44 pending office actions • 11 clients
| Client (Assignee) | Pending OAs |
|---|---|
| Resonac Corporation | 13 |
| Ihi Corporation | 10 |
| Kabushiki Kaisha Yaskawa Denki | 8 |
| Showa Denko Materials Co., Ltd. | 4 |
| I-Pex Inc. | 2 |
| J. Morita Mfg. Corp. | 2 |
| Tokiwa Corporation | 1 |
| Nhk Spring Co., Ltd. | 1 |
| Kabushiki Kaisha Riken | 1 |
| NTT Docomo, Inc. | 1 |
| Techno Takatsuki Co., Ltd. | 1 |
| App # | Title | Client | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|---|
| 19256179 | TURBOCHARGER | Ihi Corporation | WIEHE, NATHANIEL EDWARD | 3745 | Final Rejection | Jul 01, 2025 |
| 19174923 | COMPRESSOR WITH ELECTRIC MOTOR | Ihi Corporation | LETTMAN, BRYAN MATTHEW | 3746 | Non-Final OA | Apr 10, 2025 |
| 19002696 | RADIAL FOIL BEARING WITH BUMP FOIL | Ihi Corporation | WAITS, ALAN B | 3617 | Non-Final OA | Dec 27, 2024 |
| 18985022 | ROBOT CONTROL WITH LIMITATION OF CONTROL QUANTITY | Kabushiki Kaisha Yaskawa Denki | KHAYER, SOHANA T | 3657 | Non-Final OA | Dec 18, 2024 |
| 18969294 | SEMICONDUCTOR SWITCH DRIVE CIRCUIT WITH TRANSFER RESTRICTING CIRCUITRY | Ihi Corporation | YOUSSEF, MENATOALLAH M | 2849 | Non-Final OA | Dec 05, 2024 |
| 18959623 | ROBOT CONTROL WITH ERROR REDUCTION | Kabushiki Kaisha Yaskawa Denki | EMMETT, MADISON B | 3658 | Non-Final OA | Nov 26, 2024 |
| 18954552 | RADIAL FOIL BEARING | Ihi Corporation | PILKINGTON, JAMES | 3617 | Non-Final OA | Nov 21, 2024 |
| 18864553 | ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR | Resonac Corporation | SWIER, WAYNE K. | 1748 | Non-Final OA | Nov 11, 2024 |
| 18864550 | ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR | Resonac Corporation | PATEL, VISHAL I | 1746 | Non-Final OA | Nov 11, 2024 |
| 18856062 | FILM FOR TEMPORARY FIXING, LAMINATE FOR TEMPORARY FIXING, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, COMPOSITION FOR TEMPORARY FIXING | Resonac Corporation | MILLER, BETHANY MACKENZIE | 1787 | Non-Final OA | Oct 11, 2024 |
| 18854969 | COATING LIQUID, METHOD FOR PRODUCING COATING LIQUID, AND METHOD FOR PRODUCING COMPOSITE MATERIAL | Resonac Corporation | RUMMEL, JULIA L | 1784 | Non-Final OA | Oct 08, 2024 |
| 18887174 | THRUST FOIL BEARING | Ihi Corporation | PILKINGTON, JAMES | 3617 | Non-Final OA | Sep 17, 2024 |
| 18826200 | REFRIGERANT COMPRESSOR WITH RETURN OPENING | Ihi Corporation | DOYLE, BENJAMIN C | 3746 | Non-Final OA | Sep 06, 2024 |
| 18780930 | ELECTRIC MACHINE SYSTEM AND CONTROLLER | Ihi Corporation | LAUGHLIN, CHARLES S | 2846 | Non-Final OA | Jul 23, 2024 |
| 18765335 | APPLICATION CONTAINER WITH HOLDING PORTION FOR APPLICATION MATERIAL | Tokiwa Corporation | WALCZAK, DAVID J | 3754 | Non-Final OA | Jul 08, 2024 |
| 18762675 | ROBOT AND ELECTRONIC SUBSTRATE TRANSFER DEVICE | Kabushiki Kaisha Yaskawa Denki | MCCLAIN, GERALD | 3652 | Non-Final OA | Jul 03, 2024 |
| 18760045 | MOTOR ROTOR WITH INNER SLEEVE | Nhk Spring Co., Ltd. | SINGH, ALEXANDER A | 2834 | Non-Final OA | Jul 01, 2024 |
| 18721195 | PISTON RING AND PISTON RING SET | Kabushiki Kaisha Riken | PATEL, VISHAL A | 3675 | Final Rejection | Jun 18, 2024 |
| 18733842 | ELECTRIC POWER CONVERSION SYSTEM | Kabushiki Kaisha Yaskawa Denki | LUO, DAVID S | 2846 | Non-Final OA | Jun 05, 2024 |
| 18672013 | POWER CONVERSION DEVICE AND CONTROL METHOD | Kabushiki Kaisha Yaskawa Denki | COOK, CORTEZ M | 2846 | Non-Final OA | May 23, 2024 |
| 18604525 | COMMUNICATION USING TIME DIVISION DUPLEX PATTERN | Kabushiki Kaisha Yaskawa Denki | JANGBAHADUR, LAKERAM | 2469 | Non-Final OA | Mar 14, 2024 |
| 18439774 | ENERGY DISTRIBUTION CONTROL FOR SMART GRID | Ihi Corporation | EL CHANTI, HUSSEIN A | 3669 | Non-Final OA | Feb 13, 2024 |
| 18429560 | ELECTRICAL CONNECTOR | I-Pex Inc. | PATEL, HARSHAD C | 2831 | Non-Final OA | Feb 01, 2024 |
| 18290846 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Resonac Corporation | SHOOK, DANIEL P | 2896 | Non-Final OA | Jan 22, 2024 |
| 18540875 | TERMINAL CONNECTION STRUCTURE OF MOTOR CASING | Ihi Corporation | JOHNSON, ERIC | 2834 | Final Rejection | Dec 15, 2023 |
| 18552220 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT ELEMENT, AND INTEGRATED CIRCUIT ELEMENT MANUFACTURING METHOD | Resonac Corporation | SLUTSKER, JULIA | 2891 | Non-Final OA | Sep 25, 2023 |
| 18549937 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, CLEANING DEVICE, CLEANING METHOD, AND SEMICONDUCTOR DEVICE | Resonac Corporation | NGUYEN, NIKI HOANG | 2818 | Non-Final OA | Sep 11, 2023 |
| 18549171 | METHOD FOR PRODUCING COATING LIQUID AND METHOD FOR PRODUCING THERMAL INSULATION MATERIAL | Resonac Corporation | GUINO-O UZZLE, MARITES A | 1731 | Non-Final OA | Sep 06, 2023 |
| 18260468 | METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCING SAME | Resonac Corporation | LEGASPI, EUGENE REY DEVERA | 3729 | Non-Final OA | Jul 05, 2023 |
| 18253393 | IMAGE PROCESSING SYSTEM AND IMAGE PROCESSING DEVICE | J. Morita Mfg. Corp. | KAO, CHIH CHENG G | 2884 | Non-Final OA | May 18, 2023 |
| 18299776 | CONNECTOR, CONNECTOR DEVICE, AND METHOD FOR MANUFACTURING CONNECTOR | I-Pex Inc. | KRATT, JUSTIN M | 2831 | Final Rejection | Apr 13, 2023 |
| 18247077 | METHOD FOR MANUFACTURING WIRING BOARD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RESIN SHEET | Resonac Corporation | GHYKA, ALEXANDER G | 2812 | Non-Final OA | Mar 29, 2023 |
| 18043730 | ADHESIVE FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | Resonac Corporation | PIZARRO CRESPO, MARCOS D | 2814 | Final Rejection | Mar 02, 2023 |
| 18005068 | WIRELESS CONNECTION DEVICE | NTT Docomo, Inc. | WILLIAMS, TRACY L | 2465 | Final Rejection | Jan 11, 2023 |
| 18068534 | SIMULATED COLLABORATION OF MULTIPLE CONTROLLERS | Kabushiki Kaisha Yaskawa Denki | YOUNG, TIFFANY P | 3665 | Non-Final OA | Dec 20, 2022 |
| 18065623 | AIR PUMP SYSTEM FOR MASSAGER | Techno Takatsuki Co., Ltd. | DAHER, KIRA B | 3785 | Non-Final OA | Dec 14, 2022 |
| 18062019 | DEVICE CONTROL BASED ON EXECUTION COMMAND AND UPDATED ENVIRONMENT INFORMATION | Kabushiki Kaisha Yaskawa Denki | YOON, ERIC | 2118 | Non-Final OA | Dec 06, 2022 |
| 17995408 | TEMPORARY PROTECTION FILM FOR SEMICONDUCTOR ENCAPSULATION, PRODUCTION METHOD THEREFOR, LEAD FRAME WITH TEMPORARY PROTECTION FILM, TEMPORARILY PROTECTED ENCAPSULATION OBJECT, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE | Showa Denko Materials Co., Ltd. | DUCHENEAUX, FRANK D | 1788 | Non-Final OA | Oct 04, 2022 |
| 17795874 | MANUFACTURING METHOD FOR COATING LIQUID AND MANUFACTURING METHOD FOR THERMAL INSULATING MATERIAL | Showa Denko Materials Co., Ltd. | XU, JIANGTIAN | 1762 | Final Rejection | Jul 28, 2022 |
| 17846013 | JAW MOVEMENT ANALYSIS SYSTEM | J. Morita Mfg. Corp. | HANN, JAY B | 2186 | Non-Final OA | Jun 22, 2022 |
| 17779129 | CURABLE COMPOSITION AND ARTICLE | Showa Denko Materials Co., Ltd. | STANLEY, JANE L | 1767 | Final Rejection | May 24, 2022 |
| 17779130 | CURABLE COMPOSITION SET AND ARTICLE | Resonac Corporation | KOLB, KATARZYNA I | 1767 | Non-Final OA | May 24, 2022 |
| 17641101 | TEMPORARY PROTECTIVE FILM, REEL BODY, PACKAGING BODY, PACKAGE BODY, TEMPORARY PROTECTIVE BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Resonac Corporation | WU, ANDREA | 1763 | Non-Final OA | Mar 08, 2022 |
| 17633211 | RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE | Showa Denko Materials Co., Ltd. | CAI, JIAJIA JANIE | 1761 | Final Rejection | Feb 07, 2022 |
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