Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2894
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18356776 | HIGH PERFORMANCE FETS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18216675 | EXPANDER AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18340440 | SEMICONDUCTOR DEVICES | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18110296 | FIELD-EFFECT TRANSISTOR WITH UNIFORM SOURCE/DRAIN REGIONS ON SELF-ALIGNED DIRECT BACKSIDE CONTACT STRUCTURES OF BACKSIDE POWER DISTRIBUTION NETWORK (BSPDN) | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18562885 | DISPLAY PANEL AND DISPLAY DEVICE | Final Rejection | BOE Technology Group Co., Ltd. |
| 18582879 | MOTHER SUBSTRATE FOR DISPLAY DEVICE, DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18202678 | INTEGRATED CIRCUIT STRUCTURES WITH PARTIAL CHANNEL CAP REMOVAL | Non-Final OA | Intel Corporation |
| 18324640 | HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES | Non-Final OA | Intel Corporation |
| 18200967 | INTEGRATED CIRCUIT STRUCTURES HAVING METAL-CONTAINING FIN ISOLATION REGIONS | Non-Final OA | Intel Corporation |
| 17953873 | HIGH ASPECT RATIO METAL GATE CUTS | Non-Final OA | Intel Corporation |
| 17851985 | INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE POWER DELIVERY | Non-Final OA | Intel Corporation |
| 18132437 | WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION | Non-Final OA | MEDIATEK INC. |
| 18345490 | PRE-WAFER FABRICATION LASER DICING | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18519805 | SEMICONDUCTOR STRUCTURES AND METHODS THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18513562 | SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18231320 | METHOD FOR FORMING A SEMICONDUCTOR DEVICE AND DEVICES FABRICATED THEREOF | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18302010 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17894169 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18526445 | SEMICONDUCTOR DEVICES WITH BACKSIDE ROUTING AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18447913 | SOURCE/DRAIN REGIONS IN COMPLEMENTARY FIELD EFFECT TRANSISTORS AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18489214 | ACTIVELY CONTROLLED WINDOW FOR EPITAXIAL DEPOSITION PROCESS TEMPERATURE CONTROL | Non-Final OA | Applied Materials, Inc. |
| 18093648 | HYDROGEN MANAGEMENT IN PLASMA DEPOSITED FILMS | Non-Final OA | Applied Materials, Inc. |
| 17986276 | BACKSIDE SKIP-LEVEL THROUGH VIA FOR BACKSIDE SIGNAL LINE CONNECTION | Non-Final OA | International Business Machines Corporation |
| 18240475 | SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18350755 | SEMICONDUCTOR DEVICE WITH HYBRID BONDING STRUCTURE AND METHOD OF FABRICATING THE SAME | Non-Final OA | United Microelectronics Corp. |
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