Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18342182 | SOLID STATE DRIVE APPARATUS AND DATA STORAGE APPARATUS INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18205139 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18204241 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17860531 | INTERPOSER AND ELECTRONIC DEVICE INCLUDING INTERPOSER | Final Rejection | Samsung Electronics Co., Ltd. |
| 18389429 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18473976 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY APPARATUS COMPRISING THE SAME | Non-Final OA | LG DISPLAY CO., LTD. |
| 18635862 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18790616 | DISPLAY PANEL | Non-Final OA | Samsung Display Co., LTD. |
| 18473803 | MULTI-LAYER DIELECTRIC GATE SPACER FOR FIN FIELD EFFECT TRANSISTORS (FINFET) AND GATE-ALL-AROUND (GAA) DEVICES | Non-Final OA | QUALCOMM Incorporated |
| 17831100 | HEAT REMOVAL IN INTEGRATED CIRCUITS WITH TRANSISTORS AND DOUBLE-SIDED METAL INTERCONNECTS | Final Rejection | Intel Corporation |
| 18028850 | THERMAL PAD, HEAT DISSIPATION MODULE, AND ELECTRONIC DEVICE | Non-Final OA | Honor Device Co., Ltd. |
| 18160979 | HEAT DISSIPATING SYSTEM FOR ELECTRONIC DEVICES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18018286 | Power Semiconductor Module and Method for Producing a Power Semiconductor Module | Non-Final OA | Siemens Aktiengesellschaft |
| 17798100 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR | Final Rejection | Mitsubishi Electric Corporation |
| 18497654 | SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER | Non-Final OA | SK hynix Inc. |
| 17949485 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18520527 | SEMICONDUCTOR PROCESSING INTEGRATION FOR BIPOLAR JUNCTION TRANSISTOR (BJT) | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18499235 | CHIP STACKING STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17889868 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17647263 | SEMICONDUCTOR INTERCONNECT STRUCTURES AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 17541702 | METHODS FOR SEAMLESS GAP FILLING USING GRADIENT OXIDATION | Final Rejection | Applied Materials, Inc. |
| 18368302 | Inductive Heatable Particles in Semiconductor Module | Non-Final OA | Infineon Technologies AG |
| 18140375 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND SYSTEM | Non-Final OA | STMicroelectronics S.r.l. |
| 17965254 | BOTTOM ENHANCED LINER-LESS VIA CONTACT FOR REDUCED MOL RESISTANCE | Non-Final OA | International Business Machines Corporation |
| 17887530 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | UNITED MICROELECTRONICS CORP. |
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