Prosecution Insights
Prosecution Insights
Technology areas: Chemistry & Materials • Semiconductors, Circuits & Optics • Transportation, E-Commerce & Mechanical Systems
30 pending office actions • 10 clients • 29 examiners • 18 art units • 0 of 30 (0%) have an AI response strategy ready
SOEI USA INC. manages 760 career applications in the Transportation, E-Commerce & Mechanical Systems technology area. The firm has achieved a resolved allowance rate pct of 91.42. Its prosecution process averages 2.31 avg office actions per allowance.
There are 19 pending office actions currently active. The 91.42 resolved allowance rate pct for its 760 career applications indicates the firm's success in securing allowances. An avg office actions per allowance of 2.31 provides a benchmark for the examination process in its primary technology area.
Based on the USPTO statutory response window for each pending office action. 6 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 6 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 1 (3%) |
| §101 + other | 3 (10%) |
| §103 only | 12 (40%) |
| §102 only | 6 (20%) |
| Double-patenting + other | 2 (7%) |
| Multi-statute (no §101) | 6 (20%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| JOHNSON, ERIC | 2 | 62.3% | +22.7% |
| KONERU, LAKSHMI S | 1 | 62.6% | +15.9% |
| SYROWIK, MATHEW RICHARD | 1 | 9.0% | +11.7% |
| EMMETT, MADISON B | 1 | 80.2% | +10.1% |
| PATEL, VISHAL I | 1 | 78.3% | +10.0% |
| BRANCH, CATHERINE S | 1 | 85.7% | +3.5% |
| BURNS, TREMESHA WILLIS | 1 | 78.2% | +17.2% |
| NORRIS, JEREMY C | 1 | 86.8% | +4.4% |
| RUMMEL, JULIA L | 1 | 34.8% | +52.4% |
| MCALLISTER, MICHAEL F | 1 | 85.9% | +6.3% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18959623 | ROBOT CONTROL WITH ERROR REDUCTION | EMMETT, MADISON B | 28d |
| 18864553 | ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR | BRANCH, CATHERINE S | — |
| 18837891 | WIRING SUBSTRATE PRODUCTION METHOD, WIRING SUBSTRATE, RETICLE, AND EXPOSURE PATTERN-RENDERING DATA STRUCTURE | MCALLISTER, MICHAEL F | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18396700 | COMMUNICATION SYSTEM WITH ORDERED COMMAND DATA SETS | CAIN, ZACHARY ANDREW | 69d |
| 19185268 | ABNORMALITY DETERMINATION DEVICE | SYROWIK, MATHEW RICHARD | — |
| 18839728 | CORE SUBSTRATE FOR WIRING BOARDS AND METHOD FOR PRODUCING SAME, AND WIRING BOARD AND METHOD FOR PRODUCING SAME | NORRIS, JEREMY C | — |
| 18848913 | ADHESIVE FILM FOR SEMICONDUCTORS, INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | CHOI, CALVIN Y | — |
| 18843314 | MANAGEMENT APPARATUS, MANAGEMENT METHOD, MANAGEMENT PROGRAM, AND RECORDING MEDIUM | GURSKI, AMANDA KAREN | — |
| 18762654 | ROBOT WITH ARTICULATED ARM | BURKMAN, JESSICA LYNN | — |
| 18630267 | CONNECTOR DEVICE | PATEL, HARSHAD C | — |
| 18470491 | METHOD FOR FORMING RESIST PATTERN, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING DEVICE, AND STORAGE MEDIUM | CHACKO DAVIS, DABORAH | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18959623 | ROBOT CONTROL WITH ERROR REDUCTION | EMMETT, MADISON B | 28d |
| 19141052 | OIL CONTROL RING | KONERU, LAKSHMI S | 70d |
| 19185268 | ABNORMALITY DETERMINATION DEVICE | SYROWIK, MATHEW RICHARD | — |
| 19064728 | INVERTER INTEGRATED GAS SUPPLY DEVICE WITH SEALING MEMBERS FOR MOTOR-INVERTER CONNECTION | JOHNSON, ERIC | — |
| 19106637 | BRUSH UNIT AND CONNECTION DEVICE | JOHNSON, ERIC | — |
| 18864550 | ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR | PATEL, VISHAL I | — |
| 18858330 | MEMBER FOR SEMICONDUCTOR DEVICE PRODUCTION, AND METHOD FOR PRODUCING SAME | BURNS, TREMESHA WILLIS | — |
| 18854970 | COATING LIQUID, METHOD FOR PRODUCING COATING LIQUID, AND METHOD FOR PRODUCING COMPOSITE MATERIAL | RUMMEL, JULIA L | — |
| Client (Assignee) | Pending OAs |
|---|---|
| RESONAC CORPORATION | 14 |
| Yaskawa | 5 |
| Riken | 2 |
| IHI | 2 |
| I-PEX | 2 |
| NSK | 1 |
| JGC | 1 |
| Tokyo Electron | 1 |
| NTT | 1 |
| Resonac Holdings Corporation | 1 |
| Art Unit | Apps |
|---|---|
| 3675 | 2 |
| 3621 | 1 |
| 3658 | 1 |
| 1746 | 1 |
| 1748 | 1 |
| 2847 | 1 |
| 2841 | 1 |
| 3625 | 1 |
| 3653 | 1 |
| 3652 | 1 |
| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19141052 | OIL CONTROL RING | Kabushiki Kaisha Riken | KONERU, LAKSHMI S | 3675 | §103 | Non-Final OA | 70d | Pending | Jun 19, 2025 |
| 19185268 | ABNORMALITY DETERMINATION DEVICE | Ihi Corporation | SYROWIK, MATHEW RICHARD | 3621 | §101§102§103§112Other | Final Rejection | — | Pending | Apr 22, 2025 |
| 19064728 | INVERTER INTEGRATED GAS SUPPLY DEVICE WITH SEALING MEMBERS FOR MOTOR-INVERTER CONNECTION | Ihi Corporation | JOHNSON, ERIC | §103§112DP | Non-Final OA | — | Pending | Feb 27, 2025 | |
| 19106637 | BRUSH UNIT AND CONNECTION DEVICE | Nsk Ltd. | JOHNSON, ERIC | §103 | Non-Final OA | — | Pending | Feb 26, 2025 | |
| 18959623 | ROBOT CONTROL WITH ERROR REDUCTION | Kabushiki Kaisha Yaskawa Denki | EMMETT, MADISON B | 3658 | §103 | Final Rejection | 28d | Pending | Nov 26, 2024 |
| 18864550 | ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR | Resonac Corporation | PATEL, VISHAL I | 1746 | §103 | Non-Final OA | — | Pending | Nov 11, 2024 |
| 18864553 | ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR | Resonac Corporation | BRANCH, CATHERINE S | 1748 | §112DP | Non-Final OA | — | Pending | Nov 11, 2024 |
| 18858330 | MEMBER FOR SEMICONDUCTOR DEVICE PRODUCTION, AND METHOD FOR PRODUCING SAME | Resonac Corporation | BURNS, TREMESHA WILLIS | 2847 | §102 | Non-Final OA | — | Pending | Oct 21, 2024 |
| 18839728 | CORE SUBSTRATE FOR WIRING BOARDS AND METHOD FOR PRODUCING SAME, AND WIRING BOARD AND METHOD FOR PRODUCING SAME | Resonac Corporation | NORRIS, JEREMY C | §102§103 | Non-Final OA | — | Pending | Oct 10, 2024 | |
| 18854970 | COATING LIQUID, METHOD FOR PRODUCING COATING LIQUID, AND METHOD FOR PRODUCING COMPOSITE MATERIAL | Resonac Corporation | RUMMEL, JULIA L | §103Other | Non-Final OA | — | Pending | Oct 08, 2024 | |
| 18837891 | WIRING SUBSTRATE PRODUCTION METHOD, WIRING SUBSTRATE, RETICLE, AND EXPOSURE PATTERN-RENDERING DATA STRUCTURE | Resonac Corporation | MCALLISTER, MICHAEL F | §102 | Non-Final OA | — | Pending | Oct 07, 2024 | |
| 18854547 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE | Resonac Corporation | ESTRADA, ANGEL R | 2841 | §102 | Non-Final OA | — | Pending | Oct 07, 2024 |
| 18848913 | ADHESIVE FILM FOR SEMICONDUCTORS, INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Resonac Corporation | CHOI, CALVIN Y | §102§103 | Non-Final OA | — | Pending | Sep 20, 2024 | |
| 18843314 | MANAGEMENT APPARATUS, MANAGEMENT METHOD, MANAGEMENT PROGRAM, AND RECORDING MEDIUM | Jgc Corporation | GURSKI, AMANDA KAREN | 3625 | §101 | Final Rejection | — | Pending | Sep 03, 2024 |
| 18836354 | DICING/DIE-BONDING FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Resonac Corporation | AHMED, SHAHED | §103 | Non-Final OA | — | Pending | Aug 07, 2024 | |
| 18762654 | ROBOT WITH ARTICULATED ARM | Kabushiki Kaisha Yaskawa Denki | BURKMAN, JESSICA LYNN | 3653 | §102§103 | Non-Final OA | — | Pending | Jul 03, 2024 |
| 18762675 | ROBOT AND ELECTRONIC SUBSTRATE TRANSFER DEVICE | Kabushiki Kaisha Yaskawa Denki | MCCLAIN, GERALD | 3652 | §103 | Final Rejection | — | Pending | Jul 03, 2024 |
| 18749721 | CABLE ASSEMBLY | I-Pex Inc. | ALHAWAMDEH, NADER J | §102 | Non-Final OA | — | Pending | Jun 21, 2024 | |
| 18721195 | PISTON RING AND PISTON RING SET | Kabushiki Kaisha Riken | PATEL, VISHAL A | 3675 | §103Other | Non-Final OA | 26d overdue | Pending | Jun 18, 2024 |
| 18630267 | CONNECTOR DEVICE | I-Pex Inc. | PATEL, HARSHAD C | §102§103Other | Final Rejection | — | Pending | Apr 09, 2024 | |
| 18697008 | FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, METHOD FOR PRODUCING FILM-LIKE ADHESIVE FOR SEMICONDUCTORS, ADHESIVE TAPE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Resonac Corporation | SMITH JR., JIMMY R | §102 | Non-Final OA | — | Pending | Mar 29, 2024 | |
| 18687298 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, TEMPORARY-FIXING MATERIAL, AND APPLICATION FOR MANUFACTURING SEMICONDUCTOR DEVICE OF TEMPORARY-FIXING MATERIAL | Resonac Corporation | ERDEM, FAZLI | 2812 | §102 | Non-Final OA | — | Pending | Feb 28, 2024 |
| 18396700 | COMMUNICATION SYSTEM WITH ORDERED COMMAND DATA SETS | Kabushiki Kaisha Yaskawa Denki | CAIN, ZACHARY ANDREW | 2116 | §101§102§103§112 | Final Rejection | 69d | Pending | Dec 27, 2023 |
| 18470491 | METHOD FOR FORMING RESIST PATTERN, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING DEVICE, AND STORAGE MEDIUM | Tokyo Electron Limited | CHACKO DAVIS, DABORAH | 1737 | §102§103 | Non-Final OA | — | Pending | Sep 20, 2023 |
| 18450406 | SIMULATION MODEL CORRECTION OF A MACHINE SYSTEM | Kabushiki Kaisha Yaskawa Denki | CHAVEZ, ANTHONY RAY | §101§103 | Non-Final OA | — | Pending | Aug 16, 2023 | |
| 18260468 | METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCING SAME | Resonac Corporation | LEGASPI, EUGENE REY DEVERA | 3729 | §102§103§112 | Non-Final OA | — | Pending | Jul 05, 2023 |
| 18043730 | ADHESIVE FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | Resonac Corporation | PIZARRO CRESPO, MARCOS D | 2814 | §103 | Non-Final OA | 22d overdue | Pending | Mar 02, 2023 |
| 18005068 | WIRELESS CONNECTION DEVICE | NTT Docomo, Inc. | WILLIAMS, TRACY L | 2465 | §103 | Non-Final OA | 28d | Pending | Jan 11, 2023 |
| 17641101 | TEMPORARY PROTECTIVE FILM, REEL BODY, PACKAGING BODY, PACKAGE BODY, TEMPORARY PROTECTIVE BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Resonac Corporation | WU, ANDREA | 1763 | §103 | Final Rejection | — | Pending | Mar 08, 2022 |
| 17633211 | RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE | Showa Denko Materials Co., Ltd. | CAI, JIAJIA JANIE | 1761 | §103 | Non-Final OA | — | Pending | Feb 07, 2022 |
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