Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 91% of resolved cases
Chevy Jacob Boegel is a patent examiner in Tech Center 2800, assigned to Art Unit 2812. He has 54 resolved cases in his record. The allowance rate pct for Boegel is 90.7, which is exceptionally high and indicates that nearly all applications he examines result in a patent grant. This 90.7 allowance rate pct suggests a very favorable environment for applicants in Art Unit 2812.
The median days to allowance is 1152, showing the typical timeframe for successful prosecution. Boegel has an interview lift pct of 4.9, which indicates a modest benefit from conducting an interview. Given that the baseline allowance rate pct is already 90.7, the 4.9 interview lift pct suggests that most cases reach allowance through standard written procedures. With 54 resolved cases and a 1152 median days to allowance, Boegel's profile reflects a high likelihood of success and a consistent pace of examination in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18439835 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18413172 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18116836 | PERPENDICULAR SHAPE ANISOTROPY DESIGN WITH DUAL SPIN FILTERING | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18841388 | DISPLAY MODULE AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18833110 | DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18833203 | Display Module, Heat Dissipation Film and Display Apparatus | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18607551 | MULTI-SIDED LIGHT-EMITTING DISPLAY APPARATUS | Final Rejection | Samsung Display Co., Ltd. |
| 18739679 | NITRIDE SEMICONDUCTOR DEVICE | Non-Final OA | Panasonic Holdings Corporation |
| 18432738 | Display Device | Final Rejection | LG Display Co., Ltd. |
| 18439895 | SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT | Final Rejection | Robert Bosch GmbH |
| 18625980 | DIE-FIRST METALLIZATION STRUCTURE AND SUBSTRATE INTERPOSER HYBRID PACKAGE | Non-Final OA | QUALCOMM Incorporated |
| 18215748 | INTEGRATED CIRCUIT STRUCTURES HAVING REDUCED END CAP | Non-Final OA | Intel Corporation |
| 18294686 | PHOTODETECTION DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18292638 | LIGHT DETECTION DEVICE AND ELECTRONIC APPARATUS | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18291466 | SEMICONDUCTOR PACKAGE | Non-Final OA | LG INNOTEK CO., LTD. |
| 18656237 | MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18389257 | FLIP CHIP QUAD FLAT NO LEADS (QFN) PACKAGE | Final Rejection | STMicroelectronics International N.V. |
| 18666982 | SEMICONDUCTOR STRUCTURE HAVING VERTICAL CHANNELS AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18413079 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18786693 | Interconnect Structure of Semiconductor Device and Method of Forming Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18715497 | TWO-TERMINAL TANDEM SOLAR MODULE | Non-Final OA | NATIONAL UNIVERSITY OF SINGAPORE |
| 18329317 | METHODS FOR MANUFACTURING ELECTRONIC PACKAGES AND ELECTRONIC ASSEMBLIES | Final Rejection | Skyworks Solutions, Inc. |
| 18790357 | SILICON CARBIDE SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18836937 | SILICON CARBIDE EPITAXIAL SUBSTRATE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE | Non-Final OA | MITSUMI ELECTRIC CO., LTD. |
| 18671208 | WAFER-SCALE LAYERED TWO-DIMENSIONAL MATERIAL TRANSFER METHOD | Non-Final OA | National Central University |
| 18608092 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | Final Rejection | EPISTAR CORPORATION |
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