| 19241981 |
LOCALLY UNIQUE MAC ADDRESS RESOLUTION |
Semiconductor Components Industries, LLC |
MORLAN, ROBERT M |
2409 |
§102§103 |
Non-Final OA |
— |
Pending |
Jun 18, 2025 |
| 19042666 |
LOW POWER PHASE DETECTION |
Semiconductor Components Industries, LLC |
JEAN PIERRE, PEGUY |
2845 |
§102§103 |
Non-Final OA |
— |
Pending |
Jan 31, 2025 |
| 19034535 |
INDUCTIVE ANGULAR POSITION SENSOR |
Semiconductor Components Industries, LLC |
ALLGOOD, ALESA M |
2858 |
§103§112 |
Non-Final OA |
— |
Pending |
Jan 22, 2025 |
| 19018146 |
HARMONIC DISTORTION REDUCTION IN INDUCTIVE POSITION SENSORS |
Semiconductor Components Industries, LLC |
GONZALEZ, MILTON |
2852 |
Other |
Non-Final OA |
— |
Pending |
Jan 13, 2025 |
| 18955820 |
FAULT PROTECTION TESTING IN A HIGH-POWER SWITCHING SYSTEM |
Semiconductor Components Industries, LLC |
JACKSON, STEPHEN W |
2838 |
DP |
Non-Final OA |
— |
Pending |
Nov 21, 2024 |
| 18933202 |
JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS |
Semiconductor Components Industries, LLC |
VU, VU A |
2897 |
§102§103 |
Non-Final OA |
— |
Pending |
Oct 31, 2024 |
| 18917293 |
SECURE SERIAL BUS WITH AUTOMOTIVE APPLICATIONS |
Semiconductor Components Industries, LLC |
LIN, AMIE CHINYU |
2436 |
§101§102§103 |
Final Rejection |
— |
Pending |
Oct 16, 2024 |
| 18891830 |
IMPROVED VOLTAGE BUFFER |
Semiconductor Components Industries, LLC |
RETEBO, METASEBIA T |
2836 |
§102§103 |
Non-Final OA |
— |
Pending |
Sep 20, 2024 |
| 18799472 |
IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER |
Semiconductor Components Industries, LLC |
RAHMAN, KHATIB A |
2818 |
§102§103 |
Non-Final OA |
— |
Pending |
Aug 09, 2024 |
| 18796826 |
SYSTEM AND METHOD FOR GATE THRESHOLD VOLTAGE MEASUREMENT |
Semiconductor Components Industries, LLC |
AGARED, GABRIEL T |
2837 |
§102§103 |
Final Rejection |
— |
Pending |
Aug 07, 2024 |
| 18795699 |
TAPE HEATING METHODS |
Semiconductor Components Industries, LLC |
VU, VU A |
2897 |
§103 |
Non-Final OA |
— |
Pending |
Aug 06, 2024 |
| 18791299 |
LOW ENERGY PHOTON DETECTION WITH CMOS IMAGERS |
Semiconductor Components Industries, LLC |
DANG, PHILIP |
2488 |
§103 |
Non-Final OA |
26d |
Pending |
Jul 31, 2024 |
| 18787369 |
OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES |
Semiconductor Components Industries, LLC |
MIHALIOV, DMITRI |
2812 |
§103§112 |
Non-Final OA |
— |
Pending |
Jul 29, 2024 |
| 18775336 |
METHOD OF FABRICATING SUPER-JUNCTION BASED VERTICAL GALLIUM NITRIDE JFET AND MOSFET POWER DEVICES |
Semiconductor Components Industries, LLC |
BOOTH, RICHARD A |
2812 |
DP |
Non-Final OA |
— |
Pending |
Jul 17, 2024 |
| 18755366 |
SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING |
Semiconductor Components Industries, LLC |
MUSE, ISMAIL A |
2812 |
§102§103 |
Non-Final OA |
— |
Pending |
Jun 26, 2024 |
| 18738193 |
MANAGING THE GROWTH OF SILICON CARBIDE CRYSTALS |
Semiconductor Components Industries, LLC |
SONG, MATTHEW J |
1714 |
§102§103 |
Non-Final OA |
— |
Pending |
Jun 10, 2024 |
| 18676316 |
SEMICONDUCTOR PACKAGE AND RELATED METHODS |
Semiconductor Components Industries, LLC |
ENAD, CHRISTINE A |
2811 |
§102§103 |
Non-Final OA |
— |
Pending |
May 28, 2024 |
| 18661875 |
MANAGING GROWTH OF SILICON CARBIDE CRYSTALS |
Semiconductor Components Industries, LLC |
BRATLAND JR, KENNETH A |
1714 |
§102§103§112 |
Non-Final OA |
— |
Pending |
May 13, 2024 |
| 18652203 |
HIGH PHOTON RATE SPAD DEVICE |
Semiconductor Components Industries, LLC |
FLORES, MARK ANTHONY |
3648 |
§102§103 |
Non-Final OA |
— |
Pending |
May 01, 2024 |
| 18647326 |
METHOD OF TESTING A POWER TRANSISTOR |
Semiconductor Components Industries, LLC |
FREDERIKSEN, DAVID B |
2858 |
§103 |
Non-Final OA |
— |
Pending |
Apr 26, 2024 |
| 18637126 |
OPERATING MODE CONTROL TECHNIQUE FOR POWER FACTOR CORRECTION CIRCUITS |
Semiconductor Components Industries, LLC |
CORDOVA RODRIGUEZ, ULARISLAO |
2838 |
§103 |
Non-Final OA |
— |
Pending |
Apr 16, 2024 |
| 18701585 |
TERMINATION STRUCTURES FOR MOSFETS |
Semiconductor Components Industries, LLC |
BENTON, CHLOE ELAINE |
2899 |
§102§103§112 |
Non-Final OA |
— |
Pending |
Apr 15, 2024 |
| 18634120 |
SPLIT-GATE TRENCH SEMICONDUCTOR DEVICE HAVING STEPPED SHIELD ELECTRODE AND METHOD OF MANUFACTURING |
Semiconductor Components Industries, LLC |
SQUIRES, BRETT STEPHEN |
2899 |
§102§103 |
Non-Final OA |
— |
Pending |
Apr 12, 2024 |
| 18631649 |
HIDDEN ULTRASONIC SENSING SYSTEMS SUITABLE FOR ADVANCED DRIVER ASSISTANCE |
Semiconductor Components Industries, LLC |
ABULABAN, ABDALLAH |
3645 |
§103 |
Non-Final OA |
— |
Pending |
Apr 10, 2024 |
| 18621338 |
PARTITIONED LEADFRAME FOR MULTI-DIE DISCRETE ELECTRONIC COMPONENTS |
Semiconductor Components Industries, LLC |
ARMAND, MARC ANTHONY |
2813 |
§103 |
Non-Final OA |
— |
Pending |
Mar 29, 2024 |
| 18621005 |
METHODS AND SYSTEMS OF LIGHT DETECTING AND RANGING |
Semiconductor Components Industries, LLC |
HULKA, JAMES R |
3645 |
§102§103 |
Non-Final OA |
— |
Pending |
Mar 28, 2024 |
| 18608662 |
POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT |
Semiconductor Components Industries, LLC |
AU, BAC H |
2898 |
§102§103 |
Final Rejection |
— |
Pending |
Mar 18, 2024 |
| 18606922 |
METHODS FOR SINGULATING SEMICONDUCTOR DIE FROM SILICON CARBIDE SUBSTRATES |
Semiconductor Components Industries, LLC |
ZARNEKE, DAVID A |
2891 |
§102§103 |
Non-Final OA |
— |
Pending |
Mar 15, 2024 |
| 18592273 |
MULTI-CHIP SEMICONDUCTOR MODULE WITH BALANCED SWITCHING |
Semiconductor Components Industries, LLC |
SANDVIK, BENJAMIN P |
2812 |
§103 |
Non-Final OA |
— |
Pending |
Feb 29, 2024 |
| 18441484 |
DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES |
Semiconductor Components Industries, LLC |
MUNOZ, ANDRES F |
2818 |
§102§103 |
Final Rejection |
— |
Pending |
Feb 14, 2024 |
| 18533355 |
TRANSISTOR WITH INTEGRATED SOURCE-DRAIN DIODE |
United Silicon Carbide, Inc. |
MINNEY, GABRIEL SEBASTIAN |
2897 |
§102§103 |
Final Rejection |
70d |
Pending |
Dec 08, 2023 |
| 18534065 |
SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES |
Semiconductor Components Industries, LLC |
HENRY, CALEB E |
2818 |
§102 |
Final Rejection |
22d |
Pending |
Dec 08, 2023 |
| 18529657 |
METHODS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES AND POWER SEMICONDUDCTOR STRUCTURES |
Semiconductor Components Industries, LLC |
ARROYO, TERESA M |
2893 |
§103 |
Non-Final OA |
— |
Pending |
Dec 05, 2023 |
| 18488628 |
ARC PREVENTION FOR BONDED WAFERS OF A CHIP STACK |
Semiconductor Components Industries, LLC |
FAN, SU JYA |
2818 |
§103 |
Final Rejection |
— |
Pending |
Oct 17, 2023 |
| 18479316 |
IMAGE SENSOR CHARGE DIRECTION STRUCTURES AND METHODS |
Semiconductor Components Industries, LLC |
BRADFORD, PETER |
2897 |
§103 |
Non-Final OA |
— |
Pending |
Oct 02, 2023 |
| 18478296 |
WIRE-IN-DAM PACKAGES AND RELATED SYSTEMS AND METHODS |
Semiconductor Components Industries, LLC |
SWANSON, ANDREW L |
2896 |
§102 |
Non-Final OA |
— |
Pending |
Sep 29, 2023 |
| 18478115 |
PACKAGE TRAYS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS |
Semiconductor Components Industries, LLC |
BRASFIELD, QUINTON A |
2814 |
§102§103 |
Non-Final OA |
— |
Pending |
Sep 29, 2023 |
| 18473998 |
POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER |
Semiconductor Components Industries, LLC |
SRINIVASAN, SESHA SAIRAMAN |
2817 |
§103 |
Final Rejection |
— |
Pending |
Sep 25, 2023 |
| 18462082 |
IMAGE SENSOR PACKAGES AND RELATED METHODS |
Semiconductor Components Industries, LLC |
KOLB, THADDEUS J |
2817 |
§102§103 |
Final Rejection |
— |
Pending |
Sep 06, 2023 |
| 18446127 |
COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS |
Semiconductor Components Industries, LLC |
STEPHENSON, KENNETH STEPHEN |
2898 |
§103 |
Final Rejection |
19d overdue |
Pending |
Aug 08, 2023 |
| 18353148 |
COMPACT DIRECT-BONDED METAL SUBSTRATE PACKAGE |
Semiconductor Components Industries, LLC |
CIESLEWICZ, ANETA B |
2893 |
§103 |
Final Rejection |
— |
Pending |
Jul 17, 2023 |
| 18341958 |
ELECTROPLATING SYSTEMS AND METHODS |
Semiconductor Components Industries, LLC |
MENDEZ, ZULMARIAM |
1794 |
§102§103 |
Non-Final OA |
12d |
Pending |
Jun 27, 2023 |
| 18308467 |
MOLDED POWER MODULES |
Semiconductor Components Industries, LLC |
KLEIN, JORDAN M |
2893 |
§103 |
Final Rejection |
28d |
Pending |
Apr 27, 2023 |
| 18193847 |
SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS |
Semiconductor Components Industries, LLC |
ARROYO, TERESA M |
2893 |
§102§103 |
Non-Final OA |
— |
Pending |
Mar 31, 2023 |
| 18185548 |
EDGE SEALS FOR SEMICONDUCTOR DEVICES |
Semiconductor Components Industries, LLC |
PURVIS, SUE A |
2893 |
§102§103§112 |
Non-Final OA |
— |
Pending |
Mar 17, 2023 |
| 18182552 |
INTEGRATED SUBSTRATES AND RELATED METHODS |
Semiconductor Components Industries, LLC |
HIBBERT, DANIEL JOHNATHAN |
2899 |
§103 |
Non-Final OA |
— |
Pending |
Mar 13, 2023 |
| 18174837 |
SANDWICH PACKAGE FOR MICROELECTRONICS |
Semiconductor Components Industries, LLC |
HUTSON, NICHOLAS LELAND |
2818 |
§102§103 |
Non-Final OA |
— |
Pending |
Feb 27, 2023 |
| 18055123 |
POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET |
Semiconductor Components Industries, LLC |
CIESLEWICZ, ANETA B |
2893 |
§103§112 |
Final Rejection |
16d overdue |
Pending |
Nov 14, 2022 |
| 18053796 |
SEMICONDUCTOR CRYSTAL GROWTH USING SOURCE POWDER FROM CRUCIBLE WALL |
Semiconductor Components Industries, LLC |
QI, HUA |
1714 |
§112 |
Non-Final OA |
16d overdue |
Pending |
Nov 09, 2022 |
| 17822403 |
IMAGE SENSOR BALL GRID ARRAY PACKAGE |
Semiconductor Components Industries, LLC |
LASASSO, VICTOR JOSEPH |
2898 |
§103 |
Non-Final OA |
53d |
Pending |
Aug 25, 2022 |
| 17814750 |
POWER DEVICE INCLUDING METAL LAYER |
Semiconductor Components Industries, LLC |
NGUYEN, THANH T |
2893 |
§102§103 |
Non-Final OA |
79d |
Pending |
Jul 25, 2022 |
| 17814566 |
HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL |
Semiconductor Components Industries, LLC |
BULLARD-CONNOR, GENEVIEVE GRACE |
2899 |
§102§103§112 |
Final Rejection |
23d |
Pending |
Jul 25, 2022 |
| 17667432 |
METHODS AND SYSTEMS FOR FABRICATION OF VERTICAL FIN-BASED JFETS |
Semiconductor Components Industries, LLC |
SARKER-NAG, AKHEE |
2893 |
§102§103 |
Non-Final OA |
— |
Pending |
Feb 08, 2022 |
