Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2898
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18826981 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18761415 | ELECTRONIC DEVICE INCLUDING A SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE ELECTRONIC DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18713663 | DISPLAY SUBSTRATE AND DRIVE METHOD AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18228934 | OPTIMAL HIGH VOLTAGE TUB DESIGN WITH FLOATING POLY TRENCHES | Non-Final OA | NXP B.V. |
| 19069197 | ORGANIC LIGHT EMITTING DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18771623 | METHOD OF MANUFACTURING FILM ASSEMBLY FOR TRANSFERRING LIGHT EMITTING ELEMENT, FILM ASSEMBLY, AND METHOD OF MANUFACTURING DISPLAY DEVICE USING FILM ASSEMBLY | Non-Final OA | Samsung Display Co., LTD. |
| 17365044 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Panasonic Intellectual Property Management Co., Ltd. |
| 18655448 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | InnoLux Corporation |
| 18498836 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18315787 | POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINTED CIRCUIT BOARD | Non-Final OA | Infineon Technologies AG |
| 17712738 | SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER | Non-Final OA | Infineon Technologies AG |
| 18435064 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 17488586 | PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING | Final Rejection | Texas Instruments Incorporated |
| 18424709 | MICROELECTRONIC DEVICES INCLUDING VERTICAL PLANAR MEMORY CELL STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 18366531 | Dopant Concentration Boost in Epitaxially Formed Material | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17814525 | WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17701997 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH GATE STACK | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18788881 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18783597 | MULTIPLE THRESHOLD VOLTAGE IMPLEMENTATION THROUGH LANTHANUM INCORPORATION | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18779190 | STRESS-INDUCING SILICON LINER IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18785091 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED |
| 18427897 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18169492 | Electroless Die-Attach Process for Semiconductor Packaging | Non-Final OA | Wolfspeed, Inc. |
| 17935509 | HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | Non-Final OA | Wolfspeed, Inc. |
| 18836043 | SUBSTRATE FOR HIGH-FREQUENCY DEVICE, AND METHOD FOR PRODUCING SAME | Non-Final OA | SHIN-ETSU HANDOTAI CO., LTD. |
| 18722778 | METHOD FOR MANUFACTURING DISASSEMBLABLE SUBSTRATES | Non-Final OA | SOITEC |
| 17662641 | NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP PACKAGE STRUCTURE, AND METHOD FOR PACKAGING CHIP | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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