Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2894
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18475290 | INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT | Final Rejection | Samsung Electronics Co., Ltd. |
| 18340440 | SEMICONDUCTOR DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18296511 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18165563 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18345490 | PRE-WAFER FABRICATION LASER DICING | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17392738 | SEMICONDUCTOR PACKAGE WITH RAISED DAM ON CLIP OR LEADFRAME | Non-Final OA | Texas Instruments Incorporated |
| 18562885 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18356230 | SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18482843 | Modular Package of Quantum Hardware | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18489214 | ACTIVELY CONTROLLED WINDOW FOR EPITAXIAL DEPOSITION PROCESS TEMPERATURE CONTROL | Non-Final OA | Applied Materials, Inc. |
| 18093648 | HYDROGEN MANAGEMENT IN PLASMA DEPOSITED FILMS | Non-Final OA | Applied Materials, Inc. |
| 17847454 | DEPOSITION OF LOW-STRESS CARBON-CONTAINING LAYERS | Final Rejection | Applied Materials, Inc. |
| 18193861 | METHOD AND SYSTEM FOR HARDENING A TRANSISTOR LOGIC GATE | Non-Final OA | intel Corporation |
| 17953873 | HIGH ASPECT RATIO METAL GATE CUTS | Non-Final OA | Intel Corporation |
| 17851985 | INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE POWER DELIVERY | Non-Final OA | Intel Corporation |
| 18402974 | VERTICAL SEMICONDUCTOR COMPONENT, IN PARTICULAR VERTICAL TRANSISTOR, WITH MINIMIZED SOURCE-DRAIN LEAKAGE CURRENTS | Non-Final OA | Robert Bosch GmbH |
| 18111424 | MODIFIED SEMICONDUCTOR DIE CARRIER AND CARRIER TAPE | Final Rejection | Micron Technology, Inc. |
| 18346472 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TIANJIN SANAN OPTOELECTRONICS CO., LTD. |
| 18132437 | WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION | Non-Final OA | MEDIATEK INC. |
| 18231320 | METHOD FOR FORMING A SEMICONDUCTOR DEVICE AND DEVICES FABRICATED THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18516021 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 17870423 | Fan-Out Packages and Methods of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18331215 | ELECTRONIC PACKAGE WITH HEATSINK AND MANUFACTURING METHOD THEREFOR | Non-Final OA | NEXPERIA B.V. |
| 18464779 | BACK GRINDING TAPE HAVING TABS TO ASSIST IN REMOVING THE BACK GRINDING TAPE FROM A WAFER | Non-Final OA | Sandisk Technologies, Inc. |
| 18039088 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURTING SEMICONDUCTOR SUBSTRATE | Non-Final OA | NISSAN CHEMICAL CORPORATION |
| 18547073 | Semiconductor Structure And Method For Fabricating The Same | Non-Final OA | ChangXin Memory Technologies, Inc. |
| 17939981 | PACKAGE SUBSTRATE AND METHOD FOR FABRICATING CHIP ASSEMBLY | Non-Final OA | TONG HSING ELECTRONIC INDUSTRIES, LTD. |
| 18474803 | Process for Wafer Bonding | Non-Final OA | IMEC VZW |
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