Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 84% of resolved cases
Jonathan Han is an examiner in Art Unit 2818 within Tech Center 2800. The examiner has a high volume of 1285 resolved cases and an allowance rate of 83.8 percent. This large dataset suggests a very consistent and favorable environment for applicants. The 83.8 percent rate indicates that the vast majority of applications assigned to this examiner eventually reach an allowance.
The median time to allowance is 878 days. This duration reflects an efficient prosecution process, allowing applicants to secure patent rights relatively quickly. The 878-day figure provides a reliable benchmark for estimating the timeline from filing to grant in Art Unit 2818. Practitioners can use this median to help clients plan their intellectual property portfolios and commercialization schedules.
The interview lift for this examiner is 9.6 percent. While the allowance rate is already high at 83.8 percent, an interview still provides a measurable increase in the likelihood of success. The 9.6 percent lift suggests that direct communication can be a useful tool for resolving any remaining issues. Given the 1285 resolved cases, the data provides a high degree of confidence in these prosecution trends.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18769823 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18732941 | IMAGE SENSORS AND METHODS OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18610514 | SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18837612 | Display Substrate, Preparation Method Therefor, and Display Apparatus | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18747741 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18671005 | SEMICONDUCTOR DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18663477 | METHOD FOR PRODUCING A POWER MODULE WITH SINTERED HEAT SINK | Non-Final OA | Robert Bosch GmbH |
| 16803887 | INTERPOSER HEAT SPREADER | Non-Final OA | Intel Corporation |
| 18543663 | FORKSHEET DEVICE WITH WRAPPED CONTACT | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18822849 | VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18782923 | HYBRID WIRE SIZE DIAMETER UNDER ONE SINGLE DIE | Non-Final OA | Micron Technology, Inc. |
| 18789988 | METHOD OF MAKING SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18398937 | PHOTONICS DEVICE WITH BACKSIDE TRANSMISSIVE REGION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18835577 | Method and Apparatus for Forming Backside Power Rails | Non-Final OA | Applied Materials, Inc. |
| 18613525 | MEMORY DEVICES AND METHODS OF FORMING THE SAME | Non-Final OA | Applied Materials, Inc. |
| 18182856 | DISPLAY PIXELS MADE FROM STACKED MICRO-LED STRUCTURES AND PHOTOLUMINESCENT MATERIALS | Final Rejection | Applied Materials, Inc. |
| 18307173 | APPLICATIONS OF TWO-DIMENSIONAL SILICON CARBIDE AS THE CHANNEL LAYER IN FIELD-EFFECT TRANSISTORS | Final Rejection | UNM RAINFOREST INNOVATIONS |
| 18471003 | Corrosion Resistant Metal Structures for Wide Bandgap Semiconductor Devices | Non-Final OA | Wolfspeed, Inc. |
| 18908007 | METHODS AND STRUCTURES FOR GENERATING SMOOTH ELECTRODES AND ELECTRODE STRUCTURES WITH A UNIFORMLY SMOOTH SURFACE | Non-Final OA | Qorvo US, Inc. |
| 18675145 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18730779 | SYSTEM AND METHODS FOR MANUFACTURING A CRISSCROSS MATRIX OF SOLAR CELLS | Non-Final OA | SOLARWAT LTD. |
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