Tech Center 2800 • Art Units: 2426 2891
This examiner grants 72% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18507369 | SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18381785 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18387079 | DISPLAY DEVICE | Non-Final OA | LG DISPLAY CO., LTD. |
| 18381525 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18488449 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18359991 | SEMICONDUCTOR DEVICE HAVING A DOPED REGION UNDERLYING A GATE LAYER AND IN A BARRIER LAYER | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18279067 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF REPLACING SEMICONDUCTOR DEVICE | Non-Final OA | MITSUBISHI ELECTRIC CORPORATION |
| 18477831 | Field-Effect Transistor, Production Method Thereof, Switching Circuit, and Circuit Board | Non-Final OA | Huawei Technologies Co., Ltd. |
| 18575339 | SOLID-STATE IMAGING APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18364494 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | Final Rejection | Infineon Technologies AG |
| 18145857 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18324711 | STRESS INCORPORATION IN SEMICONDUCTOR DEVICES | Final Rejection | Applied Materials, Inc. |
| 18643981 | MEMORY DEVICE, SEMICONDUCTOR DIE, AND METHOD OF FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18623806 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18342910 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18005283 | THIN-FILM TRANSISTOR HAVING METAL OXIDE SEMICONDUCTOR LAYERS OF HETEROJUNCTION STRUCTURE, DISPLAY DEVICE COMPRISING SAME, AND MANUFACTURING METHOD THEREFOR | Non-Final OA | IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) |
| 18280049 | GATE-COMMUTED THYRISTOR CELL WITH A BASE REGION HAVING A VARYING THICKNESS | Final Rejection | Hitachi Energy Ltd |
| 18625453 | OPTICALLY TRANSPARENT ADHESION LAYER TO CONNECT NOBLE METALS TO OXIDES | Final Rejection | Lumileds LLC |
| 16968150 | SEALED DEVICE WITH LIGHT ENGINE | Non-Final OA | SIGNIFY HOLDING B.V. |
| 18459339 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18458284 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18364479 | NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 18458877 | RECESSED GATE HEMT PROCESSING WITH REVERSED ETCHING | Final Rejection | STMicroelectronics International N.V. |
| 18327287 | Semiconductor structure of BIPOLAR JUNCTION TRANSISTOR (BJT) | Final Rejection | MEDIATEK INC. |
| 18379133 | INVERTED MEMORY STACK | Non-Final OA | Advanced Micro Devices, Inc. |
| 18459079 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | Non-Final OA | NATIONAL TAIWAN UNIVERSITY |
| 18334763 | SEMICONDUCTOR DEVICE | Final Rejection | RENESAS ELECTRONICS CORPORATION |
| 18098999 | FIELD-EFFECT TRANSISTORS FORMED USING A WIDE BANDGAP SEMICONDUCTOR MATERIAL | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18511743 | TMR SENSOR HAVING TUNED VORTEX RESPONSE | Non-Final OA | Allegro MicroSystems, LLC |
| 18105256 | ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE | Final Rejection | UNITED MICROELECTRONICS CORP. |
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