Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2898
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18761415 | ELECTRONIC DEVICE INCLUDING A SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE ELECTRONIC DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18689583 | Display Panel and Display Apparatus | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18679058 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18632178 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18524571 | BRIDGE DIE IN SUBSTRATE CORE LAYER | Non-Final OA | QUALCOMM Incorporated |
| 18140146 | THROUGH-SILICON VIA DIE | Non-Final OA | Intel Corporation |
| 18498836 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 16534104 | PLACE-AND-ROUTE RESISTANCE AND CAPACITANCE OPTIMIZATION USING MULTI-HEIGHT INTERCONNECT TRENCHES AND AIR GAP DIELECTRICS | Final Rejection | SK Hynix NAND Product Solutions Corp. (dba Solidigm) |
| 18505125 | BONDING STRUCTURE AND STACK TYPE SEMICONDUCTOR DEVICE INCLUDING THE SAME | Non-Final OA | SK hynix Inc. |
| 18395593 | POLYMERIC DIE PAD FOR DIE ISOLATION IN CHIP ON LEAD PACKAGE | Non-Final OA | Texas Instruments Incorporated |
| 17944143 | SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17000146 | SOLDER PRINTING | Non-Final OA | Texas Instruments Incorporated |
| 18424709 | MICROELECTRONIC DEVICES INCLUDING VERTICAL PLANAR MEMORY CELL STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 17231313 | METHOD OF MANUFACTURING MICROELECTRONIC DEVICES AND RELATED MICROELECTRONIC DEVICES, TOOLS, AND APPARATUS | Final Rejection | Micron Technology, Inc. |
| 18366531 | Dopant Concentration Boost in Epitaxially Formed Material | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17701997 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH GATE STACK | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18788881 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18779190 | STRESS-INDUCING SILICON LINER IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17819381 | Semiconductor Device and Method of Manufacture | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17541582 | METHODS FOR FORMING WORK FUNCTION MODULATING LAYERS | Non-Final OA | Applied Materials, Inc. |
| 16520597 | Adhesion Enhancing Structures for a Package | Non-Final OA | Infineon Technologies AG |
| 17962634 | OXIDE FIELD TRENCH POWER MOSFET WITH A MULTI EPITAXIAL LAYER SUBSTRATE CONFIGURATION | Non-Final OA | STMicroelectronics Pte Ltd |
| 17692229 | PACKAGED HALF-BRIDGE CIRCUIT | Non-Final OA | NEXPERIA B.V. |
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