Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2817 2818
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18117848 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18149709 | NONVOLATILE MEMORY DEVICES, METHODS OF MANUFACTURING NONVOLATILE MEMORY DEVICE, AND ELECTRONIC SYSTEMS INCLUDING NONVOLATILE MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18086086 | SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17749806 | Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18175267 | STEERED TRIM CUT | Final Rejection | Texas Instruments Incorporated |
| 17975071 | CONDUCTIVE PERFORATED PLATE FOR ELECTRICAL TEST | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17761516 | DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR | Non-Final OA | LG ELECTRONICS INC. |
| 17702551 | HEAT CONDUCTOR, HEAT-CONDUCTING MATERIAL, AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE | Non-Final OA | Huawei Technologies Co., Ltd. |
| 18564966 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18159111 | FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS | Non-Final OA | International Business Machines Corporation |
| 17983863 | DIAGONAL WIRING LEVEL WITH SKIP-LEVEL VIA CONNECTIONS | Non-Final OA | International Business Machines Corporation |
| 17937429 | STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17663236 | PHASE CHANGE HETEROSTRUCTURES WITH CONTROLLED LINEAR DYNAMIC RANGE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17658487 | POWER DISTRIBUTION NETWORKS FOR SEMICONDUCTOR CHIP | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18051543 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 17728147 | PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING | Final Rejection | Intel Corporation |
| 18344857 | METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17729893 | Metal Contact Isolation and Methods of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17105341 | SEMICONDUCTOR DEVICE STRUCTURE, STACKED SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18064134 | STACKED SEMICONDUCTOR DEVICE INCLUDING HYBRID BONDING STRUCTURE | Final Rejection | SK hynix Inc. |
| 18150034 | Packaged Memory Device and Method | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17872750 | Semiconductor Package and Method of Manufacturing the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18623879 | ELECTRONIC PACKAGE, MANUFACTURING METHOD FOR THE SAME, AND ELECTRONIC STRUCTURE | Final Rejection | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18221803 | SEMICONDUCTOR WAFER CONFIGURED FOR SINGLE TOUCH-DOWN TESTING | Final Rejection | SanDisk Technologies, Inc. |
| 18140085 | CIRCUIT PROBING PAD DESIGN IN SCRIBE LINE STRUCTURE AND METHOD FOR FABRICATING A SEMICONDUCTOR CHIP | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18061476 | TEST ELEMENT GROUP FOR METAL ROUTING LAYER AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 17955681 | PACKAGE STRUCTURE, PACKAGING METHOD AND SEMICONDUCTOR DEVICE | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18328190 | MICRO LIGHT-EMITTING CHIP STRUCTURE AND MICRO DISPLAY STRUCTURE | Final Rejection | PlayNitride Display Co., Ltd. |
| 17839976 | ELECTRONIC CHIP | Final Rejection | STMicroelectronics (Rousset) SAS |
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