARACTERISTICS AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18232580 | MEMORY DEVICES WITH PARTIALLY MISALIGNED GAP LOCATIONS AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18789443 | Method of Manufacturing Semiconductor Devices Including The Steps of Removing One or More of the Nanotubes from the Stack of Nanotubes, and/or Removing Spacers that Surrounds Each of the Plurality of Nanotubes, and Forming Gate Dielectric and/or Gate Electrode to the Nanotubes | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
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