Prosecution Insights
Prosecution Insights
Technology area: Semiconductors, Circuits & Optics
20 pending office actions • 12 art units • 19 examiners • 0 of 20 (0%) have an AI response strategy ready • 38 patents granted in the last 365 days
CreeLED Inc. is managing 20 pending office actions in the Semiconductors, Circuits & Optics technology area. These actions are distributed among 19 distinct examiners, meaning only one examiner is handling more than one case for the company. The portfolio spans 12 distinct art units, indicating a high degree of technical variety for a relatively small number of actions.
YEMELYANOV, DMITRIY is the busiest examiner for the company, overseeing 2 pending office actions. With 20 total pending office actions and 19 distinct examiners, the prosecution environment is almost entirely unique for each application. The involvement of 12 distinct art units suggests that the company's work in semiconductors and optics is technically diverse. This requires a prosecution approach that is highly tailored to the specific requirements of 12 different art units and the individual preferences of 19 different examiners.
Based on the USPTO statutory response window for each pending office action. 4 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 4 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 6 (30%) |
| §102 only | 2 (10%) |
| Multi-statute (no §101) | 12 (60%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| YEMELYANOV, DMITRIY | 2 | 74.3% | +19.2% |
| ELAHI, TOWFIQ | 1 | 79.7% | +14.4% |
| CHAN, WEI | 1 | 74.6% | +13.8% |
| SMITH, BRADLEY | 1 | 79.9% | -2.9% |
| SONG, ZHENG B | 1 | 70.1% | +15.1% |
| OZDEN, ILKER NMN | 1 | 84.6% | +23.1% |
| ANYA, IGWE U | 1 | 85.0% | -3.7% |
| RAHMAN, MOHAMMAD A | 1 | 87.1% | +10.8% |
| NGUYEN, DAO H | 1 | 91.4% | +5.7% |
| WALL, VINCENT | 1 | 62.5% | +24.4% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18656839 | LIGHT COLLECTOR FOR LIGHT MIXING IN LIGHT EMITTING DIODE PACKAGES | RAHMAN, MOHAMMAD A | — |
| 18645598 | LANDING PAD STRUCTURES FOR CONTACTS IN LIGHT-EMITTING DIODE CHIPS AND RELATED METHODS | NGUYEN, DAO H | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17494264 | LUMIPHORIC MATERIAL ARRANGEMENTS FOR MULTIPLE-JUNCTION LIGHT-EMITTING DIODES | HSIEH, HSIN YI | 12d |
| 19414506 | LIGHT-EMITTING DIODE PACKAGES WITH VARYING CURRENT PULSE WIDTH MODULATION AND RELATED METHODS | ELAHI, TOWFIQ | — |
| 18770162 | LUMIPHORIC MATERIAL STRUCTURES WITHIN LIGHT-EMITTING DIODES AND RELATED METHODS | SMITH, BRADLEY | — |
| 18726858 | STRUCTURES FOR LIGHT-EMITTING DIODE PACKAGES WITH MULTIPLE LIGHT-EMITTING DIODE CHIPS | SONG, ZHENG B | — |
| 18745203 | LIGHT-DIRECTING STRUCTURES IN LIGHT-EMITTING DIODE DEVICES AND RELATED METHODS | OZDEN, ILKER NMN | — |
| 18669969 | LONG-PASS FILTER STRUCTURES FOR LIGHT-EMITTING DIODES | ANYA, IGWE U | — |
| 18597406 | ANCHORED ENCAPSULATION IN LED DEVICES | WALL, VINCENT | — |
| 18589641 | LIGHT-EMITTING DIODE CHIP STRUCTURES WITH ELECTRODE EXTENSIONS AND GRADIENT VIAS | XU, ZHIJUN | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17539678 | LIGHT-EMITTING DIODE CHIPS AND MANUFACTURING PROCESSES THEREOF | YEMELYANOV, DMITRIY | 29d |
| 19414506 | LIGHT-EMITTING DIODE PACKAGES WITH VARYING CURRENT PULSE WIDTH MODULATION AND RELATED METHODS | ELAHI, TOWFIQ | — |
| 19069965 | ACTIVE CONTROL OF LIGHT EMITTING DIODES AND LIGHT EMITTING DIODE DISPLAYS | CHAN, WEI | — |
| 18726858 | STRUCTURES FOR LIGHT-EMITTING DIODE PACKAGES WITH MULTIPLE LIGHT-EMITTING DIODE CHIPS | SONG, ZHENG B | — |
| 18745203 | LIGHT-DIRECTING STRUCTURES IN LIGHT-EMITTING DIODE DEVICES AND RELATED METHODS | OZDEN, ILKER NMN | — |
| 18656839 | LIGHT COLLECTOR FOR LIGHT MIXING IN LIGHT EMITTING DIODE PACKAGES | RAHMAN, MOHAMMAD A | — |
| 18597406 | ANCHORED ENCAPSULATION IN LED DEVICES | WALL, VINCENT | — |
| 17539685 | LIGHT-EMITTING DIODE CHIPS AND MANUFACTURING PROCESSES THEREOF | YEMELYANOV, DMITRIY | — |
| Art Unit | Apps |
|---|---|
| 2817 | 4 |
| 2898 | 2 |
| 2891 | 2 |
| 2625 | 1 |
| 2844 | 1 |
| 2875 | 1 |
| 2812 | 1 |
| 2818 | 1 |
| 2893 | 1 |
| 2815 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19414506 | LIGHT-EMITTING DIODE PACKAGES WITH VARYING CURRENT PULSE WIDTH MODULATION AND RELATED METHODS | ELAHI, TOWFIQ | 2625 | §102§103Other | Non-Final OA | — | Pending | Dec 10, 2025 |
| 19069965 | ACTIVE CONTROL OF LIGHT EMITTING DIODES AND LIGHT EMITTING DIODE DISPLAYS | CHAN, WEI | 2844 | §103 | Non-Final OA | — | Pending | Mar 04, 2025 |
| 18770162 | LUMIPHORIC MATERIAL STRUCTURES WITHIN LIGHT-EMITTING DIODES AND RELATED METHODS | SMITH, BRADLEY | 2817 | §102§103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18726858 | STRUCTURES FOR LIGHT-EMITTING DIODE PACKAGES WITH MULTIPLE LIGHT-EMITTING DIODE CHIPS | SONG, ZHENG B | 2875 | §102§103 | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18745203 | LIGHT-DIRECTING STRUCTURES IN LIGHT-EMITTING DIODE DEVICES AND RELATED METHODS | OZDEN, ILKER NMN | 2812 | §102§103 | Non-Final OA | — | Pending | Jun 17, 2024 |
| 18669969 | LONG-PASS FILTER STRUCTURES FOR LIGHT-EMITTING DIODES | ANYA, IGWE U | — | §102§103 | Non-Final OA | — | Pending | May 21, 2024 |
| 18656839 | LIGHT COLLECTOR FOR LIGHT MIXING IN LIGHT EMITTING DIODE PACKAGES | RAHMAN, MOHAMMAD A | — | §103 | Non-Final OA | — | Pending | May 07, 2024 |
| 18645598 | LANDING PAD STRUCTURES FOR CONTACTS IN LIGHT-EMITTING DIODE CHIPS AND RELATED METHODS | NGUYEN, DAO H | — | §102 | Non-Final OA | — | Pending | Apr 25, 2024 |
| 18597406 | ANCHORED ENCAPSULATION IN LED DEVICES | WALL, VINCENT | 2898 | §102§103 | Non-Final OA | — | Pending | Mar 06, 2024 |
| 18589641 | LIGHT-EMITTING DIODE CHIP STRUCTURES WITH ELECTRODE EXTENSIONS AND GRADIENT VIAS | XU, ZHIJUN | 2818 | §102§103 | Final Rejection | — | Pending | Feb 28, 2024 |
| 18508373 | ANCHORED LIGHT MIXING STRUCTURES IN LED PACKAGES AND RELATED METHODS | LIU, BENJAMIN T | 2893 | §102§103 | Final Rejection | — | Pending | Nov 14, 2023 |
| 18244354 | MULTI-PLANARITY OF LIGHT EMITTING SURFACES IN LED COMPONENTS | CHEN, DAVID Z | 2815 | §102 | Non-Final OA | 10d overdue | Pending | Sep 11, 2023 |
| 18446656 | MOUNTING STRUCTURES FOR EDGE-EMITTING SEMICONDUCTOR DEVICES | IQBAL, HAMNA FATHIMA | 2817 | §103 | Non-Final OA | — | Pending | Aug 09, 2023 |
| 18203868 | COVER STRUCTURE FOR BEAMSHAPING FOR LIGHT EMITTING DIODE PACKAGES | LIU, MIKKA H | 2817 | §102§103 | Non-Final OA | — | Pending | May 31, 2023 |
| 18093373 | SIDEWALL ARRANGEMENTS FOR LIGHT-EMITTING DIODE DEVICES AND RELATED METHODS | BELL, LAUREN R | 2896 | §103 | Non-Final OA | 26d | Pending | Jan 05, 2023 |
| 18055934 | LUMIPHORIC MATERIAL ARRANGEMENTS FOR COVER STRUCTURES OF LIGHT-EMITTING DIODE PACKAGES | RAHMAN, MOIN M | 2898 | §102§103§112 | Non-Final OA | — | Pending | Nov 16, 2022 |
| 17686943 | ENCAPSULATION ARRANGEMENTS IN LIGHT-EMITTING DIODE PACKAGES | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | — | Pending | Mar 04, 2022 |
| 17539678 | LIGHT-EMITTING DIODE CHIPS AND MANUFACTURING PROCESSES THEREOF | YEMELYANOV, DMITRIY | 2891 | §103 | Non-Final OA | 29d | Pending | Dec 01, 2021 |
| 17539685 | LIGHT-EMITTING DIODE CHIPS AND MANUFACTURING PROCESSES THEREOF | YEMELYANOV, DMITRIY | 2891 | §103§112 | Final Rejection | — | Pending | Dec 01, 2021 |
| 17494264 | LUMIPHORIC MATERIAL ARRANGEMENTS FOR MULTIPLE-JUNCTION LIGHT-EMITTING DIODES | HSIEH, HSIN YI | 2899 | §102§103§112 | Final Rejection | 12d | Pending | Oct 05, 2021 |
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