Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2817 2818 4100
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18674004 | SEMICONDUCTOR PACKAGE HAVING DIELECTRIC LAYER WITH STEP DIFFERENCE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18596240 | THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO.,LTD. |
| 18402021 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18244462 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 17932182 | Structure and Method of Fabrication for High Performance Integrated Passive Device | Non-Final OA | Apple Inc. |
| 18565028 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18695890 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18063529 | SEMICONDUCTOR APPARATUS AND ELECTRONIC DEVICE THAT INCLUDES SEMICONDUCTOR APPARATUS | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18691546 | DISPLAY DEVICE | Non-Final OA | Sharp Display Technology Corporation |
| 18051543 | ELECTRONIC DEVICE | Final Rejection | InnoLux Corporation |
| 17728147 | PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING | Non-Final OA | Intel Corporation |
| 18205364 | METHODS FOR MULTI-WAFER STACKING AND DICING | Final Rejection | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18078898 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18440172 | DISPLAY DEVICE, DISPLAY MODULE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18103494 | SEMICONDUCTOR DIE INCLUDING AN ASYMMETRIC PAD ARRAYS, A SEMICONDUCTOR DIE STACK INCLUDING THE SEMICONDUCTOR DIE, AND A HIGH BANDWIDTH MEMORY INCLUDING THE SEMICONDUCTOR DIE STACK | Non-Final OA | SK hynix Inc. |
| 17975071 | CONDUCTIVE PERFORATED PLATE FOR ELECTRICAL TEST | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18403007 | METHODS FOR MECHANICAL SELF-ALIGNMENT AND SLIP-RESISTANCE IN BONDING SEMICONDUCTOR SUBSTRATES, AND SEMICONDUCTOR DEVICES COMPRISING MECHANICAL SELF-ALIGNMENT STRUCTURES | Non-Final OA | Micron Technology, Inc. |
| 17105341 | SEMICONDUCTOR DEVICE STRUCTURE, STACKED SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18648917 | Die Stacking Structure and Method Forming Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18338107 | Multi-Level Stacking of Wafers and Chips | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17941987 | SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Kioxia Corporation |
| 18771873 | METHOD OF FORMING HARD MASK STRUCTURE | Non-Final OA | Tokyo Electron Limited |
| 18736957 | TRANSISTOR AND METHOD FOR MANUFACTURING SAME | Non-Final OA | Microchip Technology Incorporated |
| 18733196 | SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18665627 | NITRIDE SEMICONDUCTOR MODULE | Non-Final OA | ROHM CO., LTD. |
| 17839976 | ELECTRONIC CHIP | Final Rejection | STMicroelectronics (Rousset) SAS |
| 18159111 | FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS | Final Rejection | International Business Machines Corporation |
| 17663236 | PHASE CHANGE HETEROSTRUCTURES WITH CONTROLLED LINEAR DYNAMIC RANGE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17658487 | POWER DISTRIBUTION NETWORKS FOR SEMICONDUCTOR CHIP | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18421049 | SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AIR GAP AND METHOD OF MANUFACTURING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
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