16 pending office actions • 1 client
| Client (Assignee) | Pending OAs |
|---|---|
| Tokyo Electron Limited | 16 |
| App # | Title | Client | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|---|
| 18607202 | HARC ETCH CHEMISTRY FOR SEMINCONDUCTORS | Tokyo Electron Limited | LAOBAK, ANDREW KEELAN | 1713 | Non-Final OA | Mar 15, 2024 |
| 18586259 | MIXED ACTIVATING AND REDUCING AGENT FOR BONDING | Tokyo Electron Limited | SANDVIK, BENJAMIN P | 2812 | Non-Final OA | Feb 23, 2024 |
| 18433320 | DIRECT CURRENT SUPERPOSITION (DCS) FOR PROTECTION OF ORGANIC MANDREL DURING SPACER DEPOSITION | Tokyo Electron Limited | PHAM, THOMAS T | 1713 | Non-Final OA | Feb 05, 2024 |
| 18424262 | SELECTIVE ETCHING IN SEMICONDUCTOR DEVICES | Tokyo Electron Limited | AHMED, SHAMIM | 1713 | Non-Final OA | Jan 26, 2024 |
| 18376359 | MULTI-MATERIAL CHUCK | Tokyo Electron Limited | ABEL, GARY ROBERT | 2897 | Non-Final OA | Oct 03, 2023 |
| 18448086 | SEMICONDUCTOR DEVICES WITH VERTICAL TRANSISTORS AND FERROELECTRIC CAPACITORS | Tokyo Electron Limited | WILCZEWSKI, MARY A | 2898 | Non-Final OA | Aug 10, 2023 |
| 18224940 | FORKSHEET SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | Tokyo Electron Limited | SLUTSKER, JULIA | 2891 | Non-Final OA | Jul 21, 2023 |
| 18336678 | 3D HYBRID MEMORY USING HORIZONTALLY ORIENTED CONDUCTIVE DIELECTRIC CHANNEL REGIONS | Tokyo Electron Limited | KIM, TONG-HO | 2811 | Non-Final OA | Jun 16, 2023 |
| 18204081 | NON-PLANAR TRANSISTOR STRUCTURES AND METHODS OF MANUFACTURING THEREOF | Tokyo Electron Limited | GARCES, NELSON Y | 2814 | Non-Final OA | May 31, 2023 |
| 18313177 | SURFACE ENERGY MODIFICATION IN HYBRID BONDING | Tokyo Electron Limited | BERRY, PAUL ANTHONY | 2898 | Non-Final OA | May 05, 2023 |
| 17901783 | METHODS OF COMPACT CELL DESIGN FOR LOGIC APPLICATIONS | Tokyo Electron Limited | ASHBAHIAN, ERIC K | 2891 | Non-Final OA | Sep 01, 2022 |
| 17898104 | METHODS FOR FORMING SEMICONDUCTOR DEVICES WITH ISOLATION STRUCTURES | Tokyo Electron Limited | KIM, SU C | 2899 | Non-Final OA | Aug 29, 2022 |
| 17893736 | METHOD OF MAKING A PLURALITY OF 3D SEMICONDUCTOR DEVICES WITH ENHANCED MOBILITY AND CONDUCTIVITY | Tokyo Electron Limited | BAIG, ANEESA RIAZ | 2814 | Final Rejection | Aug 23, 2022 |
| 17863594 | WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT | Tokyo Electron Limited | STEPHENSON, KENNETH STEPHEN | 2898 | Final Rejection | Jul 13, 2022 |
| 17861021 | METHOD TO ENHANCE 3D VERTICAL DEVICE PERFORMANCE AND 3D CIRCUIT DENSITY | Tokyo Electron Limited | MICHAUD, NICHOLAS BRIAN | 2818 | Non-Final OA | Jul 08, 2022 |
| 17667378 | ADVANCED 3D DEVICE ARCHITECTURE USING NANOSHEETS WITH 2D MATERIALS FOR SPEED ENHANCEMENT | Tokyo Electron Limited | PURVIS, SUE A | 2893 | Final Rejection | Feb 08, 2022 |
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