Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2872 2892
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18643087 | SEMICONDUCTOR DEVICE INCLUDING VERTICAL CHANNEL HAVING TUBE SHAPE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18416608 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18407893 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18555754 | SEMICONDUCTOR DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18175360 | LIGHT SENSOR MANUFACTURING METHOD | Final Rejection | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18531368 | DETECTION DEVICE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | Magnolia White Corporation |
| 18418645 | DEPOSITION MASK, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE MANUFACTURED USING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18402310 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18392226 | TILED DISPLAY DEVICE AND DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17561681 | HIGH BANDWIDTH AND CAPACITY APPROACHES FOR STITCHED DIES | Final Rejection | Intel Corporation |
| 19228512 | MICROELECTRONIC ASSEMBLIES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18053444 | DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY APPARATUS | Final Rejection | Shanghai Tianma Micro-Electronics Co., Ltd. |
| 18406068 | HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES | Non-Final OA | Micron Technology, Inc. |
| 18431140 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18425264 | THERMAL CONDUCTIVE BARRIER LAYER IN INTERCONNECT STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18409806 | SEMICONDUCTOR STRUCTURE INCLUDING PHOTODETECTOR AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18780081 | MULTIPLE-MASK MULTIPLE-EXPOSURE LITHOGRAPHY AND MASKS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18495495 | Packages with Power Switches and Power User Circuits Separated in Different Dies | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17735536 | MULTI-INTERPOSER STRUCTURES AND METHODS OF MAKING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18631384 | METHODS FOR BOW COMPENSATION USING TENSILE NITRIDE | Non-Final OA | Applied Materials, Inc. |
| 18345233 | REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID OUTSIDE OF AN AREA CONTACTING A DIE | Final Rejection | ADVANCED MICRO DEVICES, INC. |
| 18590048 | MULTI-TIER MEMORY ARRAY INCLUDING LATERALLY-STAGGERED STAIRCASES AND METHOD OF MAKING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18531855 | ANGLED EPITAXY CUT | Non-Final OA | International Business Machines Corporation |
| 18522307 | QUANTUM DOT SUBSTRATE, METHOD OF MANUFACTURING THEREOF, AND DISPLAY PANEL | Non-Final OA | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18423827 | THREE DIMENSIONAL SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18482176 | Semiconductor Device | Non-Final OA | NEXPERIA B.V. |
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