Tech Center 2800 • Art Units: 2812 2898
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18386328 | IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17488586 | PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING | Non-Final OA | Texas Instruments Incorporated |
| 17000146 | SOLDER PRINTING | Non-Final OA | Texas Instruments Incorporated |
| 17365044 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 17938296 | SEMICONDUCTOR APPARATUS | Non-Final OA | Mitsubishi Electric Corporation |
| 17537788 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Mitsubishi Electric Corporation |
| 17712738 | SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER | Non-Final OA | Infineon Technologies AG |
| 17633921 | HEAT SINK FOR IC COMPONENT AND IC HEAT SINK ASSEMBLY | Non-Final OA | HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED |
| 18360510 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Ltd. |
| 17814525 | WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17701997 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH GATE STACK | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 16490504 | DIELECTRIC LINING LAYERS FOR SEMICONDUCTOR DEVICES | Final Rejection | Intel Corporation |
| 16826651 | VIAS AND CONDUCTIVE ROUTING LAYERS IN SEMICONDUCTOR SUBSTRATES | Non-Final OA | Micron Technology, Inc. |
| 17872568 | DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME | Non-Final OA | FURUKAWA ELECTRIC CO., LTD. |
| 18505131 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 17645794 | METHODS OF FORMING SEMICONDUCTOR DEVICES | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18410060 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18510091 | METHOD OF FORMING SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17819381 | Semiconductor Device and Method of Manufacture | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18228934 | OPTIMAL HIGH VOLTAGE TUB DESIGN WITH FLOATING POLY TRENCHES | Non-Final OA | NXP B.V. |
| 17380769 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE | Non-Final OA | NEXPERIA B.V. |
| 17673150 | Semiconductor Device with Protective Layer | Non-Final OA | SANDISK TECHNOLOGIES, INC. |
| 17834952 | ELECTRONIC DEVICE | Non-Final OA | ASUSTeK COMPUTER INC. |
| 17928134 | METHOD AND DEVICE FOR BONDING SUBSTRATES | Final Rejection | EV Group E. Thallner GmbH |
| 17942233 | SEMICONDUCTOR DEVICE STRUCTURES ISOLATED BY POROUS SEMICONDUCTOR MATERIAL | Non-Final OA | GlobalFoundries U.S. Inc. |
| 17458751 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED |
| 17807847 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 17662641 | NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP PACKAGE STRUCTURE, AND METHOD FOR PACKAGING CHIP | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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