Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2141 2812 2823 2826 2896 2897 4100
This examiner grants 73% of resolved cases
Bitew A. Dinke has managed 785 resolved cases in Art Unit 2141 within Tech Center 4100. The examiner's allowance rate is 72.9%, and the median days to allowance is 839. The interview lift of 12.4% suggests that interviews are a productive way to advance prosecution and improve the likelihood of a favorable outcome. This profile indicates a solid and predictable environment for applicants.
Practitioners in Tech Center 4100 can expect a solid 72.9% baseline success rate that is further improved by the 12.4% interview lift. The 839-day median to allowance is an efficient timeline for this tech center. With 785 resolved cases, the data provides a reliable foundation for strategic planning. Applicants should consider the 12.4% lift as a meaningful reason to engage the examiner directly, especially if written responses do not immediately lead to an allowance. The combination of the 72.9% rate and 839-day median makes this a favorable profile for patent prosecution in Art Unit 2141.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18731574 | SENSOR, IMAGE SENSOR, DISPLAY PANEL, AND DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18588586 | SEMICONDUCTOR DEVICE HAVING ASYMMETRICAL SOURCE/DRAIN | Final Rejection | Samsung Electronics Co., Ltd. |
| 18473665 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18735220 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., Ltd. |
| 18663084 | DISPLAY APPARATUS | Final Rejection | Samsung Display Co., Ltd. |
| 18650091 | DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18746015 | MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING METHOD FOR LAMINATE, LAMINATE, MANUFACTURING METHOD FOR DEVICE, AND DEVICE, AND COMPOSITION FOR FORMING POLYIMIDE-CONTAINING PRECURSOR PORTION | Non-Final OA | FUJIFILM Corporation |
| 18849265 | DISPLAY DEVICE | Non-Final OA | LG DISPLAY CO., LTD. |
| 18454273 | THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREOF AND DISPLAY APPARATUS COMPRISING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18780099 | METHOD OF MANUFACTURING OPTICAL MEMBER, AND LIGHT EMITTING DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18755275 | LIGHT-EMITTING DEVICE AND LIGHT-EMITTING MODULE | Non-Final OA | NICHIA CORPORATION |
| 18090879 | MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAVING ROUGHENED BUMP STRUCTURES | Non-Final OA | Intel Corporation |
| 18722110 | Display Device | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18707987 | MEMORY ELEMENT AND MEMORY DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18558614 | IMAGE DISPLAY DEVICE AND ELECTRONIC DEVICE | Final Rejection | Sony Semiconductor Solutions Corporation |
| 18468556 | Reduction of Edge Transistor Leakage on N-Type EDMOS and LDMOS Devices | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18773742 | STRESSED PFET NANOSHEETS | Non-Final OA | International Business Machines Corporation |
| 18443354 | SEMICONDUCTOR DEVICE AND CORRESPONDING METHODS OF MANUFACTURE | Final Rejection | Infineon Technologies Austria AG |
| 18731791 | DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | Wuhan Tianma Micro-Electronics Co., Ltd. |
| 18629732 | QUANTUM PHASED ARRAYS | Non-Final OA | California Institute of Technology |
| 18606182 | MAGNETIC MEMORY DEVICE | Final Rejection | Kioxia Corporation |
| 18668134 | SEMICONDUCTOR DEVICES WITH A CURRENT GAIN LAYOUT | Non-Final OA | Micron Technology, Inc. |
| 18659666 | APPARATUS AND MEMORY DEVICE INCLUDING SPIRAL TSV CONNECTION | Non-Final OA | MICRON TECHNOLOGY, INC. |
| 18416079 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING RIBBON, APPARATUS AND DEVICE | Non-Final OA | STMicroelectronics International N.V. |
| 18783518 | Epitaxial Source/Drain Structures for Multigate Devices and Methods of Fabricating Thereof | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18784139 | SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18765271 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18631274 | SEMICONDUCTOR STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18618063 | TFT WITH HYDROGEN ABSORPTION LAYER AND METHOD FOR FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18428230 | METHOD FOR FORMING FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
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