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| App # | Title | Client | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|---|
| 19372602 | Untitled | Intel Corporation | BROMELL, ALEXANDRIA Y | 2156 | — | Non-Final OA | — | Pending | |
| 19260043 | TECHNOLOGIES FOR ALLOCATING RESOURCES ACROSS DATA CENTERS | Intel Corporation | RECEK, JASON D | 2458 | §103 | Non-Final OA | — | Pending | Jul 03, 2025 |
| 18868623 | VARIABLE CACHELINE SET MAPPING | Intel Corporation | TALUKDAR, ARVIND | 2132 | §102§103 | Final Rejection | — | Pending | Nov 22, 2024 |
| 18913807 | MICROSERVICE PROVISION AND MANAGEMENT | Intel Corporation | WILLIAMS, CLAYTON R | 2443 | §103Other | Non-Final OA | — | AI Ready | Oct 11, 2024 |
| 18907358 | ARRAYS OF DOUBLE-SIDED DRAM CELLS INCLUDING CAPACITORS ON THE FRONTSIDE AND BACKSIDE OF A STACKED TRANSISTOR STRUCTURE | Intel Corporation | ASSOUMAN, HERVE-LOUIS Y | 2812 | Other | Non-Final OA | — | Pending | Oct 04, 2024 |
| 18762478 | PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER TO AN INTEGRATED ROUTING LAYER | Intel Corporation | GEYER, SCOTT B | 2812 | §102DP | Non-Final OA | — | Pending | Jul 02, 2024 |
| 18762484 | POWER DELIVERY STRUCTURES | Intel Corporation | ANDERSON, WILLIAM H | 2817 | §102Other | Non-Final OA | — | Pending | Jul 02, 2024 |
| 18734891 | VIRTUAL EXECUTION ENVIRONMENT POWER USAGE | Intel Corporation | KAMRAN, MEHRAN | 2196 | — | Final Rejection | — | Pending | Jun 05, 2024 |
| 18668042 | MULTI-HEIGHT & MULTI-WIDTH INTERCONNECT LINE METALLIZATION FOR INTEGRATED CIRCUIT STRUCTURES | Intel Corporation | PATEL, REEMA | 2812 | §102§103DP | Non-Final OA | — | Pending | May 17, 2024 |
| 18399494 | Comb Laser Source Architectures for Photonic integrated Circuits | Intel Corporation | PATEL, PREET BAKUL | 2874 | §103§112 | Non-Final OA | 71d | AI Ready | Dec 28, 2023 |
| 18399503 | SILICON PHOTONIC INTEGRATED CIRCUITS WITH LOCALIZED THICK BURIED INSULATOR | Intel Corporation | GREEN, TAJANAE NICOLE | 2874 | §102§103§112 | Non-Final OA | — | Pending | Dec 28, 2023 |
| 18478589 | METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO MANAGE NETWORK COMMUNICATIONS IN TIME SENSITIVE NETWORKS | Intel Corporation | WIDHALM DE RODRIG, ANGELA MARIE | 2443 | §102 | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18374516 | SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID BONDED DIE STACKS | Intel Corporation | ONUTA, TIBERIU DAN | 2814 | — | Non-Final OA | — | Pending | Sep 28, 2023 |
| 18240271 | DEVICE, METHOD AND SYSTEM TO SUPPORT A SYNCHRONOUS DATA FLOW WITH AN IDENTIFICATION OF AN EXECUTABLE TASK | Intel Corporation | MACKALL, LARRY T | 2139 | §102 | Non-Final OA | — | Pending | Aug 30, 2023 |
| 18233199 | DEVICE, METHOD AND SYSTEM FOR IN-FIELD LANE TESTING AND REPAIR WITH A THREE-DIMENSIONAL INTEGRATED CIRCUIT | Intel Corporation | ALEJNIKOV JR, ROBERT P | 2857 | §102§103 | Non-Final OA | — | Pending | Aug 11, 2023 |
| 18231695 | EXTENDED ERROR MANAGEMENT WITH CONFIGURABLE HEADER LOGS | Intel Corporation | YU, XINYUAN | §101§102§103 | Non-Final OA | — | Pending | Aug 08, 2023 | |
| 18217049 | METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT STRUCTURES | Intel Corporation | MCCOY, THOMAS WILSON | 2814 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18217056 | FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY | Intel Corporation | ANYA, IGWE U | 2891 | §102§103 | Non-Final OA | — | Pending | Jun 30, 2023 |
| 18216493 | PERFORMANCE OPTIMIZATION OF TRANSISTORS SHARING CHANNEL STRUCTURES OF VARYING WIDTH | Intel Corporation | KIM, TONG-HO | 2811 | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216476 | MITIGATION OF THRESHOLD VOLTAGE SHIFT IN BACKSIDE POWER DELIVERY USING BACKSIDE PASSIVATION LAYER | Intel Corporation | LEE, WOO KYUNG | 2815 | — | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216456 | DEVICE, SYSTEM, AND METHOD FOR PROVIDING ISOLATION BETWEEN CORES TO FACILITATE A MULTI-TENANT ENVIRONMENT | Intel Corporation | CHAN, DANNY | 2175 | §103 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216485 | AND DOUBLE PATTERNING STRATEGY WITH PRINTED ERASABLE DUMMIFICATION | Intel Corporation | IMTIAZ, S M SOHEL | 2812 | — | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216525 | THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVICE PACKAGES | Intel Corporation | LIU, XIAOMING | 2812 | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216447 | HIGH-FREQUENCY INTERFACE CIRCUIT PROTECTION FROM ELECTROSTATIC DISCHARGE EVENTS | Intel Corporation | SREEVATSA, SREEYA | 2838 | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216352 | DEVICE, METHOD, AND SYSTEM TO PROVIDE A LIMITED POWER STATES MODE FOR MANAGING PROCESSOR OPERATION | Intel Corporation | HARRINGTON, CHERI L. | 2176 | §102§103§112 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18216436 | HARDWARE-BASED CRYPTOGRAPHIC PROTECTION OF TOKENS | Intel Corporation | ZARRINEH, SHAHRIAR | 2496 | §102§103 | Non-Final OA | — | Pending | Jun 29, 2023 |
| 18343671 | METHODS AND APPARATUS TO INCREASE PRIVACY FOR FOLLOW-ME SERVICES | Intel Corporation | NOAMAN, BASSAM A | 2497 | — | Final Rejection | — | Pending | Jun 28, 2023 |
| 18215033 | DISTRIBUTED CIRCUIT FOR ELECTROSTATIC DISCHARGE PROTECTION FOR A SIGNAL PAD | Intel Corporation | JACKSON, STEPHEN W | 2838 | §102 | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18331799 | METHODS AND APPARATUS TO SLICE NETWORKS FOR WIRELESS SERVICES | Intel Corporation | HSU, BAILOR CHIA-JONG | 2461 | §112 | Non-Final OA | — | Pending | Jun 08, 2023 |
| 18201656 | OFFSET VOIDING SCHEME FOR VERTICAL INTERCONNECTS | Intel Corporation | MINNEY, GABRIEL SEBASTIAN | 2897 | §103 | Non-Final OA | — | Pending | May 24, 2023 |
| 18201597 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF NEGATIVE CURRENT | Intel Corporation | COMBER, KEVIN J | 2838 | §103 | Non-Final OA | — | Pending | May 24, 2023 |
| 18201592 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT WITH LOW-LEAKAGE FOR LARGE VOLTAGE SWING OF POSITIVE CURRENT | Intel Corporation | COMBER, KEVIN J | 2838 | §103Other | Non-Final OA | — | Pending | May 24, 2023 |
| 18139078 | EXECUTION OF CONTAINER IMAGES IN A TRUSTED EXECUTION ENVIRONMENT | Intel Corporation | COYER, RYAN D | 2191 | §103 | Final Rejection | 33d | AI Ready | Apr 25, 2023 |
| 18136972 | HARDWARE-BASED ACCELERATORS IN CLOUD NATIVE APPLICATIONS WRITTEN IN HIGH LEVEL PROGRAMMING LANGUAGES | Intel Corporation | DASCOMB, JACOB D | 2198 | §103 | Final Rejection | 21d | AI Ready | Apr 20, 2023 |
| 18133353 | OPTICAL FIBER MOUNTS FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT DEVICE PACKAGES | Intel Corporation | KIANNI, KAVEH C | 2874 | §102 | Non-Final OA | — | Pending | Apr 11, 2023 |
| 18296264 | DISPLAY SYNCHRONIZATION FOR TIME SENSITIVE NETWORKING | Intel Corporation | VAUGHN JR, WILLIAM C | 2481 | — | Final Rejection | 83d | Pending | Apr 05, 2023 |
| 18129737 | METHODS OF FORMING DIE STRUCTURES WITH SCALLOPED SIDEWALLS AND STRUCTURES FORMED THEREBY | Intel Corporation | STARK, JARRETT J | 2898 | §103 | Final Rejection | — | Pending | Mar 31, 2023 |
| 18129690 | CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE | Intel Corporation | CHOWDHURY, TARIFUR RASHID | 2877 | §103 | Final Rejection | — | Pending | Mar 31, 2023 |
| 18129617 | MODULATION OF CHIP PERFORMANCE BY CONTROLLING TRANSISTOR GATE PROFILE | Intel Corporation | MENZ, DOUGLAS M | 2893 | §103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18129704 | PLASMA ENHANCED ATOMIC LAYER DEPOSITION OF DIELECTRIC MATERIAL UPON OXIDIZABLE MATERIAL | Intel Corporation | MOVVA, AMAR | 2898 | §103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18116940 | IN-ORDER STREAMING IN-NETWORK COMPUTATION | Intel Corporation | BARRY, LANCE LEONARD | 2443 | §103 | Final Rejection | — | Pending | Mar 03, 2023 |
| 18114120 | PROTECTION AGAINST ELECTROMIGRATION WITHIN A LAYER OF AN INTEGRATED CIRCUIT | Intel Corporation | GARCES, NELSON Y | 2814 | §102§103 | Final Rejection | 28d | AI Ready | Feb 24, 2023 |
| 18109774 | TECHNOLOGIES FOR COORDINATING DISAGGREGATED ACCELERATOR DEVICE RESOURCES | Intel Corporation | CAO, DIEM K | 2196 | §103 | Non-Final OA | — | Pending | Feb 14, 2023 |
| 18090707 | DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING | Intel Corporation | PALANISWAMY, KRISHNA JAYANTHI | 2899 | §103§112 | Final Rejection | — | AI Ready | Dec 29, 2022 |
| 18091270 | IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS | Intel Corporation | AU, BAC H | 2898 | §103 | Final Rejection | 15d | AI Ready | Dec 29, 2022 |
| 18090258 | ELECTRO-OPTICAL CIRCUITS WITH LOW-COST SWITCHABLE PHOTONIC INTERFACE | Intel Corporation | TRAN, HOANG Q | 2874 | §103 | Final Rejection | 20d | AI Ready | Dec 28, 2022 |
| 18090140 | SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES | Intel Corporation | ARMAND, MARC ANTHONY | 2813 | §103 | Final Rejection | — | AI Ready | Dec 28, 2022 |
| 18087517 | UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING | Intel Corporation | LINDSEY, COLE LEON | 2812 | §103 | Final Rejection | 9d overdue | AI Ready | Dec 22, 2022 |
| 18086232 | GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY | Intel Corporation | JOHNSON, CHRISTOPHER A | 2899 | §103 | Final Rejection | — | Pending | Dec 21, 2022 |
| 18084438 | LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES | Intel Corporation | HANUMASAGAR, SHAMITA S | 2814 | §102§103§112 | Final Rejection | 18d overdue | AI Ready | Dec 19, 2022 |
| 18080152 | INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES | Intel Corporation | JORDAN, ANDREW | 2874 | §103 | Final Rejection | 12d | AI Ready | Dec 13, 2022 |
| 17957257 | EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS | Intel Corporation | ANGUIANO, MICHAEL | 2899 | §103§112 | Final Rejection | 5d overdue | AI Ready | Sep 30, 2022 |
| 17957945 | DEVICE, METHOD AND SYSTEM TO PROVIDE A RANDOM ACCESS MEMORY WITH A FERROELECTRIC RESISTIVE JUNCTION | Intel Corporation | LEBOEUF, JEROME LARRY | 2824 | §103 | Final Rejection | — | Pending | Sep 30, 2022 |
| 17957359 | SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES | Intel Corporation | FARMER, EMILY NICOLE | 2812 | §103 | Final Rejection | — | Pending | Sep 30, 2022 |
| 17957969 | DEVICE, METHOD AND SYSTEM TO DETERMINE A MODE OF PROCESSOR OPERATION BASED ON PAGE TABLE METADATA | Intel Corporation | VICARY, KEITH E | 2183 | §112 | Non-Final OA | — | AI Ready | Sep 30, 2022 |
| 17957719 | METHOD AND APPARATUS TO DETECT NETWORK IDLENESS IN A NETWORK DEVICE TO PROVIDE POWER SAVINGS IN A DATA CENTER | Intel Corporation | SAMPATH, GAYATHRI | 2176 | §103 | Non-Final OA | — | AI Ready | Sep 30, 2022 |
| 17957403 | HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES | Intel Corporation | KOLB, THADDEUS J | 2817 | §102§103 | Non-Final OA | 30d | AI Ready | Sep 30, 2022 |
| 17955269 | RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE | Intel Corporation | VU, HUNG K | 2897 | §103 | Final Rejection | 41d | AI Ready | Sep 28, 2022 |
| 17955262 | LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS | Intel Corporation | MELLINGER, CORBYN DAVID | 2899 | §103 | Non-Final OA | — | Pending | Sep 28, 2022 |
| 17955245 | SOLID STATE ELECTROLYTES FOR BACKEND SUPERCAPACITORS | Intel Corporation | MILLER, ALEXANDER MICHAEL | 2898 | §103 | Final Rejection | 7d | AI Ready | Sep 28, 2022 |
| 17955187 | SELF-ALIGNMENT LAYER WITH LOW-K MATERIAL PROXIMATE TO VIAS | Intel Corporation | GREWAL, HEIM KIRIN | 2812 | §103§112 | Non-Final OA | 27d | AI Ready | Sep 28, 2022 |
| 17955235 | LOW TEMPERATURE VARACTORS USING VARIABLE CAPACITANCE MATERIALS | Intel Corporation | CHEN, YU | 2896 | §103§112 | Final Rejection | 44d overdue | AI Ready | Sep 28, 2022 |
| 17903327 | METHOD AND APPARATUS TO SELECT ASSIGNABLE DEVICE INTERFACES FOR VIRTUAL DEVICE COMPOSITION | Intel Corporation | KE, PENG | 2194 | §101§102§103 | Final Rejection | 9d | AI Ready | Sep 06, 2022 |
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | Intel Corporation | KOLB, THADDEUS J | 2817 | §102§103 | Final Rejection | 10d overdue | AI Ready | Aug 19, 2022 |
| 17891727 | INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE DEVICES | Intel Corporation | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Aug 19, 2022 |
| 17891666 | DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES | Intel Corporation | XU, ZHIJUN | 2818 | §103§112 | Final Rejection | 66d overdue | AI Ready | Aug 19, 2022 |
| 17856795 | LAYER SELECTION FOR ROUTING HIGH-SPEED SIGNALS IN SUBSTRATES | Intel Corporation | MULERO FLORES, ERIC MANUEL | 2898 | §103 | Final Rejection | — | Pending | Jul 01, 2022 |
| 17855145 | MULTIPLE COMPOSITION THERMAL INTERFACE MATERIALS FOR MULTI-DIE PACKAGES | Intel Corporation | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | — | AI Ready | Jun 30, 2022 |
| 17829788 | TECHNOLOGIES FOR NETWORK PACKET PROCESSING BETWEEN CLOUD AND TELECOMMUNICATIONS NETWORKS | Intel Corporation | MENSAH, PRINCE AKWASI | 2474 | §103 | Final Rejection | 46d overdue | AI Ready | Jun 01, 2022 |
| 17825350 | INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING RETICLE BOUNDARY / DICING STREETS OF MONOLITHIC STRUCTURES THEREIN | Intel Corporation | PHAM, LONG | 2897 | §102 | Non-Final OA | — | Pending | May 26, 2022 |
| 17825340 | INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING INTEGRATED CIRCUIT DEVICES THEREIN | Intel Corporation | TRAN, TRANG Q | 2811 | §103 | Final Rejection | — | AI Ready | May 26, 2022 |
| 17723216 | COMPRESSION AS A SOLUTION FOR CONGESTION CONTROL ON AI WORKLOADS | Intel Corporation | WONG, WILLIAM | 2144 | §101§103§112 | Final Rejection | — | Pending | Apr 18, 2022 |
| 17711878 | LASER-INDUCED THERMAL STRESSING OF INTEGRATED CIRCUITS | Intel Corporation | LE, THANG XUAN | 2858 | §103 | Non-Final OA | 31d overdue | AI Ready | Apr 01, 2022 |
| 17710658 | CHASSIS CUSTOMIZATION WITH HIGH THROUGHPUT ADDITIVE MANUFACTURED MODIFICATION STRUCTURES | Intel Corporation | MCDONALD, JASON ANDREW | 2898 | §103§112 | Final Rejection | — | AI Ready | Mar 31, 2022 |
| 17677829 | ADDITIVELY MANUFACTURED HEAT DISSIPATION DEVICE | Intel Corporation | AL SAMIRI, KHALED AHMED ALI | 3763 | §103§112 | Final Rejection | — | Pending | Feb 22, 2022 |
| 17561832 | THROUGH-MOLD-INTERCONNECT STRUCTURE ON AN IC DIE DIRECTLY BONDED TO ANOTHER IC DIE | Intel Corporation | FREY, KIMBERLY NEWMAN | 2817 | §103 | Non-Final OA | 41d | Pending | Dec 24, 2021 |
| 17559342 | FORMATION OF CAVITY SPACER AND SOURCE-DRAIN EPITAXIAL GROWTH FOR SCALING OF GATE-ALL-AROUND TRANSISTORS | Intel Corporation | DEGRASSE, IAN ISAAC | 2818 | §103 | Final Rejection | — | Pending | Dec 22, 2021 |
| 17358921 | WAVEGUIDE PHOTODETECTORS FOR SILICON PHOTONIC INTEGRATED CIRCUITS | Intel Corporation | LE, UYEN CHAU N | 2800 | §103§112 | Final Rejection | — | Pending | Jun 25, 2021 |
| 17308853 | METAL OXIDE THIN FILM TRANSISTORS WITH MULTI-COMPOSITION GATE DIELECTRIC | Intel Corporation | OH, JIYOUNG | 2818 | §103 | Final Rejection | 6d | AI Ready | May 05, 2021 |
