Prosecution Insights
Last updated: May 29, 2026

Examiner: CULLEN, PATRICK LAWRENCE

Tech Center 2800 • Art Units: 2899

This examiner grants 87% of resolved cases

Performance Statistics

86.7%
Allow Rate
+18.7% vs TC avg
66
Total Applications
+25.0%
Interview Lift
1263
Avg Prosecution Days
Based on 15 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
2.7%
§102 Novelty
96.0%
§103 Obviousness
1.3%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18204241 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18158233 INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18090856 SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME Final Rejection Samsung Electronics Co., Ltd.
18550153 LIGHT-EMITTING SUBSTRATE AND DISPLAY APPARATUS Non-Final OA BOE Technology Group Co., Ltd.
17773106 SUBSTRATE INTEGRATED WITH PASSIVE DEVICES AND MANUFACTURING METHOD THEREOF Non-Final OA BOE TECHNOLOGY GROUP CO., LTD.
17541702 METHODS FOR SEAMLESS GAP FILLING USING GRADIENT OXIDATION Non-Final OA Applied Materials, Inc.
17985607 LIGHT-EMITTING DEVICE Final Rejection TIANJIN SANAN OPTOELECTRONICS CO., LTD.
17929437 SEMICONDUCTOR MEMORY DEVICE Non-Final OA Kioxia Corporation
17651329 Oxygen-Free Protection Layer Formation in Wafer Bonding Process Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18167912 Three-Dimensional Device Package with Vertical Heat Pipes Non-Final OA MARVELL ASIA PTE LTD
18334396 GAS-PERMEABLE PACKAGE LID OF CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Final Rejection Industrial Technology Research Institute
17661749 SEMICONDUCTOR DEVICE Final Rejection NANYA TECHNOLOGY CORPORATION
17887530 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Non-Final OA UNITED MICROELECTRONICS CORP.
18146326 DIRECTLY BONDED FRAME WAFERS Final Rejection ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
18093497 SEMICONDUCTOR STRUCTURE Non-Final OA Semiconductor Manufacturing International (Beijing) Corporation
17919154 SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME Final Rejection UltraMemory Inc.

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