Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 83% of resolved cases
Patrick Lawrence Cullen operates within Tech Center 2800 and Art Unit 2899, where he has managed 18 resolved cases. His allowance rate of 83.3% is the primary outcome metric for applicants in this group. This rate is achieved over a median of 1267 days to allowance, which is the timeframe for seeking a patent grant. Practitioners should factor this 1267-day duration into their prosecution strategies.
The data shows an interview lift of 30.0%, which highlights the results of direct communication with the examiner. This 30.0% increase in success probability is a factor when deciding whether to schedule an interview. With 18 resolved cases, the 1267 days to allowance represents the pace of his docket within the 2800 Tech Center. The 30.0% lift is a reason to engage in verbal advocacy to navigate the 83.3% allowance rate environment. These metrics provide a picture of his examination style in Art Unit 2899.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18830785 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18342182 | SOLID STATE DRIVE APPARATUS AND DATA STORAGE APPARATUS INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17860531 | INTERPOSER AND ELECTRONIC DEVICE INCLUDING INTERPOSER | Final Rejection | Samsung Electronics Co., Ltd. |
| 18550153 | LIGHT-EMITTING SUBSTRATE AND DISPLAY APPARATUS | Final Rejection | BOE Technology Group Co., Ltd. |
| 18790616 | DISPLAY PANEL | Non-Final OA | Samsung Display Co., LTD. |
| 18635862 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18043857 | THERMOCONDUCTIVE MATERIAL AND ELECTRONIC COMPONENT | Final Rejection | Panasonic Intellectual Property Management Co., Ltd. |
| 18473976 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY APPARATUS COMPRISING THE SAME | Non-Final OA | LG DISPLAY CO., LTD. |
| 17615341 | SPLICED DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18473803 | MULTI-LAYER DIELECTRIC GATE SPACER FOR FIN FIELD EFFECT TRANSISTORS (FINFET) AND GATE-ALL-AROUND (GAA) DEVICES | Non-Final OA | QUALCOMM Incorporated |
| 18146326 | DIRECTLY BONDED FRAME WAFERS | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 17798100 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR | Final Rejection | Mitsubishi Electric Corporation |
| 18838402 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18018286 | Power Semiconductor Module and Method for Producing a Power Semiconductor Module | Non-Final OA | Siemens Aktiengesellschaft |
| 18167912 | Three-Dimensional Device Package with Vertical Heat Pipes | Final Rejection | MARVELL ASIA PTE LTD |
| 18142106 | Semiconductor Package Comprising Structures Configured to Withstand a Change of the Volume of a Potting Compound | Non-Final OA | Infineon Technologies AG |
| 17949485 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18902251 | SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER | Non-Final OA | Texas Instruments Incorporated |
| 18520527 | SEMICONDUCTOR PROCESSING INTEGRATION FOR BIPOLAR JUNCTION TRANSISTOR (BJT) | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18140375 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND SYSTEM | Non-Final OA | STMicroelectronics S.r.l. |
| 18499235 | CHIP STACKING STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17739259 | Semiconductor Device Including Air Spacer and Method of Manufacture | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17541702 | METHODS FOR SEAMLESS GAP FILLING USING GRADIENT OXIDATION | Final Rejection | Applied Materials, Inc. |
| 17985607 | LIGHT-EMITTING DEVICE | Non-Final OA | TIANJIN SANAN OPTOELECTRONICS CO., LTD. |
| 17737582 | MOTION SENSOR ROBUSTNESS UTILIZING A ROOM-TEMPERATURE-VOLCANIZING MATERIAL VIA A SOLDER RESIST DAM | Non-Final OA | INVENSENSE, INC. |
| 17887530 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18093497 | SEMICONDUCTOR STRUCTURE | Final Rejection | Semiconductor Manufacturing International (Beijing) Corporation |
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