Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2898
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18386328 | IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17488586 | PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING | Non-Final OA | Texas Instruments Incorporated |
| 17000146 | SOLDER PRINTING | Non-Final OA | Texas Instruments Incorporated |
| 18498836 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 17537788 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Mitsubishi Electric Corporation |
| 18315787 | POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINTED CIRCUIT BOARD | Non-Final OA | Infineon Technologies AG |
| 17712738 | SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER | Non-Final OA | Infineon Technologies AG |
| 16937644 | Power Semiconductor Device and Manufacturing Method | Final Rejection | Infineon Technologies AG |
| 16826651 | VIAS AND CONDUCTIVE ROUTING LAYERS IN SEMICONDUCTOR SUBSTRATES | Non-Final OA | Micron Technology, Inc. |
| 18486382 | SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18360510 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Ltd. |
| 18099097 | SEMICONDUCTOR MANUFACTURING METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17814525 | WAFER-ON-WAFER PACKAGING WITH CONTINUOUS SEAL RING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17701997 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH GATE STACK | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18510091 | METHOD OF FORMING SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17819381 | Semiconductor Device and Method of Manufacture | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17633921 | HEAT SINK FOR IC COMPONENT AND IC HEAT SINK ASSEMBLY | Non-Final OA | HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED |
| 17380769 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE | Non-Final OA | NEXPERIA B.V. |
| 17834952 | ELECTRONIC DEVICE | Non-Final OA | ASUSTeK COMPUTER INC. |
| 17673150 | Semiconductor Device with Protective Layer | Non-Final OA | SANDISK TECHNOLOGIES, INC. |
| 17458751 | SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED |
| 17662641 | NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP PACKAGE STRUCTURE, AND METHOD FOR PACKAGING CHIP | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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