Tech Center 2800 • Art Units: 2817 2818
This examiner grants 67% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18244462 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18149709 | NONVOLATILE MEMORY DEVICES, METHODS OF MANUFACTURING NONVOLATILE MEMORY DEVICE, AND ELECTRONIC SYSTEMS INCLUDING NONVOLATILE MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17659135 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17749806 | Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18175267 | STEERED TRIM CUT | Final Rejection | Texas Instruments Incorporated |
| 17975071 | CONDUCTIVE PERFORATED PLATE FOR ELECTRICAL TEST | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17761516 | DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR | Non-Final OA | LG ELECTRONICS INC. |
| 18063529 | SEMICONDUCTOR APPARATUS AND ELECTRONIC DEVICE THAT INCLUDES SEMICONDUCTOR APPARATUS | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 17702551 | HEAT CONDUCTOR, HEAT-CONDUCTING MATERIAL, AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE | Non-Final OA | Huawei Technologies Co., Ltd. |
| 18564966 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17655678 | Control Signal Route Through Backside Layers for High Performance Standard Cells | Non-Final OA | Apple Inc. |
| 18159111 | FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS | Non-Final OA | International Business Machines Corporation |
| 17983863 | DIAGONAL WIRING LEVEL WITH SKIP-LEVEL VIA CONNECTIONS | Non-Final OA | International Business Machines Corporation |
| 18344857 | METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18149789 | CRUCIFORM BONDING STRUCTURE FOR 3D-IC | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17729893 | Metal Contact Isolation and Methods of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17105341 | SEMICONDUCTOR DEVICE STRUCTURE, STACKED SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18051543 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 17728147 | PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING | Final Rejection | Intel Corporation |
| 18238848 | HIGH VOLTAGE DEVICE AND METHOD | Non-Final OA | Micron Technology, Inc. |
| 17943104 | TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE | Non-Final OA | Micron Technology, Inc. |
| 18103494 | SEMICONDUCTOR DIE INCLUDING AN ASYMMETRIC PAD ARRAYS, A SEMICONDUCTOR DIE STACK INCLUDING THE SEMICONDUCTOR DIE, AND A HIGH BANDWIDTH MEMORY INCLUDING THE SEMICONDUCTOR DIE STACK | Non-Final OA | SK hynix Inc. |
| 18096427 | STACKED INTEGRATED CIRCUIT CONFIGURED TO DISTINGUISH CHIPS WITHIN STACKED CHIPS | Non-Final OA | SK hynix Inc. |
| 18064134 | STACKED SEMICONDUCTOR DEVICE INCLUDING HYBRID BONDING STRUCTURE | Final Rejection | SK hynix Inc. |
| 17974205 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SK hynix Inc. |
| 18338107 | Multi-Level Stacking of Wafers and Chips | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17814995 | Sensor Package and Method | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17872750 | Semiconductor Package and Method of Manufacturing the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18239231 | CIRCUIT PROBING PAD DESIGN IN SCRIBE LINE STRUCTURE AND METHOD FOR FABRICATING A SEMICONDUCTOR CHIP | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18140085 | CIRCUIT PROBING PAD DESIGN IN SCRIBE LINE STRUCTURE AND METHOD FOR FABRICATING A SEMICONDUCTOR CHIP | Final Rejection | NANYA TECHNOLOGY CORPORATION |
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