Tech Center 2800 • Art Units: 2818 2892
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18390268 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18333084 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18140905 | INTEGRATED CIRCUIT DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18308222 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18380497 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY APPARATUS COMPRISING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 17877976 | LOCOS OR SIBLK TO PROTECT DEEP TRENCH POLYSILICON IN DEEP TRENCH AFTER STI PROCESS | Final Rejection | Texas Instruments Incorporated |
| 18481648 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18080413 | DISPLAY DEVICE AND TILED DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18555754 | SEMICONDUCTOR DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18324936 | SILICON CARBIDE SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18187683 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18160554 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18529255 | OFFSET STAGGERED STACKED FIELD EFFECT TRANSISTOR (SFET) DEVICES | Non-Final OA | International Business Machines Corporation |
| 18348579 | FORMING CROSSBAR AND NON-CROSSBAR TRANSISTORS ON THE SAME SUBSTRATE | Non-Final OA | International Business Machines Corporation |
| 18771753 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18770792 | VARIABLE SIZE FIN STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18756105 | METHOD OF FABRICATING MAGNETO-RESISTIVE RANDOM ACCESS MEMORY (MRAM) | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18181678 | SPACER STRUCTURES AND CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17886461 | PACKAGE AND FABRICATION METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17561681 | HIGH BANDWIDTH AND CAPACITY APPROACHES FOR STITCHED DIES | Non-Final OA | Intel Corporation |
| 17479155 | THIN FILM TRANSISTORS HAVING FIN STRUCTURES INTEGRATED WITH 2D CHANNEL MATERIALS | Final Rejection | Intel Corporation |
| 18175360 | LIGHT SENSOR MANUFACTURING METHOD | Non-Final OA | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18160002 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18536945 | METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT | Non-Final OA | NICHIA CORPORATION |
| 18490363 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18345233 | REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID OUTSIDE OF AN AREA CONTACTING A DIE | Non-Final OA | ADVANCED MICRO DEVICES, INC. |
| 18482163 | FOUR-LAYER SEMICONDUCTOR DEVICE AND ESD PROTECTION CIRCUIT | Non-Final OA | NEXPERIA B.V. |
| 18053444 | DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS | Non-Final OA | Shanghai Tianma Micro-Electronics Co., Ltd. |
| 17829719 | MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK | Final Rejection | Sandisk Technologies, Inc. |
| 18183216 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | MIRISE Technologies Corporation |
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