Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2892
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18390268 | LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18308222 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18380497 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY APPARATUS COMPRISING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18481648 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18080413 | DISPLAY DEVICE AND TILED DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18555754 | SEMICONDUCTOR DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18324936 | SILICON CARBIDE SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18187683 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18529255 | OFFSET STAGGERED STACKED FIELD EFFECT TRANSISTOR (SFET) DEVICES | Non-Final OA | International Business Machines Corporation |
| 18515560 | SEMICONDUCTOR STRUCTURES HAVING ANGLED DIELECTRIC BARS ATTACHED TO NANOSHEET CHANNEL LAYERS | Non-Final OA | International Business Machines Corporation |
| 17561681 | HIGH BANDWIDTH AND CAPACITY APPROACHES FOR STITCHED DIES | Non-Final OA | Intel Corporation |
| 18160002 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18506359 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | ROHM CO., LTD. |
| 18480978 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18175360 | LIGHT SENSOR MANUFACTURING METHOD | Non-Final OA | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18770792 | VARIABLE SIZE FIN STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18756105 | METHOD OF FABRICATING MAGNETO-RESISTIVE RANDOM ACCESS MEMORY (MRAM) | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18181678 | SPACER STRUCTURES AND CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18490363 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18482176 | Semiconductor Device | Non-Final OA | NEXPERIA B.V. |
| 18482163 | FOUR-LAYER SEMICONDUCTOR DEVICE AND ESD PROTECTION CIRCUIT | Non-Final OA | NEXPERIA B.V. |
| 18183216 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | MIRISE Technologies Corporation |
| 18495339 | METHOD OF FORMING MEMORY STRUCTURE | Non-Final OA | Winbond Electronics Corp. |
| 18137491 | TRANSISTORS WITH FIELD-SHIELD CONTACTS AND BASE CONTACTS | Non-Final OA | GlobalFoundries U.S. Inc. |
| 17735536 | MULTI-INTERPOSER STRUCTURES AND METHODS OF MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18560924 | THIN FILM DEPOSITION METHOD | Non-Final OA | JUSUNG ENGINEERING CO., LTD. |
| 18495100 | PHOTODIODE STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan-Asia Semiconductor Corporation |
| 18454895 | METHODS OF PREPARING SILICON-ON-INSULATOR STRUCTURES USING EPITAXIAL WAFERS | Non-Final OA | GlobalWafers Co., Ltd. |
| 18138380 | Semiconductor Structure and Method for Forming the Same | Non-Final OA | SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING CORPORATION |
| 18096121 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | Final Rejection | Semiconductor Manufacturing International (Shanghai) Corporation |
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